International Symposium on Microelectronics

IMAPS - International Microelectronics Assembly and Packaging Society
ISSN: 23804505, 10858024

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journal names
International Symposium on Microelectronics
Publications
487
Citations
1 709
h-index
15
Publications
8
Citations
813
Top-3 countries
USA (255 publications)
Germany (64 publications)
Japan (57 publications)

Most cited in 5 years

Found 
Found 

Top-100

Citing journals

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IEEE Transactions on Components, Packaging and Manufacturing Technology
88 citations, 5.15%
International Symposium on Microelectronics
48 citations, 2.81%
Journal of Electronic Packaging, Transactions of the ASME
21 citations, 1.23%
Journal of Electronic Materials
14 citations, 0.82%
Micromachines
13 citations, 0.76%
Journal of Japan Institute of Electronics Packaging
13 citations, 0.76%
IEEE Access
13 citations, 0.76%
Journal of Photopolymer Science and Technology
12 citations, 0.7%
Microelectronics Reliability
10 citations, 0.59%
Journal of the Electrochemical Society
10 citations, 0.59%
Journal of Materials Science: Materials in Electronics
10 citations, 0.59%
Materials
10 citations, 0.59%
IEEE Transactions on Device and Materials Reliability
9 citations, 0.53%
Journal of Alloys and Compounds
8 citations, 0.47%
Scientific Reports
8 citations, 0.47%
IEEE Transactions on Power Electronics
7 citations, 0.41%
Transactions of The Japan Institute of Electronics Packaging
7 citations, 0.41%
ACS applied materials & interfaces
6 citations, 0.35%
Electronics (Switzerland)
6 citations, 0.35%
Springer Series in Advanced Microelectronics
6 citations, 0.35%
Sensors
6 citations, 0.35%
Journal of Microelectromechanical Systems
6 citations, 0.35%
International Journal of Advanced Manufacturing Technology
6 citations, 0.35%
Microelectronics International
5 citations, 0.29%
Materials Science in Semiconductor Processing
5 citations, 0.29%
Microsystem Technologies
5 citations, 0.29%
Additive Manufacturing
5 citations, 0.29%
IEEE Transactions on Microwave Theory and Techniques
5 citations, 0.29%
IEEE Transactions on Electromagnetic Compatibility
5 citations, 0.29%
Flexible and Printed Electronics
5 citations, 0.29%
Journal of Micromechanics and Microengineering
5 citations, 0.29%
IEEE Transactions on Electron Devices
5 citations, 0.29%
Advanced Materials Technologies
4 citations, 0.23%
Materials Science Forum
4 citations, 0.23%
IEEE Journal of Selected Topics in Quantum Electronics
4 citations, 0.23%
Materials Science and Engineering B: Solid-State Materials for Advanced Technology
4 citations, 0.23%
Polymers
4 citations, 0.23%
Applied Surface Science
4 citations, 0.23%
Journal of Microelectronics and Electronic Packaging
4 citations, 0.23%
SID Symposium Digest of Technical Papers
4 citations, 0.23%
SSRN Electronic Journal
4 citations, 0.23%
Applied Physics Letters
3 citations, 0.18%
Aerospace
3 citations, 0.18%
ECS Journal of Solid State Science and Technology
3 citations, 0.18%
Nanomaterials
3 citations, 0.18%
IEEE Transactions on Instrumentation and Measurement
3 citations, 0.18%
IBM Journal of Research and Development
3 citations, 0.18%
Macromolecular Rapid Communications
3 citations, 0.18%
Ceramics International
3 citations, 0.18%
Applied Sciences (Switzerland)
3 citations, 0.18%
Springer Series in Reliability Engineering
3 citations, 0.18%
Microsystems and Nanoengineering
3 citations, 0.18%
Advanced Engineering Materials
3 citations, 0.18%
ACS Sustainable Chemistry and Engineering
3 citations, 0.18%
Materials Today: Proceedings
3 citations, 0.18%
ACS Applied Electronic Materials
3 citations, 0.18%
Journal of Manufacturing and Materials Processing
3 citations, 0.18%
Journal of The Surface Finishing Society of Japan
3 citations, 0.18%
Intelligente Technische Systeme – Lösungen aus dem Spitzencluster it’s OWL
3 citations, 0.18%
Journal of Applied Polymer Science
2 citations, 0.12%
Materials Letters
2 citations, 0.12%
Measurement: Journal of the International Measurement Confederation
2 citations, 0.12%
Advanced Optical Materials
2 citations, 0.12%
Nuclear Instruments and Methods in Physics Research, Section B: Beam Interactions with Materials and Atoms
2 citations, 0.12%
Journal of Physics: Conference Series
2 citations, 0.12%
Journal of Interior Design
2 citations, 0.12%
IEEE Transactions on Biomedical Circuits and Systems
2 citations, 0.12%
IEEE Photonics Technology Letters
2 citations, 0.12%
Advanced Functional Materials
2 citations, 0.12%
Journal of Mechanics
2 citations, 0.12%
ACS Nano
2 citations, 0.12%
Optics Express
2 citations, 0.12%
Materials and Design
2 citations, 0.12%
Journal of Lightwave Technology
2 citations, 0.12%
Multidiscipline Modeling in Materials and Structures
2 citations, 0.12%
Journal of Infrared, Millimeter, and Terahertz Waves
2 citations, 0.12%
Journal of Applied Physics
2 citations, 0.12%
Materials Today Communications
2 citations, 0.12%
Surface and Coatings Technology
2 citations, 0.12%
IEEJ Transactions on Electronics, Information and Systems
2 citations, 0.12%
Circuit World
2 citations, 0.12%
International Journal of Heat and Mass Transfer
2 citations, 0.12%
Electronic Materials Letters
2 citations, 0.12%
IEEJ Transactions on Electrical and Electronic Engineering
2 citations, 0.12%
JOM
2 citations, 0.12%
European Polymer Journal
2 citations, 0.12%
Sustainability
2 citations, 0.12%
Microelectronic Engineering
2 citations, 0.12%
Key Engineering Materials
2 citations, 0.12%
Journal of Manufacturing Processes
2 citations, 0.12%
IEEE Journal of Emerging and Selected Topics in Power Electronics
2 citations, 0.12%
International Journal of Precision Engineering and Manufacturing - Green Technology
2 citations, 0.12%
MRS Communications
2 citations, 0.12%
Proceedings of the IEEE
2 citations, 0.12%
Coatings
2 citations, 0.12%
International Journal of Fatigue
2 citations, 0.12%
ACS Applied Polymer Materials
2 citations, 0.12%
Springer Proceedings in Physics
2 citations, 0.12%
Power Electronic Devices and Components
2 citations, 0.12%
IEEE Transactions on Materials for Electron Devices
2 citations, 0.12%
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Citing publishers

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Institute of Electrical and Electronics Engineers (IEEE)
641 citations, 37.51%
Elsevier
111 citations, 6.5%
Springer Nature
109 citations, 6.38%
MDPI
65 citations, 3.8%
Wiley
63 citations, 3.69%
IMAPS - International Microelectronics Assembly and Packaging Society
48 citations, 2.81%
American Chemical Society (ACS)
23 citations, 1.35%
ASME International
23 citations, 1.35%
Japan Institute of Electronics Packaging
20 citations, 1.17%
IOP Publishing
18 citations, 1.05%
The Electrochemical Society
13 citations, 0.76%
The Technical Association of Photopolymers, Japan
12 citations, 0.7%
Emerald
11 citations, 0.64%
AIP Publishing
7 citations, 0.41%
Taylor & Francis
6 citations, 0.35%
Trans Tech Publications
6 citations, 0.35%
Cambridge University Press
4 citations, 0.23%
Walter de Gruyter
4 citations, 0.23%
International Microelectronics And Packaging Society
4 citations, 0.23%
Social Science Electronic Publishing
4 citations, 0.23%
SAE International
4 citations, 0.23%
Institution of Engineering and Technology (IET)
3 citations, 0.18%
Royal Society of Chemistry (RSC)
3 citations, 0.18%
Association for Computing Machinery (ACM)
3 citations, 0.18%
IBM Corp.
3 citations, 0.18%
Cold Spring Harbor Laboratory
3 citations, 0.18%
Hindawi Limited
3 citations, 0.18%
The Surface Finishing Society of Japan
3 citations, 0.18%
IGI Global
3 citations, 0.18%
Optica Publishing Group
2 citations, 0.12%
IntechOpen
2 citations, 0.12%
Institute of Electronics, Information and Communications Engineers (IEICE)
2 citations, 0.12%
Institute of Electrical Engineers of Japan (IEE Japan)
2 citations, 0.12%
Oxford University Press
1 citation, 0.06%
EDP Sciences
1 citation, 0.06%
Proceedings of the National Academy of Sciences (PNAS)
1 citation, 0.06%
Korean Society of Mechanical Engineers
1 citation, 0.06%
Frontiers Media S.A.
1 citation, 0.06%
American Scientific Publishers
1 citation, 0.06%
Japan Society of Applied Physics
1 citation, 0.06%
Society of Rheology
1 citation, 0.06%
American Physical Society (APS)
1 citation, 0.06%
Open Library of Humanities
1 citation, 0.06%
Tsinghua University Press
1 citation, 0.06%
Korean Institute of Metals and Materials
1 citation, 0.06%
Polish Maintenance Society
1 citation, 0.06%
American Vacuum Society
1 citation, 0.06%
Science in China Press
1 citation, 0.06%
1 citation, 0.06%
Annual Reviews
1 citation, 0.06%
SPIE-Intl Soc Optical Eng
1 citation, 0.06%
Stowarzyszenie Menedzerow Jakosci i Produkcji
1 citation, 0.06%
Japan Welding Society
1 citation, 0.06%
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Publishing organizations

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Fraunhofer Institute for Reliability and Microintegration
18 publications, 3.7%
Technical University of Berlin
14 publications, 2.87%
Interuniversity Microelectronics Centre
12 publications, 2.46%
Georgia Institute of technology
9 publications, 1.85%
Osaka University
9 publications, 1.85%
Auburn University
8 publications, 1.64%
North Carolina State University
7 publications, 1.44%
University of California, Irvine
6 publications, 1.23%
University of Maryland, College Park
6 publications, 1.23%
Grenoble Alpes University
5 publications, 1.03%
Hong Kong University of Science and Technology
5 publications, 1.03%
Infineon Technologies AG
5 publications, 1.03%
Paderborn University
5 publications, 1.03%
Binghamton University
5 publications, 1.03%
University of Milan
4 publications, 0.82%
Michigan State University
4 publications, 0.82%
Samsung
4 publications, 0.82%
Pennsylvania State University
4 publications, 0.82%
San Diego State University
4 publications, 0.82%
University of Waterloo
4 publications, 0.82%
University of Erlangen–Nuremberg
4 publications, 0.82%
Fujitsu Limited
4 publications, 0.82%
Watson Research Center
4 publications, 0.82%
Ghent University
3 publications, 0.62%
Lulea University of Technology
3 publications, 0.62%
National Chung Hsing University
3 publications, 0.62%
North Dakota State University
3 publications, 0.62%
University of California, Berkeley
3 publications, 0.62%
Siliconware Precision Industries
3 publications, 0.62%
Toshiba Corporation
3 publications, 0.62%
University of Texas at El Paso
3 publications, 0.62%
Florida International University
3 publications, 0.62%
Sandia National Laboratories
3 publications, 0.62%
University of Oklahoma
3 publications, 0.62%
University of Arkansas at Fayetteville
3 publications, 0.62%
Massachusetts Institute of Technology
2 publications, 0.41%
University of Ulsan
2 publications, 0.41%
Virginia Tech
2 publications, 0.41%
University of California, Los Angeles
2 publications, 0.41%
Friedrich Schiller University Jena
2 publications, 0.41%
National Institute of Advanced Industrial Science and Technology
2 publications, 0.41%
University of South Florida
2 publications, 0.41%
Leibniz University Hannover
2 publications, 0.41%
Fraunhofer Institute for Ceramic Technologies and Systems
2 publications, 0.41%
Missouri University of Science and Technology
2 publications, 0.41%
Kansas State University
2 publications, 0.41%
Royal Philips
2 publications, 0.41%
University of North Texas
2 publications, 0.41%
Mount Allison University
2 publications, 0.41%
University of Dayton
2 publications, 0.41%
Indian Institute of Science
1 publication, 0.21%
Katholieke Universiteit Leuven
1 publication, 0.21%
Beijing University of Technology
1 publication, 0.21%
Technische Universität Dresden
1 publication, 0.21%
National Sun Yat-sen University
1 publication, 0.21%
Delft University of Technology
1 publication, 0.21%
Polytechnic University of Milan
1 publication, 0.21%
VTT Technical Research Centre of Finland
1 publication, 0.21%
University of Warwick
1 publication, 0.21%
University of Padua
1 publication, 0.21%
National Taiwan University of Science and Technology
1 publication, 0.21%
Loughborough University
1 publication, 0.21%
National Central University
1 publication, 0.21%
National Yang Ming Chiao Tung University
1 publication, 0.21%
Korea University
1 publication, 0.21%
Korea Advanced Institute of Science and Technology
1 publication, 0.21%
Electronics and Telecommunications Research Institute
1 publication, 0.21%
Arizona State University
1 publication, 0.21%
City University of Hong Kong
1 publication, 0.21%
Lawrence Livermore National Laboratory
1 publication, 0.21%
Case Western Reserve University
1 publication, 0.21%
Harvard University
1 publication, 0.21%
Massachusetts General Hospital
1 publication, 0.21%
Vienna University of Technology
1 publication, 0.21%
Andong National University
1 publication, 0.21%
Tohoku University
1 publication, 0.21%
National Technical University of Athens
1 publication, 0.21%
Centre for Research and Technology Hellas
1 publication, 0.21%
Vrije Universiteit Brussel
1 publication, 0.21%
Helmholtz Centre for Materials and Energy
1 publication, 0.21%
Fraunhofer Institute for Silicon Technology
1 publication, 0.21%
Fraunhofer Institute for Applied Optics and Precision Engineering
1 publication, 0.21%
Université de Sherbrooke
1 publication, 0.21%
Fraunhofer Institute for Wind Energy Systems
1 publication, 0.21%
Fraunhofer Institute for Microelectronic Circuits and Systems
1 publication, 0.21%
Fraunhofer Institute for Integrated Circuits
1 publication, 0.21%
Albert Ludwig University of Freiburg
1 publication, 0.21%
University of Duisburg-Essen
1 publication, 0.21%
Siemens AG
1 publication, 0.21%
Clarkson University
1 publication, 0.21%
Physikalisch-Technische Bundesanstalt
1 publication, 0.21%
Purdue University Northwest
1 publication, 0.21%
Purdue University
1 publication, 0.21%
Technical University Ingolstadt of Applied Sciences
1 publication, 0.21%
University of Stuttgart
1 publication, 0.21%
Texas Instruments
1 publication, 0.21%
Waseda University
1 publication, 0.21%
Toyota Motor Corporation
1 publication, 0.21%
Nippon Steel Corporation (Nippon Steel & Sumitomo Metal Corporation)
1 publication, 0.21%
Shibaura Institute of Technology
1 publication, 0.21%
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Publishing countries

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USA, 255, 52.36%
USA
255 publications, 52.36%
Germany, 64, 13.14%
Germany
64 publications, 13.14%
Japan, 57, 11.7%
Japan
57 publications, 11.7%
China, 35, 7.19%
China
35 publications, 7.19%
France, 24, 4.93%
France
24 publications, 4.93%
Republic of Korea, 16, 3.29%
Republic of Korea
16 publications, 3.29%
Belgium, 12, 2.46%
Belgium
12 publications, 2.46%
Canada, 11, 2.26%
Canada
11 publications, 2.26%
United Kingdom, 8, 1.64%
United Kingdom
8 publications, 1.64%
Italy, 8, 1.64%
Italy
8 publications, 1.64%
Austria, 6, 1.23%
Austria
6 publications, 1.23%
Singapore, 5, 1.03%
Singapore
5 publications, 1.03%
Portugal, 3, 0.62%
Portugal
3 publications, 0.62%
Netherlands, 3, 0.62%
Netherlands
3 publications, 0.62%
Sweden, 3, 0.62%
Sweden
3 publications, 0.62%
India, 2, 0.41%
India
2 publications, 0.41%
Norway, 2, 0.41%
Norway
2 publications, 0.41%
Finland, 2, 0.41%
Finland
2 publications, 0.41%
Switzerland, 2, 0.41%
Switzerland
2 publications, 0.41%
Russia, 1, 0.21%
Russia
1 publication, 0.21%
Vietnam, 1, 0.21%
Vietnam
1 publication, 0.21%
Greece, 1, 0.21%
Greece
1 publication, 0.21%
Denmark, 1, 0.21%
Denmark
1 publication, 0.21%
Poland, 1, 0.21%
Poland
1 publication, 0.21%
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