Frontiers of Mathematics

Springer Nature
Springer Nature
ISSN: 27318648, 27318656

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SCImago
Q2
SJR
0.431
CiteScore
1.3
Categories
Mathematics (miscellaneous)
Areas
Mathematics
Years of issue
2023-2025
journal names
Frontiers of Mathematics
Publications
184
Citations
56
h-index
3
Top-3 citing journals
Mathematics
Mathematics (4 citations)
Axioms
Axioms (3 citations)
Top-3 countries
China (129 publications)
USA (8 publications)
France (2 publications)

Most cited in 5 years

Found 
from chars
Publications found: 13043
On the feature accuracy of deep learning mask topography effect models
Engelmann L., IrenaeusWlokas
Q2
Elsevier
Microelectronic Engineering 2025 citations by CoLab: 0
Theoretical insights into the impact of border and interface traps on hysteresis in monolayer MoS2 FETs
Ghosh R., Provias A., Karl A., Wilhelmer C., Knobloch T., Davoudi M.R., Sattari-Esfahlan S.M., Waldhör D., Grasser T.
Q2
Elsevier
Microelectronic Engineering 2025 citations by CoLab: 0
Unveiling strain in future generation transistor technology by Bessel beam electron diffraction method
Favia P., Eneman G., Veloso A., Mehta A.N., Martinez G.T., Richard O., Hikavyy A., Gowda P.P., Seidel F., Pourtois G., De Keersgieter A., Grieten E.
Q2
Elsevier
Microelectronic Engineering 2025 citations by CoLab: 0
Ultrasharp periodic AlN nanotips formed via purely subtractive nanofabrication
Armstrong R.F., Shields P.
Q2
Elsevier
Microelectronic Engineering 2025 citations by CoLab: 0
Fabrication of industrial grade GMR multilayer magnetic sensors for non-recording applications
Behera B., Borole U.P., Khan J., Barshilia H.C., Chowdhury P.
Q2
Elsevier
Microelectronic Engineering 2025 citations by CoLab: 0
Low temperature solid-state diffusion bonding of fine pitch cu/Sn micro-bumps assisted with formic acid vapor for 3D integration
Wan H., Wang Q., Cai J., Wang D.
Q2
Elsevier
Microelectronic Engineering 2025 citations by CoLab: 0
Unraveling the role of post-annealing in IGZO transistor for memory applications
Kim N., Jeong J., Lee J.W., Woo J.
Q2
Elsevier
Microelectronic Engineering 2025 citations by CoLab: 0
Optimized fabrication of subwavelength slanted gratings via laser interference lithography and faraday cage-assisted etching
Jiang Z., Zhang X., He W., Jiang K., Wang L.
Q2
Elsevier
Microelectronic Engineering 2025 citations by CoLab: 0
Spin coating in semiconductor lithography: Advances in modeling and future prospects
Liu P., Huang L., Zheng C., Bao Y., Gao D., Zhou G.
Q2
Elsevier
Microelectronic Engineering 2025 citations by CoLab: 0
Amorphous indium gallium zinc oxide thin film transistors (a-IGZO-TFTs): Exciting prospects and fabrication challenges
Ajayan J., Sreejith S., Kumari N.A., Manikandan M., Sen S., Kumar M.
Q2
Elsevier
Microelectronic Engineering 2025 citations by CoLab: 0
Optimization of pattern quality in DMD scanning maskless lithography: A parametric study of the OS3L exposure algorithm
Miau T., Lee Y.
Q2
Elsevier
Microelectronic Engineering 2025 citations by CoLab: 0
Neural network for in-sensor time series recognition based on optoelectronic memristor
Zhang Z., Wang Q., Shi G., Liu G.
Q2
Elsevier
Microelectronic Engineering 2025 citations by CoLab: 0
Thermal management of through-silicon vias and back-end-of-line layers in 3D ICs: A comprehensive review
Zhang H., Tian M., Gu X.
Q2
Elsevier
Microelectronic Engineering 2025 citations by CoLab: 0
Optimization of read operation for low power consumption in 3D NAND flash memory
Park J., Kim S., Cho T., Kang M.
Q2
Elsevier
Microelectronic Engineering 2025 citations by CoLab: 0

Top-100

Citing journals

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China, 129, 70.11%
USA, 8, 4.35%
France, 2, 1.09%
Egypt, 1, 0.54%
Jordan, 1, 0.54%
Iran, 1, 0.54%
Spain, 1, 0.54%
Poland, 1, 0.54%
Turkey, 1, 0.54%
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