Journal of Microelectronics and Electronic Packaging

International Microelectronics And Packaging Society
ISSN: 15514897, 15558037

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SCImago
Q4
SJR
0.160
CiteScore
1.3
Categories
Computer Networks and Communications
Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials
Areas
Computer Science
Engineering
Materials Science
Years of issue
2005-2012, 2014-2023
journal names
Journal of Microelectronics and Electronic Packaging
Publications
260
Citations
1 525
h-index
18
Top-3 countries
USA (28 publications)
Germany (7 publications)
Malaysia (6 publications)

Most cited in 5 years

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Citing journals

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Publishing organizations

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Publishing organizations in 5 years

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Publishing countries

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USA, 28, 10.77%
Germany, 7, 2.69%
Malaysia, 6, 2.31%
China, 4, 1.54%
Poland, 4, 1.54%
Austria, 2, 0.77%
Belgium, 2, 0.77%
Ireland, 2, 0.77%
Japan, 2, 0.77%
France, 1, 0.38%
Australia, 1, 0.38%
United Kingdom, 1, 0.38%
India, 1, 0.38%
Jordan, 1, 0.38%
Italy, 1, 0.38%
Canada, 1, 0.38%
Republic of Korea, 1, 0.38%
Singapore, 1, 0.38%
Finland, 1, 0.38%
Switzerland, 1, 0.38%
Sweden, 1, 0.38%
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Publishing countries in 5 years

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USA, 3, 20%
Germany, 1, 6.67%
China, 1, 6.67%
Jordan, 1, 6.67%
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