Длинный Хаохуэй

Dr. Haohui Long [IEEE Senior member，IET Fellow, IES Fellow] received the Ph.D degree from National University of Singapore (NUS), in 2006.,He received his B.S and M.S degrees in Civil engineering, HydroPower&Information engineering from Huazhong University of Science and Technology, China in 1999 and 2002, respectively. From 2002 to 2005, He was research assistant at Dept. of ECE, NUS and A*STAR Data Storage Institute with the sponsorship of A*STAR-DSI scholarship. After graduation at Nov.2005, he served as a failure analysis engineer with the Quality Group of Hitachi Global Storage Technology (formerly IBM storage division) at Singapore. In 2007, he joined Chartered Semiconductor at Singapore (Now, Global Foundries) as a senior Req and FA engineer. He moved to NOKIA in 2008 as failure analysis specialist. After 2011, He joined Huawei device. And he is currently the Huawei Scientist, Chief Reliability Expert, and Head of display design for reliability Dept. He leads a large group of reliability and electronics package/display experts & engineers and take the full leadership and responsibility in the research and development of reliability and HI technologies to guarantee the market success of all Huawei’s mobile terminal products ranging from smartphones, foldable phone, laptops, tablets, Smart watches, IOT, smart screens, and so on. Dr. Long has been a fellow of the Institution of Engineering and Technology (IET) , also the Institution of Engineers (IES), Singapore, since 2022, Senior member of IEEE since 2010, senior member of IMAPS and member of SID and SPIE. He provided his service as IEEE EPS Reliability Technical committee, organization committee member of IEEE IEEE APEMC(2010), the tech committee member of IEEE EPTC, ICEPT , REPP, APEMC, IPFA, SID Beijing Chapter; the TC chair of “Advanced optoelectronics & Displays” tech commmittee of IEEE EPTC, TC chair of "Heterogeneous and Hybrid Integration" of IEEE EDS IFETC (2022) conference,Session Chair of "Heterogeneous Integration Roadmap" HIR workshop at REPP 2022 with publishing arount 40 Journal& international conference papers, and holding around 100 granted and pending US/WO/JP/PCT/CN/EP patents, including 25 US patents in LENS database. Also, he is Huawei Postdoctoral Mentor and guest professor at the institute of technological sciences of Wuhan University. Paper by him and students guided by him have won the Best paper Award in IEEE ICEPT. He served as a Associate Editor for the "Moore and More" Journal, and Guest Editor for Advance in Manufacturing (AIM) Journal Special issues on "Advance package and Reliability" . His current research interests include System in Package (SIP) reliability, Heterogeneous Integration Technology, HiSID(Heterogeneous Integration System in Display), Chip&advance package level reliability, and display module reliability focused on foldable and flexible, MicroLED area; Design for Reliability and Failure Analysis. Dr. LONG Has also made some accomplishments on the standardization, he received distinguished committee service award from IPC for his contributions on testing and qualification of surface amount solder attachment standard IPC -9701A;He was also a recipient of the Huawei Team Gold Medal Award, the Huawei Consumer BG top Ten patent awards, Reliability Outstanding contribution Award, respectively.