IEEE Transactions on Advanced Packaging

Institute of Electrical and Electronics Engineers (IEEE)

ISSN: 15213323, 15579980

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IEEE Transactions on Advanced Packaging

All time from 2020

Publications

1 213

Citations

24 603

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Top-3 citing journals

IEEE Transactions on Components, Packaging and Manufacturing Technology (1397 citations)

IEEE Transactions on Advanced Packaging (901 citations)

IEEE Transactions on Electromagnetic Compatibility (861 citations)

Top-3 organizations

Georgia Institute of technology (113 publications)

University of Arizona (25 publications)

Korea Advanced Institute of Science and Technology (23 publications)

Top-3 countries

USA (504 publications)

China (165 publications)

Republic of Korea (77 publications)

Most cited in 5 years

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Publications found: 0

	2000 4000 6000 8000 10000 12000
Institute of Electrical and Electronics Engineers (IEEE)	Institute of Electrical and Electronics Engineers (IEEE), 11983, 48.71% Institute of Electrical and Electronics Engineers (IEEE) 11983 citations, 48.71%
Elsevier	Elsevier, 2262, 9.19% Elsevier 2262 citations, 9.19%
Springer Nature	Springer Nature, 1293, 5.26% Springer Nature 1293 citations, 5.26%
Wiley	Wiley, 1062, 4.32% Wiley 1062 citations, 4.32%
MDPI	MDPI, 449, 1.82% MDPI 449 citations, 1.82%
IOP Publishing	IOP Publishing, 436, 1.77% IOP Publishing 436 citations, 1.77%
Optica Publishing Group	Optica Publishing Group, 281, 1.14% Optica Publishing Group 281 citations, 1.14%
Taylor & Francis	Taylor & Francis, 278, 1.13% Taylor & Francis 278 citations, 1.13%
ASME International	ASME International, 269, 1.09% ASME International 269 citations, 1.09%
Institution of Engineering and Technology (IET)	Institution of Engineering and Technology (IET), 232, 0.94% Institution of Engineering and Technology (IET) 232 citations, 0.94%
AIP Publishing	AIP Publishing, 220, 0.89% AIP Publishing 220 citations, 0.89%
Emerald	Emerald, 208, 0.85% Emerald 208 citations, 0.85%
American Chemical Society (ACS)	American Chemical Society (ACS), 175, 0.71% American Chemical Society (ACS) 175 citations, 0.71%
Royal Society of Chemistry (RSC)	Royal Society of Chemistry (RSC), 172, 0.7% Royal Society of Chemistry (RSC) 172 citations, 0.7%
Japan Society of Applied Physics	Japan Society of Applied Physics, 159, 0.65% Japan Society of Applied Physics 159 citations, 0.65%
Trans Tech Publications	Trans Tech Publications, 143, 0.58% Trans Tech Publications 143 citations, 0.58%
SPIE-Intl Soc Optical Eng	SPIE-Intl Soc Optical Eng, 102, 0.41% SPIE-Intl Soc Optical Eng 102 citations, 0.41%
Cambridge University Press	Cambridge University Press, 101, 0.41% Cambridge University Press 101 citations, 0.41%
SAGE	SAGE, 100, 0.41% SAGE 100 citations, 0.41%
The Electrochemical Society	The Electrochemical Society, 90, 0.37% The Electrochemical Society 90 citations, 0.37%
Hindawi Limited	Hindawi Limited, 84, 0.34% Hindawi Limited 84 citations, 0.34%
Electromagnetics Academy	Electromagnetics Academy, 83, 0.34% Electromagnetics Academy 83 citations, 0.34%
Institute of Electronics, Information and Communications Engineers (IEICE)	Institute of Electronics, Information and Communications Engineers (IEICE), 76, 0.31% Institute of Electronics, Information and Communications Engineers (IEICE) 76 citations, 0.31%
Association for Computing Machinery (ACM)	Association for Computing Machinery (ACM), 72, 0.29% Association for Computing Machinery (ACM) 72 citations, 0.29%
Japan Institute of Electronics Packaging	Japan Institute of Electronics Packaging, 49, 0.2% Japan Institute of Electronics Packaging 49 citations, 0.2%
American Vacuum Society	American Vacuum Society, 46, 0.19% American Vacuum Society 46 citations, 0.19%
World Scientific	World Scientific, 42, 0.17% World Scientific 42 citations, 0.17%
Japan Institute of Metals	Japan Institute of Metals, 35, 0.14% Japan Institute of Metals 35 citations, 0.14%
Walter de Gruyter	Walter de Gruyter, 30, 0.12% Walter de Gruyter 30 citations, 0.12%
	, 24, 0.1% 24 citations, 0.1%
	, 20, 0.08% 20 citations, 0.08%
American Physical Society (APS)	American Physical Society (APS), 18, 0.07% American Physical Society (APS) 18 citations, 0.07%
EDP Sciences	EDP Sciences, 17, 0.07% EDP Sciences 17 citations, 0.07%
SAE International	SAE International, 17, 0.07% SAE International 17 citations, 0.07%
Institute of Electrical Engineers of Japan (IEE Japan)	Institute of Electrical Engineers of Japan (IEE Japan), 16, 0.07% Institute of Electrical Engineers of Japan (IEE Japan) 16 citations, 0.07%
American Institute of Aeronautics and Astronautics (AIAA)	American Institute of Aeronautics and Astronautics (AIAA), 14, 0.06% American Institute of Aeronautics and Astronautics (AIAA) 14 citations, 0.06%
IGI Global	IGI Global, 14, 0.06% IGI Global 14 citations, 0.06%
Pleiades Publishing	Pleiades Publishing, 13, 0.05% Pleiades Publishing 13 citations, 0.05%
Korean Society of Mechanical Engineers	Korean Society of Mechanical Engineers, 13, 0.05% Korean Society of Mechanical Engineers 13 citations, 0.05%
China Science Publishing & Media	China Science Publishing & Media, 13, 0.05% China Science Publishing & Media 13 citations, 0.05%
International Microelectronics And Packaging Society	International Microelectronics And Packaging Society, 12, 0.05% International Microelectronics And Packaging Society 12 citations, 0.05%
Korean Institute of Metals and Materials	Korean Institute of Metals and Materials, 11, 0.04% Korean Institute of Metals and Materials 11 citations, 0.04%
Society for Industrial and Applied Mathematics (SIAM)	Society for Industrial and Applied Mathematics (SIAM), 10, 0.04% Society for Industrial and Applied Mathematics (SIAM) 10 citations, 0.04%
IMAPS - International Microelectronics Assembly and Packaging Society	IMAPS - International Microelectronics Assembly and Packaging Society, 10, 0.04% IMAPS - International Microelectronics Assembly and Packaging Society 10 citations, 0.04%
American Association for the Advancement of Science (AAAS)	American Association for the Advancement of Science (AAAS), 9, 0.04% American Association for the Advancement of Science (AAAS) 9 citations, 0.04%
American Society of Civil Engineers (ASCE)	American Society of Civil Engineers (ASCE), 9, 0.04% American Society of Civil Engineers (ASCE) 9 citations, 0.04%
Public Library of Science (PLoS)	Public Library of Science (PLoS), 8, 0.03% Public Library of Science (PLoS) 8 citations, 0.03%
Science in China Press	Science in China Press, 8, 0.03% Science in China Press 8 citations, 0.03%
Annual Reviews	Annual Reviews, 8, 0.03% Annual Reviews 8 citations, 0.03%
ASM International	ASM International, 7, 0.03% ASM International 7 citations, 0.03%
Frontiers Media S.A.	Frontiers Media S.A., 6, 0.02% Frontiers Media S.A. 6 citations, 0.02%
American Institute of Mathematical Sciences (AIMS)	American Institute of Mathematical Sciences (AIMS), 6, 0.02% American Institute of Mathematical Sciences (AIMS) 6 citations, 0.02%
midwest symposium on circuits and systems	midwest symposium on circuits and systems, 6, 0.02% midwest symposium on circuits and systems 6 citations, 0.02%
CSIRO Publishing	CSIRO Publishing, 6, 0.02% CSIRO Publishing 6 citations, 0.02%
Biophysical Society	Biophysical Society, 5, 0.02% Biophysical Society 5 citations, 0.02%
The Institute of Electronics Engineers of Korea	The Institute of Electronics Engineers of Korea, 5, 0.02% The Institute of Electronics Engineers of Korea 5 citations, 0.02%
Acta Physica Sinica, Chinese Physical Society and Institute of Physics, Chinese Academy of Sciences	Acta Physica Sinica, Chinese Physical Society and Institute of Physics, Chinese Academy of Sciences, 5, 0.02% Acta Physica Sinica, Chinese Physical Society and Institute of Physics, Chinese Academy of Sciences 5 citations, 0.02%
Polymer Society of Korea	Polymer Society of Korea, 5, 0.02% Polymer Society of Korea 5 citations, 0.02%
IntechOpen	IntechOpen, 5, 0.02% IntechOpen 5 citations, 0.02%
The Royal Society	The Royal Society, 4, 0.02% The Royal Society 4 citations, 0.02%
Laser Institute of America	Laser Institute of America, 4, 0.02% Laser Institute of America 4 citations, 0.02%
ifmbe proceedings	ifmbe proceedings, 4, 0.02% ifmbe proceedings 4 citations, 0.02%
Beijing University of Posts and Telecommunications	Beijing University of Posts and Telecommunications, 4, 0.02% Beijing University of Posts and Telecommunications 4 citations, 0.02%
Korean Institute of Electrical Engineers	Korean Institute of Electrical Engineers, 4, 0.02% Korean Institute of Electrical Engineers 4 citations, 0.02%
The Korean Society of Precision Engineering	The Korean Society of Precision Engineering, 4, 0.02% The Korean Society of Precision Engineering 4 citations, 0.02%
The Korean Institute of Electrical and Electronic Material Engineers	The Korean Institute of Electrical and Electronic Material Engineers, 4, 0.02% The Korean Institute of Electrical and Electronic Material Engineers 4 citations, 0.02%
The Korean Fiber Society	The Korean Fiber Society, 4, 0.02% The Korean Fiber Society 4 citations, 0.02%
Scientific Research Publishing	Scientific Research Publishing, 4, 0.02% Scientific Research Publishing 4 citations, 0.02%
Bentham Science Publishers Ltd.	Bentham Science Publishers Ltd., 3, 0.01% Bentham Science Publishers Ltd. 3 citations, 0.01%
Proceedings of the National Academy of Sciences (PNAS)	Proceedings of the National Academy of Sciences (PNAS), 3, 0.01% Proceedings of the National Academy of Sciences (PNAS) 3 citations, 0.01%
Japan Society of Mechanical Engineers	Japan Society of Mechanical Engineers, 3, 0.01% Japan Society of Mechanical Engineers 3 citations, 0.01%
Acoustical Society of America (ASA)	Acoustical Society of America (ASA), 3, 0.01% Acoustical Society of America (ASA) 3 citations, 0.01%
Nonferrous Metals Society of China	Nonferrous Metals Society of China, 3, 0.01% Nonferrous Metals Society of China 3 citations, 0.01%
Korea Soc of Automotive Engineers, Inc	Korea Soc of Automotive Engineers, Inc, 3, 0.01% Korea Soc of Automotive Engineers, Inc 3 citations, 0.01%
	, 3, 0.01% 3 citations, 0.01%
Assoc Nonwoven Fabrics Ind	Assoc Nonwoven Fabrics Ind, 3, 0.01% Assoc Nonwoven Fabrics Ind 3 citations, 0.01%
The Surface Finishing Society of Japan	The Surface Finishing Society of Japan, 3, 0.01% The Surface Finishing Society of Japan 3 citations, 0.01%
International Academy Publishing (IAP)	International Academy Publishing (IAP), 3, 0.01% International Academy Publishing (IAP) 3 citations, 0.01%
The Magnetics Society of Japan	The Magnetics Society of Japan, 3, 0.01% The Magnetics Society of Japan 3 citations, 0.01%
Korea Institute of Information and Communication Engineering	Korea Institute of Information and Communication Engineering, 3, 0.01% Korea Institute of Information and Communication Engineering 3 citations, 0.01%
Japan Welding Society	Japan Welding Society, 3, 0.01% Japan Welding Society 3 citations, 0.01%
Oxford University Press	Oxford University Press, 2, 0.01% Oxford University Press 2 citations, 0.01%
IOS Press	IOS Press, 2, 0.01% IOS Press 2 citations, 0.01%
King Saud University	King Saud University, 2, 0.01% King Saud University 2 citations, 0.01%
Morgan & Claypool Publishers	Morgan & Claypool Publishers, 2, 0.01% Morgan & Claypool Publishers 2 citations, 0.01%
American Scientific Publishers	American Scientific Publishers, 2, 0.01% American Scientific Publishers 2 citations, 0.01%
	, 2, 0.01% 2 citations, 0.01%
British Institute of Non-Destructive Testing	British Institute of Non-Destructive Testing, 2, 0.01% British Institute of Non-Destructive Testing 2 citations, 0.01%
The Korean Society for Aeronautical & Space Sciences	The Korean Society for Aeronautical & Space Sciences, 2, 0.01% The Korean Society for Aeronautical & Space Sciences 2 citations, 0.01%
Chinese Ceramic Society	Chinese Ceramic Society, 2, 0.01% Chinese Ceramic Society 2 citations, 0.01%
Copernicus	Copernicus, 2, 0.01% Copernicus 2 citations, 0.01%
Materials Research Society of Korea	Materials Research Society of Korea, 2, 0.01% Materials Research Society of Korea 2 citations, 0.01%
Ain Shams University	Ain Shams University, 2, 0.01% Ain Shams University 2 citations, 0.01%
Korean Chemical Society	Korean Chemical Society, 2, 0.01% Korean Chemical Society 2 citations, 0.01%
Thomas Telford	Thomas Telford, 2, 0.01% Thomas Telford 2 citations, 0.01%
Social Science Electronic Publishing	Social Science Electronic Publishing, 2, 0.01% Social Science Electronic Publishing 2 citations, 0.01%
ASTM International	ASTM International, 2, 0.01% ASTM International 2 citations, 0.01%
Hans Publishers	Hans Publishers, 2, 0.01% Hans Publishers 2 citations, 0.01%
Ovid Technologies (Wolters Kluwer Health)	Ovid Technologies (Wolters Kluwer Health), 1, 0% Ovid Technologies (Wolters Kluwer Health) 1 citation, 0%
Begell House	Begell House, 1, 0% Begell House 1 citation, 0%
Show all (70 more)
	2000 4000 6000 8000 10000 12000

	20 40 60 80 100 120
Georgia Institute of technology	Georgia Institute of technology, 113, 9.32% Georgia Institute of technology 113 publications, 9.32%
University of Arizona	University of Arizona, 25, 2.06% University of Arizona 25 publications, 2.06%
Korea Advanced Institute of Science and Technology	Korea Advanced Institute of Science and Technology, 23, 1.9% Korea Advanced Institute of Science and Technology 23 publications, 1.9%
Carleton University	Carleton University, 22, 1.81% Carleton University 22 publications, 1.81%
National Taiwan University	National Taiwan University, 21, 1.73% National Taiwan University 21 publications, 1.73%
Samsung	Samsung, 20, 1.65% Samsung 20 publications, 1.65%
National University of Singapore	National University of Singapore, 18, 1.48% National University of Singapore 18 publications, 1.48%
National Tsing Hua University	National Tsing Hua University, 18, 1.48% National Tsing Hua University 18 publications, 1.48%
City University of Hong Kong	City University of Hong Kong, 18, 1.48% City University of Hong Kong 18 publications, 1.48%
University of Illinois Urbana-Champaign	University of Illinois Urbana-Champaign, 18, 1.48% University of Illinois Urbana-Champaign 18 publications, 1.48%
University of Maryland, College Park	University of Maryland, College Park, 18, 1.48% University of Maryland, College Park 18 publications, 1.48%
Polytechnic University of Turin	Polytechnic University of Turin, 16, 1.32% Polytechnic University of Turin 16 publications, 1.32%
Nanyang Technological University	Nanyang Technological University, 16, 1.32% Nanyang Technological University 16 publications, 1.32%
National Cheng Kung University	National Cheng Kung University, 15, 1.24% National Cheng Kung University 15 publications, 1.24%
Interuniversity Microelectronics Centre	Interuniversity Microelectronics Centre, 14, 1.15% Interuniversity Microelectronics Centre 14 publications, 1.15%
University of Washington	University of Washington, 14, 1.15% University of Washington 14 publications, 1.15%
Agency for Science, Technology and Research	Agency for Science, Technology and Research, 14, 1.15% Agency for Science, Technology and Research 14 publications, 1.15%
Purdue University	Purdue University, 14, 1.15% Purdue University 14 publications, 1.15%
National Sun Yat-sen University	National Sun Yat-sen University, 13, 1.07% National Sun Yat-sen University 13 publications, 1.07%
University of California, Irvine	University of California, Irvine, 13, 1.07% University of California, Irvine 13 publications, 1.07%
Ghent University	Ghent University, 12, 0.99% Ghent University 12 publications, 0.99%
University of Tokyo	University of Tokyo, 11, 0.91% University of Tokyo 11 publications, 0.91%
University of Colorado Boulder	University of Colorado Boulder, 11, 0.91% University of Colorado Boulder 11 publications, 0.91%
Toshiba Corporation	Toshiba Corporation, 10, 0.82% Toshiba Corporation 10 publications, 0.82%
North Carolina State University	North Carolina State University, 9, 0.74% North Carolina State University 9 publications, 0.74%
Taiwan Semiconductor Manufacturing Company	Taiwan Semiconductor Manufacturing Company, 9, 0.74% Taiwan Semiconductor Manufacturing Company 9 publications, 0.74%
Missouri University of Science and Technology	Missouri University of Science and Technology, 9, 0.74% Missouri University of Science and Technology 9 publications, 0.74%
Shanghai Jiao Tong University	Shanghai Jiao Tong University, 8, 0.66% Shanghai Jiao Tong University 8 publications, 0.66%
University of L'Aquila	University of L'Aquila, 8, 0.66% University of L'Aquila 8 publications, 0.66%
Pennsylvania State University	Pennsylvania State University, 8, 0.66% Pennsylvania State University 8 publications, 0.66%
Hanyang University	Hanyang University, 8, 0.66% Hanyang University 8 publications, 0.66%
Virginia Tech	Virginia Tech, 8, 0.66% Virginia Tech 8 publications, 0.66%
University of Michigan	University of Michigan, 8, 0.66% University of Michigan 8 publications, 0.66%
Fraunhofer Institute for Reliability and Microintegration	Fraunhofer Institute for Reliability and Microintegration, 8, 0.66% Fraunhofer Institute for Reliability and Microintegration 8 publications, 0.66%
ETH Zurich	ETH Zurich, 7, 0.58% ETH Zurich 7 publications, 0.58%
Cornell University	Cornell University, 7, 0.58% Cornell University 7 publications, 0.58%
National Yang Ming Chiao Tung University	National Yang Ming Chiao Tung University, 7, 0.58% National Yang Ming Chiao Tung University 7 publications, 0.58%
Stanford University	Stanford University, 7, 0.58% Stanford University 7 publications, 0.58%
Hong Kong University of Science and Technology	Hong Kong University of Science and Technology, 7, 0.58% Hong Kong University of Science and Technology 7 publications, 0.58%
University of Waterloo	University of Waterloo, 7, 0.58% University of Waterloo 7 publications, 0.58%
Industrial Technology Research Institute	Industrial Technology Research Institute, 7, 0.58% Industrial Technology Research Institute 7 publications, 0.58%
Nippon Electric Company	Nippon Electric Company, 7, 0.58% Nippon Electric Company 7 publications, 0.58%
Linköping University	Linköping University, 6, 0.49% Linköping University 6 publications, 0.49%
Electronics and Telecommunications Research Institute	Electronics and Telecommunications Research Institute, 6, 0.49% Electronics and Telecommunications Research Institute 6 publications, 0.49%
University at Buffalo, State University of New York	University at Buffalo, State University of New York, 6, 0.49% University at Buffalo, State University of New York 6 publications, 0.49%
Western University	Western University, 6, 0.49% Western University 6 publications, 0.49%
Katholieke Universiteit Leuven	Katholieke Universiteit Leuven, 5, 0.41% Katholieke Universiteit Leuven 5 publications, 0.41%
Massachusetts Institute of Technology	Massachusetts Institute of Technology, 5, 0.41% Massachusetts Institute of Technology 5 publications, 0.41%
National Chung Cheng University	National Chung Cheng University, 5, 0.41% National Chung Cheng University 5 publications, 0.41%
Seoul National University	Seoul National University, 5, 0.41% Seoul National University 5 publications, 0.41%
University of California, Berkeley	University of California, Berkeley, 5, 0.41% University of California, Berkeley 5 publications, 0.41%
National Institute of Advanced Industrial Science and Technology	National Institute of Advanced Industrial Science and Technology, 5, 0.41% National Institute of Advanced Industrial Science and Technology 5 publications, 0.41%
McGill University	McGill University, 5, 0.41% McGill University 5 publications, 0.41%
Infineon Technologies AG	Infineon Technologies AG, 5, 0.41% Infineon Technologies AG 5 publications, 0.41%
University of Toronto	University of Toronto, 5, 0.41% University of Toronto 5 publications, 0.41%
University of Ottawa	University of Ottawa, 5, 0.41% University of Ottawa 5 publications, 0.41%
Huazhong University of Science and Technology	Huazhong University of Science and Technology, 4, 0.33% Huazhong University of Science and Technology 4 publications, 0.33%
University of Electronic Science and Technology of China	University of Electronic Science and Technology of China, 4, 0.33% University of Electronic Science and Technology of China 4 publications, 0.33%
Chalmers University of Technology	Chalmers University of Technology, 4, 0.33% Chalmers University of Technology 4 publications, 0.33%
KTH Royal Institute of Technology	KTH Royal Institute of Technology, 4, 0.33% KTH Royal Institute of Technology 4 publications, 0.33%
Tampere University	Tampere University, 4, 0.33% Tampere University 4 publications, 0.33%
University of Oulu	University of Oulu, 4, 0.33% University of Oulu 4 publications, 0.33%
Chung Yuan Christian University	Chung Yuan Christian University, 4, 0.33% Chung Yuan Christian University 4 publications, 0.33%
Feng Chia University	Feng Chia University, 4, 0.33% Feng Chia University 4 publications, 0.33%
University of Sydney	University of Sydney, 4, 0.33% University of Sydney 4 publications, 0.33%
Arizona State University	Arizona State University, 4, 0.33% Arizona State University 4 publications, 0.33%
National Institute of Standards and Technology	National Institute of Standards and Technology, 4, 0.33% National Institute of Standards and Technology 4 publications, 0.33%
University of California, Los Angeles	University of California, Los Angeles, 4, 0.33% University of California, Los Angeles 4 publications, 0.33%
McMaster University	McMaster University, 4, 0.33% McMaster University 4 publications, 0.33%
Fujitsu Limited	Fujitsu Limited, 4, 0.33% Fujitsu Limited 4 publications, 0.33%
University of Florida	University of Florida, 4, 0.33% University of Florida 4 publications, 0.33%
Tsinghua University	Tsinghua University, 3, 0.25% Tsinghua University 3 publications, 0.25%
Chang Gung University	Chang Gung University, 3, 0.25% Chang Gung University 3 publications, 0.25%
Kun Shan University	Kun Shan University, 3, 0.25% Kun Shan University 3 publications, 0.25%
National Kaohsiung University of Science and Technology	National Kaohsiung University of Science and Technology, 3, 0.25% National Kaohsiung University of Science and Technology 3 publications, 0.25%
California Institute of Technology	California Institute of Technology, 3, 0.25% California Institute of Technology 3 publications, 0.25%
Yonsei University	Yonsei University, 3, 0.25% Yonsei University 3 publications, 0.25%
Korea University	Korea University, 3, 0.25% Korea University 3 publications, 0.25%
Pohang University of Science and Technology	Pohang University of Science and Technology, 3, 0.25% Pohang University of Science and Technology 3 publications, 0.25%
Clemson University	Clemson University, 3, 0.25% Clemson University 3 publications, 0.25%
Gwangju Institute of Science and Technology	Gwangju Institute of Science and Technology, 3, 0.25% Gwangju Institute of Science and Technology 3 publications, 0.25%
University of Hong Kong	University of Hong Kong, 3, 0.25% University of Hong Kong 3 publications, 0.25%
Duke University	Duke University, 3, 0.25% Duke University 3 publications, 0.25%
Kwangwoon University	Kwangwoon University, 3, 0.25% Kwangwoon University 3 publications, 0.25%
New York University	New York University, 3, 0.25% New York University 3 publications, 0.25%
Technical University of Berlin	Technical University of Berlin, 3, 0.25% Technical University of Berlin 3 publications, 0.25%
Leibniz University Hannover	Leibniz University Hannover, 3, 0.25% Leibniz University Hannover 3 publications, 0.25%
Jet Propulsion Laboratory	Jet Propulsion Laboratory, 3, 0.25% Jet Propulsion Laboratory 3 publications, 0.25%
University of Minnesota	University of Minnesota, 3, 0.25% University of Minnesota 3 publications, 0.25%
Texas Instruments	Texas Instruments, 3, 0.25% Texas Instruments 3 publications, 0.25%
Sony Group Corporation	Sony Group Corporation, 3, 0.25% Sony Group Corporation 3 publications, 0.25%
Binghamton University	Binghamton University, 3, 0.25% Binghamton University 3 publications, 0.25%
University College Cork (National University of Ireland, Cork)	University College Cork (National University of Ireland, Cork), 3, 0.25% University College Cork (National University of Ireland, Cork) 3 publications, 0.25%
Harbin Institute of Technology	Harbin Institute of Technology, 2, 0.16% Harbin Institute of Technology 2 publications, 0.16%
Dalian University of Technology	Dalian University of Technology, 2, 0.16% Dalian University of Technology 2 publications, 0.16%
Mid Sweden University	Mid Sweden University, 2, 0.16% Mid Sweden University 2 publications, 0.16%
Aalto University	Aalto University, 2, 0.16% Aalto University 2 publications, 0.16%
University of Naples Federico II	University of Naples Federico II, 2, 0.16% University of Naples Federico II 2 publications, 0.16%
University of Science and Technology Beijing	University of Science and Technology Beijing, 2, 0.16% University of Science and Technology Beijing 2 publications, 0.16%
VTT Technical Research Centre of Finland	VTT Technical Research Centre of Finland, 2, 0.16% VTT Technical Research Centre of Finland 2 publications, 0.16%
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	100 200 300 400 500 600
USA	USA, 504, 41.55% USA 504 publications, 41.55%
China	China, 165, 13.6% China 165 publications, 13.6%
Republic of Korea	Republic of Korea, 77, 6.35% Republic of Korea 77 publications, 6.35%
Japan	Japan, 70, 5.77% Japan 70 publications, 5.77%
Singapore	Singapore, 64, 5.28% Singapore 64 publications, 5.28%
Canada	Canada, 53, 4.37% Canada 53 publications, 4.37%
Germany	Germany, 42, 3.46% Germany 42 publications, 3.46%
Italy	Italy, 34, 2.8% Italy 34 publications, 2.8%
Belgium	Belgium, 25, 2.06% Belgium 25 publications, 2.06%
Sweden	Sweden, 17, 1.4% Sweden 17 publications, 1.4%
Finland	Finland, 14, 1.15% Finland 14 publications, 1.15%
Switzerland	Switzerland, 14, 1.15% Switzerland 14 publications, 1.15%
France	France, 11, 0.91% France 11 publications, 0.91%
United Kingdom	United Kingdom, 11, 0.91% United Kingdom 11 publications, 0.91%
Ireland	Ireland, 9, 0.74% Ireland 9 publications, 0.74%
Spain	Spain, 8, 0.66% Spain 8 publications, 0.66%
Netherlands	Netherlands, 7, 0.58% Netherlands 7 publications, 0.58%
Australia	Australia, 5, 0.41% Australia 5 publications, 0.41%
Norway	Norway, 5, 0.41% Norway 5 publications, 0.41%
Israel	Israel, 4, 0.33% Israel 4 publications, 0.33%
Bulgaria	Bulgaria, 2, 0.16% Bulgaria 2 publications, 0.16%
Malaysia	Malaysia, 2, 0.16% Malaysia 2 publications, 0.16%
Russia	Russia, 1, 0.08% Russia 1 publication, 0.08%
Portugal	Portugal, 1, 0.08% Portugal 1 publication, 0.08%
Austria	Austria, 1, 0.08% Austria 1 publication, 0.08%
Vietnam	Vietnam, 1, 0.08% Vietnam 1 publication, 0.08%
Greece	Greece, 1, 0.08% Greece 1 publication, 0.08%
India	India, 1, 0.08% India 1 publication, 0.08%
Mexico	Mexico, 1, 0.08% Mexico 1 publication, 0.08%
Poland	Poland, 1, 0.08% Poland 1 publication, 0.08%
Saudi Arabia	Saudi Arabia, 1, 0.08% Saudi Arabia 1 publication, 0.08%
Thailand	Thailand, 1, 0.08% Thailand 1 publication, 0.08%
Turkey	Turkey, 1, 0.08% Turkey 1 publication, 0.08%
Show all (3 more)
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IEEE Transactions on Advanced Packaging

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Oppermann Hermann

	200 400 600 800 1000 1200 1400
IEEE Transactions on Components, Packaging and Manufacturing Technology	IEEE Transactions on Components, Packaging and Manufacturing Technology, 1397, 5.68% IEEE Transactions on Components, Packaging and Manufacturing Technology 1397 citations, 5.68%
IEEE Transactions on Advanced Packaging	IEEE Transactions on Advanced Packaging, 901, 3.66% IEEE Transactions on Advanced Packaging 901 citations, 3.66%
IEEE Transactions on Electromagnetic Compatibility	IEEE Transactions on Electromagnetic Compatibility, 861, 3.5% IEEE Transactions on Electromagnetic Compatibility 861 citations, 3.5%
IEEE Transactions on Microwave Theory and Techniques	IEEE Transactions on Microwave Theory and Techniques, 711, 2.89% IEEE Transactions on Microwave Theory and Techniques 711 citations, 2.89%
Microelectronics Reliability	Microelectronics Reliability, 436, 1.77% Microelectronics Reliability 436 citations, 1.77%
IEEE Transactions on Antennas and Propagation	IEEE Transactions on Antennas and Propagation, 224, 0.91% IEEE Transactions on Antennas and Propagation 224 citations, 0.91%
Journal of Electronic Packaging, Transactions of the ASME	Journal of Electronic Packaging, Transactions of the ASME, 195, 0.79% Journal of Electronic Packaging, Transactions of the ASME 195 citations, 0.79%
Journal of Micromechanics and Microengineering	Journal of Micromechanics and Microengineering, 190, 0.77% Journal of Micromechanics and Microengineering 190 citations, 0.77%
IEEE Transactions on Components and Packaging Technologies	IEEE Transactions on Components and Packaging Technologies, 179, 0.73% IEEE Transactions on Components and Packaging Technologies 179 citations, 0.73%
Journal of Electronic Materials	Journal of Electronic Materials, 177, 0.72% Journal of Electronic Materials 177 citations, 0.72%
Microwave and Optical Technology Letters	Microwave and Optical Technology Letters, 167, 0.68% Microwave and Optical Technology Letters 167 citations, 0.68%
Journal of Lightwave Technology	Journal of Lightwave Technology, 158, 0.64% Journal of Lightwave Technology 158 citations, 0.64%
Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes	Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes, 154, 0.63% Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes 154 citations, 0.63%
Journal of Microelectromechanical Systems	Journal of Microelectromechanical Systems, 153, 0.62% Journal of Microelectromechanical Systems 153 citations, 0.62%
IEEE Access	IEEE Access, 152, 0.62% IEEE Access 152 citations, 0.62%
Journal of Materials Science: Materials in Electronics	Journal of Materials Science: Materials in Electronics, 149, 0.61% Journal of Materials Science: Materials in Electronics 149 citations, 0.61%
IEEE Microwave and Wireless Components Letters	IEEE Microwave and Wireless Components Letters, 140, 0.57% IEEE Microwave and Wireless Components Letters 140 citations, 0.57%
IEEE Transactions on Power Electronics	IEEE Transactions on Power Electronics, 130, 0.53% IEEE Transactions on Power Electronics 130 citations, 0.53%
Microelectronic Engineering	Microelectronic Engineering, 127, 0.52% Microelectronic Engineering 127 citations, 0.52%
IEEE Transactions on Very Large Scale Integration (VLSI) Systems	IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 118, 0.48% IEEE Transactions on Very Large Scale Integration (VLSI) Systems 118 citations, 0.48%
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems	IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 115, 0.47% IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems 115 citations, 0.47%
IEEE Transactions on Electron Devices	IEEE Transactions on Electron Devices, 96, 0.39% IEEE Transactions on Electron Devices 96 citations, 0.39%
IEEE Transactions on Device and Materials Reliability	IEEE Transactions on Device and Materials Reliability, 93, 0.38% IEEE Transactions on Device and Materials Reliability 93 citations, 0.38%
Sensors and Actuators, A: Physical	Sensors and Actuators, A: Physical, 90, 0.37% Sensors and Actuators, A: Physical 90 citations, 0.37%
Micromachines	Micromachines, 87, 0.35% Micromachines 87 citations, 0.35%
International Journal of Numerical Modelling: Electronic Networks, Devices and Fields	International Journal of Numerical Modelling: Electronic Networks, Devices and Fields, 86, 0.35% International Journal of Numerical Modelling: Electronic Networks, Devices and Fields 86 citations, 0.35%
Sensors	Sensors, 84, 0.34% Sensors 84 citations, 0.34%
Soldering and Surface Mount Technology	Soldering and Surface Mount Technology, 83, 0.34% Soldering and Surface Mount Technology 83 citations, 0.34%
Optics Express	Optics Express, 82, 0.33% Optics Express 82 citations, 0.33%
IEEE Transactions on Power Delivery	IEEE Transactions on Power Delivery, 81, 0.33% IEEE Transactions on Power Delivery 81 citations, 0.33%
IEEE Transactions on Circuits and Systems I: Regular Papers	IEEE Transactions on Circuits and Systems I: Regular Papers, 80, 0.33% IEEE Transactions on Circuits and Systems I: Regular Papers 80 citations, 0.33%
Microsystem Technologies	Microsystem Technologies, 79, 0.32% Microsystem Technologies 79 citations, 0.32%
Electronics Letters	Electronics Letters, 74, 0.3% Electronics Letters 74 citations, 0.3%
IEEE Antennas and Wireless Propagation Letters	IEEE Antennas and Wireless Propagation Letters, 74, 0.3% IEEE Antennas and Wireless Propagation Letters 74 citations, 0.3%
IEEE Journal of Solid-State Circuits	IEEE Journal of Solid-State Circuits, 73, 0.3% IEEE Journal of Solid-State Circuits 73 citations, 0.3%
International Journal of RF and Microwave Computer-Aided Engineering	International Journal of RF and Microwave Computer-Aided Engineering, 71, 0.29% International Journal of RF and Microwave Computer-Aided Engineering 71 citations, 0.29%
IEEE Journal of Selected Topics in Quantum Electronics	IEEE Journal of Selected Topics in Quantum Electronics, 67, 0.27% IEEE Journal of Selected Topics in Quantum Electronics 67 citations, 0.27%
Applied Physics Letters	Applied Physics Letters, 66, 0.27% Applied Physics Letters 66 citations, 0.27%
IEEE Photonics Technology Letters	IEEE Photonics Technology Letters, 65, 0.26% IEEE Photonics Technology Letters 65 citations, 0.26%
Electronics (Switzerland)	Electronics (Switzerland), 64, 0.26% Electronics (Switzerland) 64 citations, 0.26%
Microelectronics Journal	Microelectronics Journal, 62, 0.25% Microelectronics Journal 62 citations, 0.25%
Advanced Materials Research	Advanced Materials Research, 61, 0.25% Advanced Materials Research 61 citations, 0.25%
Journal of Applied Physics	Journal of Applied Physics, 60, 0.24% Journal of Applied Physics 60 citations, 0.24%
Journal of the Electrochemical Society	Journal of the Electrochemical Society, 57, 0.23% Journal of the Electrochemical Society 57 citations, 0.23%
Journal of Alloys and Compounds	Journal of Alloys and Compounds, 55, 0.22% Journal of Alloys and Compounds 55 citations, 0.22%
IET Microwaves Antennas & Propagation	IET Microwaves Antennas & Propagation, 54, 0.22% IET Microwaves Antennas & Propagation 54 citations, 0.22%
IEEE Sensors Journal	IEEE Sensors Journal, 53, 0.22% IEEE Sensors Journal 53 citations, 0.22%
IEEE Electromagnetic Compatibility Magazine	IEEE Electromagnetic Compatibility Magazine, 52, 0.21% IEEE Electromagnetic Compatibility Magazine 52 citations, 0.21%
Lecture Notes in Electrical Engineering	Lecture Notes in Electrical Engineering, 51, 0.21% Lecture Notes in Electrical Engineering 51 citations, 0.21%
Microelectronics International	Microelectronics International, 49, 0.2% Microelectronics International 49 citations, 0.2%
Proceedings of the IEEE	Proceedings of the IEEE, 49, 0.2% Proceedings of the IEEE 49 citations, 0.2%
Applied Thermal Engineering	Applied Thermal Engineering, 48, 0.2% Applied Thermal Engineering 48 citations, 0.2%
IEEE Microwave Magazine	IEEE Microwave Magazine, 47, 0.19% IEEE Microwave Magazine 47 citations, 0.19%
IEEE Transactions on Electronics Packaging Manufacturing	IEEE Transactions on Electronics Packaging Manufacturing, 46, 0.19% IEEE Transactions on Electronics Packaging Manufacturing 46 citations, 0.19%
IEEE Transactions on Instrumentation and Measurement	IEEE Transactions on Instrumentation and Measurement, 45, 0.18% IEEE Transactions on Instrumentation and Measurement 45 citations, 0.18%
Materials	Materials, 45, 0.18% Materials 45 citations, 0.18%
MRS Proceedings	MRS Proceedings, 44, 0.18% MRS Proceedings 44 citations, 0.18%
IEEE Transactions on Magnetics	IEEE Transactions on Magnetics, 43, 0.17% IEEE Transactions on Magnetics 43 citations, 0.17%
Advanced Materials	Advanced Materials, 43, 0.17% Advanced Materials 43 citations, 0.17%
Progress in Electromagnetics Research	Progress in Electromagnetics Research, 42, 0.17% Progress in Electromagnetics Research 42 citations, 0.17%
Circuit World	Circuit World, 41, 0.17% Circuit World 41 citations, 0.17%
Scientific Reports	Scientific Reports, 40, 0.16% Scientific Reports 40 citations, 0.16%
Applied Mechanics and Materials	Applied Mechanics and Materials, 39, 0.16% Applied Mechanics and Materials 39 citations, 0.16%
IEEE Transactions on Signal and Power Integrity	IEEE Transactions on Signal and Power Integrity, 39, 0.16% IEEE Transactions on Signal and Power Integrity 39 citations, 0.16%
Journal of Electromagnetic Waves and Applications	Journal of Electromagnetic Waves and Applications, 38, 0.15% Journal of Electromagnetic Waves and Applications 38 citations, 0.15%
IEICE Electronics Express	IEICE Electronics Express, 38, 0.15% IEICE Electronics Express 38 citations, 0.15%
Proceedings of SPIE - The International Society for Optical Engineering	Proceedings of SPIE - The International Society for Optical Engineering, 38, 0.15% Proceedings of SPIE - The International Society for Optical Engineering 38 citations, 0.15%
International Journal of Heat and Mass Transfer	International Journal of Heat and Mass Transfer, 37, 0.15% International Journal of Heat and Mass Transfer 37 citations, 0.15%
Optical Engineering	Optical Engineering, 37, 0.15% Optical Engineering 37 citations, 0.15%
International Journal of Antennas and Propagation	International Journal of Antennas and Propagation, 36, 0.15% International Journal of Antennas and Propagation 36 citations, 0.15%
Materials Transactions	Materials Transactions, 35, 0.14% Materials Transactions 35 citations, 0.14%
Applied Surface Science	Applied Surface Science, 35, 0.14% Applied Surface Science 35 citations, 0.14%
IEEE Journal of Emerging and Selected Topics in Power Electronics	IEEE Journal of Emerging and Selected Topics in Power Electronics, 34, 0.14% IEEE Journal of Emerging and Selected Topics in Power Electronics 34 citations, 0.14%
Energies	Energies, 34, 0.14% Energies 34 citations, 0.14%
Electric Power Systems Research	Electric Power Systems Research, 33, 0.13% Electric Power Systems Research 33 citations, 0.13%
Thin Solid Films	Thin Solid Films, 33, 0.13% Thin Solid Films 33 citations, 0.13%
IEEE Transactions on Industrial Electronics	IEEE Transactions on Industrial Electronics, 32, 0.13% IEEE Transactions on Industrial Electronics 32 citations, 0.13%
Journal of Applied Polymer Science	Journal of Applied Polymer Science, 31, 0.13% Journal of Applied Polymer Science 31 citations, 0.13%
Textile Reseach Journal	Textile Reseach Journal, 31, 0.13% Textile Reseach Journal 31 citations, 0.13%
Journal of Materials Chemistry A	Journal of Materials Chemistry A, 30, 0.12% Journal of Materials Chemistry A 30 citations, 0.12%
Nanotechnology	Nanotechnology, 30, 0.12% Nanotechnology 30 citations, 0.12%
Journal of Japan Institute of Electronics Packaging	Journal of Japan Institute of Electronics Packaging, 30, 0.12% Journal of Japan Institute of Electronics Packaging 30 citations, 0.12%
International Journal of Microwave and Wireless Technologies	International Journal of Microwave and Wireless Technologies, 29, 0.12% International Journal of Microwave and Wireless Technologies 29 citations, 0.12%
Lab on a Chip	Lab on a Chip, 28, 0.11% Lab on a Chip 28 citations, 0.11%
ACS applied materials & interfaces	ACS applied materials & interfaces, 27, 0.11% ACS applied materials & interfaces 27 citations, 0.11%
Journal of Physics: Conference Series	Journal of Physics: Conference Series, 26, 0.11% Journal of Physics: Conference Series 26 citations, 0.11%
International Journal of Advanced Manufacturing Technology	International Journal of Advanced Manufacturing Technology, 26, 0.11% International Journal of Advanced Manufacturing Technology 26 citations, 0.11%
International Journal of Circuit Theory and Applications	International Journal of Circuit Theory and Applications, 26, 0.11% International Journal of Circuit Theory and Applications 26 citations, 0.11%
IEEE Electron Device Letters	IEEE Electron Device Letters, 25, 0.1% IEEE Electron Device Letters 25 citations, 0.1%
Journal Physics D: Applied Physics	Journal Physics D: Applied Physics, 25, 0.1% Journal Physics D: Applied Physics 25 citations, 0.1%
Ceramics International	Ceramics International, 25, 0.1% Ceramics International 25 citations, 0.1%
Applied Optics	Applied Optics, 24, 0.1% Applied Optics 24 citations, 0.1%
Materials Chemistry and Physics	Materials Chemistry and Physics, 24, 0.1% Materials Chemistry and Physics 24 citations, 0.1%
IEEE Transactions on Circuits and Systems II: Express Briefs	IEEE Transactions on Circuits and Systems II: Express Briefs, 24, 0.1% IEEE Transactions on Circuits and Systems II: Express Briefs 24 citations, 0.1%
Sensors and Actuators, B: Chemical	Sensors and Actuators, B: Chemical, 24, 0.1% Sensors and Actuators, B: Chemical 24 citations, 0.1%
Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing	Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing, 24, 0.1% Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing 24 citations, 0.1%
Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A/Chung-kuo Kung Ch'eng Hsuch K'an	Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A/Chung-kuo Kung Ch'eng Hsuch K'an, 23, 0.09% Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A/Chung-kuo Kung Ch'eng Hsuch K'an 23 citations, 0.09%
Journal of Materials Science	Journal of Materials Science, 23, 0.09% Journal of Materials Science 23 citations, 0.09%
IET Circuits, Devices and Systems	IET Circuits, Devices and Systems, 23, 0.09% IET Circuits, Devices and Systems 23 citations, 0.09%
Applied Sciences (Switzerland)	Applied Sciences (Switzerland), 22, 0.09% Applied Sciences (Switzerland) 22 citations, 0.09%
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