Institute of Electrical and Electronics Engineers (IEEE)

IEEE Transactions on Components and Packaging Technologies

, volume 33 , issue 4 , pages 761-766

Development of High-Performance Optical Silicone for the Packaging of High-Power LEDs

Yeong-Her Lin ¹

Jiun Pyng You ¹

Yuan-Chang Lin ¹

Nguyen T. Tran ¹

Frank G. Shi ¹

Hide authors affiliations Show authors affiliations: 1 affiliation

Optoelectronics Packaging and Materials Laboratories, University of California, Irvine, CA, USA |

Publication type: Journal Article

Publication date: 2010-12-01

Institute of Electrical and Electronics Engineers (IEEE)

IEEE Transactions on Components and Packaging Technologies

SJR: —

CiteScore: —

Impact factor: —

ISSN: 15213331, 15579972

DOI: 10.1109/tcapt.2010.2046488

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Electronic, Optical and Magnetic Materials

Electrical and Electronic Engineering

Abstract

Silicone materials with a relatively high-refractive index have been introduced for the encapsulation of high-power light-emitting diodes (LEDs), and LEDs with relatively short wavelengths. However, most of those existing silicone encapsulants still suffer from thermal and radiation induced degradations and thus lead to reliability issues and a shorten lifetime. A new high-performance silicone has been developed and its performance is compared with other commercial silicone and optical grade epoxy in high-power white LEDs. The new materials had been found to suffer less loss in the lumen output during the aging test and high-temperature/high-humidity test, as well as the Joint Electron Devices Engineering Council (JEDEC) reliability test. It is concluded that this material is excellent for the packaging of high-power white LEDs and high-power colored LEDs, because of its ability in maintaining high-transparency and great radiation/thermal resistance.

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GOST |

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GOST Copy

Lin Y. et al. Development of High-Performance Optical Silicone for the Packaging of High-Power LEDs // IEEE Transactions on Components and Packaging Technologies. 2010. Vol. 33. No. 4. pp. 761-766.

GOST all authors (up to 50) Copy

Lin Y., You J. P., Lin Y., Tran N. T., Shi F. G. Development of High-Performance Optical Silicone for the Packaging of High-Power LEDs // IEEE Transactions on Components and Packaging Technologies. 2010. Vol. 33. No. 4. pp. 761-766.

RIS |

Cite this

RIS Copy

TY - JOUR

DO - 10.1109/tcapt.2010.2046488

UR - https://doi.org/10.1109/tcapt.2010.2046488

TI - Development of High-Performance Optical Silicone for the Packaging of High-Power LEDs

T2 - IEEE Transactions on Components and Packaging Technologies

AU - Lin, Yeong-Her

AU - You, Jiun Pyng

AU - Lin, Yuan-Chang

AU - Tran, Nguyen T.

AU - Shi, Frank G.

PY - 2010

DA - 2010/12/01

PB - Institute of Electrical and Electronics Engineers (IEEE)

SP - 761-766

IS - 4

VL - 33

SN - 1521-3331

SN - 1557-9972

ER -

BibTex |

Cite this

BibTex (up to 50 authors) Copy

@article{2010_Lin,

author = {Yeong-Her Lin and Jiun Pyng You and Yuan-Chang Lin and Nguyen T. Tran and Frank G. Shi},

title = {Development of High-Performance Optical Silicone for the Packaging of High-Power LEDs},

journal = {IEEE Transactions on Components and Packaging Technologies},

year = {2010},

volume = {33},

publisher = {Institute of Electrical and Electronics Engineers (IEEE)},

month = {dec},

url = {https://doi.org/10.1109/tcapt.2010.2046488},

number = {4},

pages = {761--766},

doi = {10.1109/tcapt.2010.2046488}

}

MLA

Cite this

MLA Copy

Lin, Yeong-Her, et al. “Development of High-Performance Optical Silicone for the Packaging of High-Power LEDs.” IEEE Transactions on Components and Packaging Technologies, vol. 33, no. 4, Dec. 2010, pp. 761-766. https://doi.org/10.1109/tcapt.2010.2046488.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Journal

IEEE Transactions on Components and Packaging Technologies

SJR

—

CiteScore

—

Impact factor

—

ISSN

15213331 (Print)

15579972 (Electronic)