IEEE Transactions on Advanced Packaging

Institute of Electrical and Electronics Engineers (IEEE)
Institute of Electrical and Electronics Engineers (IEEE)
ISSN: 15213323, 15579980
journal names
IEEE Transactions on Advanced Packaging
Publications
1 213
Citations
24 446
h-index
67
Publications
0
Citations
4 604
Top-3 organizations
Top-3 countries
USA (504 publications)
China (165 publications)
Republic of Korea (77 publications)

Most cited in 5 years

Found 
from chars
Publications found: 0

Top-100

Citing journals

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IEEE Transactions on Components, Packaging and Manufacturing Technology
1374 citations, 5.62%
IEEE Transactions on Advanced Packaging
901 citations, 3.69%
IEEE Transactions on Electromagnetic Compatibility
855 citations, 3.5%
IEEE Transactions on Microwave Theory and Techniques
711 citations, 2.91%
Microelectronics Reliability
434 citations, 1.78%
IEEE Transactions on Antennas and Propagation
224 citations, 0.92%
Journal of Electronic Packaging, Transactions of the ASME
195 citations, 0.8%
Journal of Micromechanics and Microengineering
190 citations, 0.78%
IEEE Transactions on Components and Packaging Technologies
180 citations, 0.74%
Journal of Electronic Materials
177 citations, 0.72%
Microwave and Optical Technology Letters
166 citations, 0.68%
Journal of Lightwave Technology
158 citations, 0.65%
Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
154 citations, 0.63%
Journal of Microelectromechanical Systems
153 citations, 0.63%
IEEE Access
150 citations, 0.61%
Journal of Materials Science: Materials in Electronics
146 citations, 0.6%
IEEE Microwave and Wireless Components Letters
140 citations, 0.57%
IEEE Transactions on Power Electronics
130 citations, 0.53%
Microelectronic Engineering
127 citations, 0.52%
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
118 citations, 0.48%
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
115 citations, 0.47%
IEEE Transactions on Electron Devices
96 citations, 0.39%
IEEE Transactions on Device and Materials Reliability
93 citations, 0.38%
Sensors and Actuators, A: Physical
90 citations, 0.37%
Micromachines
86 citations, 0.35%
International Journal of Numerical Modelling: Electronic Networks, Devices and Fields
86 citations, 0.35%
Optics Express
82 citations, 0.34%
Soldering and Surface Mount Technology
81 citations, 0.33%
IEEE Transactions on Power Delivery
81 citations, 0.33%
Sensors
81 citations, 0.33%
IEEE Transactions on Circuits and Systems I: Regular Papers
80 citations, 0.33%
Microsystem Technologies
79 citations, 0.32%
Electronics Letters
74 citations, 0.3%
IEEE Antennas and Wireless Propagation Letters
73 citations, 0.3%
IEEE Journal of Solid-State Circuits
71 citations, 0.29%
International Journal of RF and Microwave Computer-Aided Engineering
71 citations, 0.29%
IEEE Journal of Selected Topics in Quantum Electronics
67 citations, 0.27%
Applied Physics Letters
66 citations, 0.27%
Electronics (Switzerland)
64 citations, 0.26%
IEEE Photonics Technology Letters
64 citations, 0.26%
Microelectronics Journal
62 citations, 0.25%
Advanced Materials Research
61 citations, 0.25%
Journal of Applied Physics
60 citations, 0.25%
Journal of the Electrochemical Society
57 citations, 0.23%
Journal of Alloys and Compounds
55 citations, 0.22%
IEEE Sensors Journal
53 citations, 0.22%
IET Microwaves Antennas & Propagation
51 citations, 0.21%
Lecture Notes in Electrical Engineering
50 citations, 0.2%
Microelectronics International
49 citations, 0.2%
IEEE Electromagnetic Compatibility Magazine
48 citations, 0.2%
Proceedings of the IEEE
48 citations, 0.2%
Applied Thermal Engineering
47 citations, 0.19%
IEEE Microwave Magazine
47 citations, 0.19%
IEEE Transactions on Electronics Packaging Manufacturing
46 citations, 0.19%
IEEE Transactions on Instrumentation and Measurement
45 citations, 0.18%
Materials
44 citations, 0.18%
MRS Proceedings
44 citations, 0.18%
IEEE Transactions on Magnetics
43 citations, 0.18%
Advanced Materials
43 citations, 0.18%
Progress in Electromagnetics Research
42 citations, 0.17%
Circuit World
41 citations, 0.17%
Scientific Reports
40 citations, 0.16%
Applied Mechanics and Materials
39 citations, 0.16%
Journal of Electromagnetic Waves and Applications
38 citations, 0.16%
Proceedings of SPIE - The International Society for Optical Engineering
38 citations, 0.16%
International Journal of Heat and Mass Transfer
37 citations, 0.15%
International Journal of Antennas and Propagation
36 citations, 0.15%
IEICE Electronics Express
36 citations, 0.15%
Optical Engineering
36 citations, 0.15%
Materials Transactions
35 citations, 0.14%
Applied Surface Science
35 citations, 0.14%
Thin Solid Films
34 citations, 0.14%
IEEE Journal of Emerging and Selected Topics in Power Electronics
34 citations, 0.14%
Energies
34 citations, 0.14%
IEEE Transactions on Signal and Power Integrity
34 citations, 0.14%
IEEE Transactions on Industrial Electronics
33 citations, 0.13%
Electric Power Systems Research
33 citations, 0.13%
Journal of Applied Polymer Science
31 citations, 0.13%
Textile Reseach Journal
31 citations, 0.13%
Journal of Materials Chemistry A
30 citations, 0.12%
Nanotechnology
30 citations, 0.12%
International Journal of Microwave and Wireless Technologies
29 citations, 0.12%
Lab on a Chip
28 citations, 0.11%
ACS applied materials & interfaces
26 citations, 0.11%
Journal of Physics: Conference Series
26 citations, 0.11%
International Journal of Advanced Manufacturing Technology
26 citations, 0.11%
International Journal of Circuit Theory and Applications
26 citations, 0.11%
IEEE Electron Device Letters
25 citations, 0.1%
Journal Physics D: Applied Physics
25 citations, 0.1%
Applied Optics
24 citations, 0.1%
Materials Chemistry and Physics
24 citations, 0.1%
Ceramics International
24 citations, 0.1%
IEEE Transactions on Circuits and Systems II: Express Briefs
24 citations, 0.1%
Sensors and Actuators, B: Chemical
24 citations, 0.1%
Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing
24 citations, 0.1%
Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A/Chung-kuo Kung Ch'eng Hsuch K'an
23 citations, 0.09%
Journal of Materials Science
23 citations, 0.09%
IET Circuits, Devices and Systems
23 citations, 0.09%
Applied Sciences (Switzerland)
22 citations, 0.09%
Engineering Fracture Mechanics
22 citations, 0.09%
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Citing publishers

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Institute of Electrical and Electronics Engineers (IEEE)
11648 citations, 47.65%
Elsevier
2229 citations, 9.12%
Springer Nature
1263 citations, 5.17%
Wiley
1055 citations, 4.32%
MDPI
441 citations, 1.8%
IOP Publishing
436 citations, 1.78%
Optica Publishing Group
281 citations, 1.15%
Taylor & Francis
277 citations, 1.13%
ASME International
268 citations, 1.1%
Institution of Engineering and Technology (IET)
229 citations, 0.94%
AIP Publishing
220 citations, 0.9%
Emerald
206 citations, 0.84%
American Chemical Society (ACS)
173 citations, 0.71%
Royal Society of Chemistry (RSC)
170 citations, 0.7%
Japan Society of Applied Physics
159 citations, 0.65%
Trans Tech Publications
143 citations, 0.58%
Cambridge University Press
100 citations, 0.41%
SAGE
98 citations, 0.4%
SPIE-Intl Soc Optical Eng
97 citations, 0.4%
The Electrochemical Society
89 citations, 0.36%
Electromagnetics Academy
83 citations, 0.34%
Hindawi Limited
83 citations, 0.34%
Association for Computing Machinery (ACM)
70 citations, 0.29%
Institute of Electronics, Information and Communications Engineers (IEICE)
68 citations, 0.28%
American Vacuum Society
46 citations, 0.19%
World Scientific
42 citations, 0.17%
Japan Institute of Metals
35 citations, 0.14%
30 citations, 0.12%
Walter de Gruyter
28 citations, 0.11%
26 citations, 0.11%
American Physical Society (APS)
18 citations, 0.07%
EDP Sciences
17 citations, 0.07%
SAE International
17 citations, 0.07%
Institute of Electrical Engineers of Japan (IEE Japan)
16 citations, 0.07%
Korean Institute of Metals and Materials
15 citations, 0.06%
American Institute of Aeronautics and Astronautics (AIAA)
14 citations, 0.06%
IGI Global
14 citations, 0.06%
Pleiades Publishing
13 citations, 0.05%
Korean Society of Mechanical Engineers
13 citations, 0.05%
China Science Publishing & Media
13 citations, 0.05%
International Microelectronics And Packaging Society
12 citations, 0.05%
Japan Institute of Electronics Packaging
12 citations, 0.05%
Society for Industrial and Applied Mathematics (SIAM)
10 citations, 0.04%
IMAPS - International Microelectronics Assembly and Packaging Society
10 citations, 0.04%
American Association for the Advancement of Science (AAAS)
9 citations, 0.04%
Public Library of Science (PLoS)
8 citations, 0.03%
Annual Reviews
8 citations, 0.03%
American Society of Civil Engineers (ASCE)
8 citations, 0.03%
ASM International
7 citations, 0.03%
Frontiers Media S.A.
6 citations, 0.02%
American Institute of Mathematical Sciences (AIMS)
6 citations, 0.02%
midwest symposium on circuits and systems
6 citations, 0.02%
CSIRO Publishing
6 citations, 0.02%
Biophysical Society
5 citations, 0.02%
The Institute of Electronics Engineers of Korea
5 citations, 0.02%
Acta Physica Sinica, Chinese Physical Society and Institute of Physics, Chinese Academy of Sciences
5 citations, 0.02%
Polymer Society of Korea
5 citations, 0.02%
Science in China Press
5 citations, 0.02%
IntechOpen
5 citations, 0.02%
The Royal Society
4 citations, 0.02%
Laser Institute of America
4 citations, 0.02%
ifmbe proceedings
4 citations, 0.02%
Beijing University of Posts and Telecommunications
4 citations, 0.02%
Korean Institute of Electrical Engineers
4 citations, 0.02%
The Korean Society of Precision Engineering
4 citations, 0.02%
The Korean Institute of Electrical and Electronic Material Engineers
4 citations, 0.02%
The Korean Fiber Society
4 citations, 0.02%
Scientific Research Publishing
4 citations, 0.02%
Bentham Science Publishers Ltd.
3 citations, 0.01%
Proceedings of the National Academy of Sciences (PNAS)
3 citations, 0.01%
Japan Society of Mechanical Engineers
3 citations, 0.01%
Acoustical Society of America (ASA)
3 citations, 0.01%
Nonferrous Metals Society of China
3 citations, 0.01%
Korea Soc of Automotive Engineers, Inc
3 citations, 0.01%
3 citations, 0.01%
Assoc Nonwoven Fabrics Ind
3 citations, 0.01%
International Academy Publishing (IAP)
3 citations, 0.01%
The Magnetics Society of Japan
3 citations, 0.01%
Japan Welding Society
3 citations, 0.01%
Oxford University Press
2 citations, 0.01%
IOS Press
2 citations, 0.01%
King Saud University
2 citations, 0.01%
Morgan & Claypool Publishers
2 citations, 0.01%
American Scientific Publishers
2 citations, 0.01%
2 citations, 0.01%
British Institute of Non-Destructive Testing
2 citations, 0.01%
The Korean Society for Aeronautical & Space Sciences
2 citations, 0.01%
Chinese Ceramic Society
2 citations, 0.01%
Copernicus
2 citations, 0.01%
Materials Research Society of Korea
2 citations, 0.01%
Ain Shams University
2 citations, 0.01%
Korean Chemical Society
2 citations, 0.01%
Thomas Telford
2 citations, 0.01%
Social Science Electronic Publishing
2 citations, 0.01%
ASTM International
2 citations, 0.01%
Hans Publishers
2 citations, 0.01%
Ovid Technologies (Wolters Kluwer Health)
1 citation, 0%
Begell House
1 citation, 0%
Georg Thieme Verlag KG
1 citation, 0%
American Physiological Society
1 citation, 0%
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Publishing organizations

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Georgia Institute of technology
113 publications, 9.32%
University of Arizona
25 publications, 2.06%
Korea Advanced Institute of Science and Technology
23 publications, 1.9%
Carleton University
22 publications, 1.81%
National Taiwan University
21 publications, 1.73%
Samsung
20 publications, 1.65%
National University of Singapore
18 publications, 1.48%
National Tsing Hua University
18 publications, 1.48%
City University of Hong Kong
18 publications, 1.48%
University of Illinois Urbana-Champaign
18 publications, 1.48%
University of Maryland, College Park
18 publications, 1.48%
Polytechnic University of Turin
16 publications, 1.32%
Nanyang Technological University
16 publications, 1.32%
National Cheng Kung University
15 publications, 1.24%
Interuniversity Microelectronics Centre
14 publications, 1.15%
University of Washington
14 publications, 1.15%
Agency for Science, Technology and Research
14 publications, 1.15%
Purdue University
14 publications, 1.15%
National Sun Yat-sen University
13 publications, 1.07%
University of California, Irvine
13 publications, 1.07%
Ghent University
12 publications, 0.99%
University of Tokyo
11 publications, 0.91%
University of Colorado Boulder
11 publications, 0.91%
Toshiba Corporation
10 publications, 0.82%
North Carolina State University
9 publications, 0.74%
Taiwan Semiconductor Manufacturing Company
9 publications, 0.74%
Missouri University of Science and Technology
9 publications, 0.74%
Shanghai Jiao Tong University
8 publications, 0.66%
University of L'Aquila
8 publications, 0.66%
Pennsylvania State University
8 publications, 0.66%
Hanyang University
8 publications, 0.66%
Virginia Tech
8 publications, 0.66%
University of Michigan
8 publications, 0.66%
Fraunhofer Institute for Reliability and Microintegration
8 publications, 0.66%
ETH Zurich
7 publications, 0.58%
Cornell University
7 publications, 0.58%
National Yang Ming Chiao Tung University
7 publications, 0.58%
Stanford University
7 publications, 0.58%
Hong Kong University of Science and Technology
7 publications, 0.58%
University of Waterloo
7 publications, 0.58%
Industrial Technology Research Institute
7 publications, 0.58%
Nippon Electric Company
7 publications, 0.58%
Linköping University
6 publications, 0.49%
Electronics and Telecommunications Research Institute
6 publications, 0.49%
University at Buffalo, State University of New York
6 publications, 0.49%
Western University
6 publications, 0.49%
Katholieke Universiteit Leuven
5 publications, 0.41%
Massachusetts Institute of Technology
5 publications, 0.41%
National Chung Cheng University
5 publications, 0.41%
Seoul National University
5 publications, 0.41%
University of California, Berkeley
5 publications, 0.41%
National Institute of Advanced Industrial Science and Technology
5 publications, 0.41%
McGill University
5 publications, 0.41%
Infineon Technologies AG
5 publications, 0.41%
University of Toronto
5 publications, 0.41%
University of Ottawa
5 publications, 0.41%
Huazhong University of Science and Technology
4 publications, 0.33%
University of Electronic Science and Technology of China
4 publications, 0.33%
Chalmers University of Technology
4 publications, 0.33%
KTH Royal Institute of Technology
4 publications, 0.33%
Tampere University
4 publications, 0.33%
University of Oulu
4 publications, 0.33%
Chung Yuan Christian University
4 publications, 0.33%
Feng Chia University
4 publications, 0.33%
University of Sydney
4 publications, 0.33%
Arizona State University
4 publications, 0.33%
National Institute of Standards and Technology
4 publications, 0.33%
University of California, Los Angeles
4 publications, 0.33%
McMaster University
4 publications, 0.33%
Fujitsu Limited
4 publications, 0.33%
University of Florida
4 publications, 0.33%
Tsinghua University
3 publications, 0.25%
Chang Gung University
3 publications, 0.25%
Kun Shan University
3 publications, 0.25%
National Kaohsiung University of Science and Technology
3 publications, 0.25%
California Institute of Technology
3 publications, 0.25%
Yonsei University
3 publications, 0.25%
Korea University
3 publications, 0.25%
Pohang University of Science and Technology
3 publications, 0.25%
Clemson University
3 publications, 0.25%
Gwangju Institute of Science and Technology
3 publications, 0.25%
University of Hong Kong
3 publications, 0.25%
Duke University
3 publications, 0.25%
Kwangwoon University
3 publications, 0.25%
New York University
3 publications, 0.25%
Technical University of Berlin
3 publications, 0.25%
Leibniz University Hannover
3 publications, 0.25%
Jet Propulsion Laboratory
3 publications, 0.25%
University of Minnesota
3 publications, 0.25%
Texas Instruments
3 publications, 0.25%
Sony Group Corporation
3 publications, 0.25%
Binghamton University
3 publications, 0.25%
Dalian University of Technology
2 publications, 0.16%
Mid Sweden University
2 publications, 0.16%
Aalto University
2 publications, 0.16%
University of Naples Federico II
2 publications, 0.16%
University of Science and Technology Beijing
2 publications, 0.16%
VTT Technical Research Centre of Finland
2 publications, 0.16%
Florida State University
2 publications, 0.16%
National Central University
2 publications, 0.16%
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Publishing countries

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USA, 504, 41.55%
USA
504 publications, 41.55%
China, 165, 13.6%
China
165 publications, 13.6%
Republic of Korea, 77, 6.35%
Republic of Korea
77 publications, 6.35%
Japan, 70, 5.77%
Japan
70 publications, 5.77%
Singapore, 64, 5.28%
Singapore
64 publications, 5.28%
Canada, 53, 4.37%
Canada
53 publications, 4.37%
Germany, 42, 3.46%
Germany
42 publications, 3.46%
Italy, 34, 2.8%
Italy
34 publications, 2.8%
Belgium, 25, 2.06%
Belgium
25 publications, 2.06%
Sweden, 17, 1.4%
Sweden
17 publications, 1.4%
Finland, 14, 1.15%
Finland
14 publications, 1.15%
Switzerland, 14, 1.15%
Switzerland
14 publications, 1.15%
France, 11, 0.91%
France
11 publications, 0.91%
United Kingdom, 11, 0.91%
United Kingdom
11 publications, 0.91%
Ireland, 9, 0.74%
Ireland
9 publications, 0.74%
Spain, 8, 0.66%
Spain
8 publications, 0.66%
Netherlands, 7, 0.58%
Netherlands
7 publications, 0.58%
Australia, 5, 0.41%
Australia
5 publications, 0.41%
Norway, 5, 0.41%
Norway
5 publications, 0.41%
Israel, 4, 0.33%
Israel
4 publications, 0.33%
Bulgaria, 2, 0.16%
Bulgaria
2 publications, 0.16%
Malaysia, 2, 0.16%
Malaysia
2 publications, 0.16%
Russia, 1, 0.08%
Russia
1 publication, 0.08%
Portugal, 1, 0.08%
Portugal
1 publication, 0.08%
Austria, 1, 0.08%
Austria
1 publication, 0.08%
Vietnam, 1, 0.08%
Vietnam
1 publication, 0.08%
Greece, 1, 0.08%
Greece
1 publication, 0.08%
India, 1, 0.08%
India
1 publication, 0.08%
Mexico, 1, 0.08%
Mexico
1 publication, 0.08%
Poland, 1, 0.08%
Poland
1 publication, 0.08%
Saudi Arabia, 1, 0.08%
Saudi Arabia
1 publication, 0.08%
Thailand, 1, 0.08%
Thailand
1 publication, 0.08%
Turkey, 1, 0.08%
Turkey
1 publication, 0.08%
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