IEEE Transactions on Parts Hybrids and Packaging

Institute of Electrical and Electronics Engineers (IEEE)
Institute of Electrical and Electronics Engineers (IEEE)
ISSN: 03611000, 15582469
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journal names
IEEE Transactions on Parts Hybrids and Packaging
All time from 2020
Publications
346
Citations
3 500
h-index
26
Top-3 citing journals
Top-3 organizations
Top-3 countries
USA (113 publications)
Japan (11 publications)
Germany (4 publications)

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Top-100

Citing journals

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IEEE Transactions on Components Hybrids and Manufacturing Technology
IEEE Transactions on Components Hybrids and Manufacturing Technology, 338, 9.66%
IEEE Transactions on Parts Hybrids and Packaging
IEEE Transactions on Parts Hybrids and Packaging, 100, 2.86%
Thin Solid Films
Thin Solid Films, 90, 2.57%
Journal of Applied Physics
Journal of Applied Physics, 70, 2%
IEEE Transactions on Microwave Theory and Techniques
IEEE Transactions on Microwave Theory and Techniques, 48, 1.37%
IEEE Journal of Solid-State Circuits
IEEE Journal of Solid-State Circuits, 43, 1.23%
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices, 39, 1.11%
Microelectronics Reliability
Microelectronics Reliability, 38, 1.09%
IEEE Transactions on Components and Packaging Technologies
IEEE Transactions on Components and Packaging Technologies, 38, 1.09%
Journal of Electronic Materials
Journal of Electronic Materials, 37, 1.06%
Journal of the American Ceramic Society
Journal of the American Ceramic Society, 29, 0.83%
IEEE Transactions on Magnetics
IEEE Transactions on Magnetics, 28, 0.8%
IEEE Transactions on Components Packaging and Manufacturing Technology Part A
IEEE Transactions on Components Packaging and Manufacturing Technology Part A, 25, 0.71%
IEEE Transactions on Plasma Science
IEEE Transactions on Plasma Science, 23, 0.66%
MRS Proceedings
MRS Proceedings, 23, 0.66%
IEEE Transactions on Antennas and Propagation
IEEE Transactions on Antennas and Propagation, 21, 0.6%
Microelectronics International
Microelectronics International, 21, 0.6%
Applied Physics Letters
Applied Physics Letters, 21, 0.6%
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology, 20, 0.57%
Wear
Wear, 20, 0.57%
Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes, 19, 0.54%
Microwave and Optical Technology Letters
Microwave and Optical Technology Letters, 18, 0.51%
Corrosion Science
Corrosion Science, 16, 0.46%
Circuit World
Circuit World, 16, 0.46%
Journal of Electronic Packaging, Transactions of the ASME
Journal of Electronic Packaging, Transactions of the ASME, 15, 0.43%
Journal Physics D: Applied Physics
Journal Physics D: Applied Physics, 15, 0.43%
Ferroelectrics
Ferroelectrics, 15, 0.43%
IEEE Transactions on Power Electronics
IEEE Transactions on Power Electronics, 15, 0.43%
Microsystem Technologies
Microsystem Technologies, 13, 0.37%
Sensors and Actuators, A: Physical
Sensors and Actuators, A: Physical, 13, 0.37%
Journal of Micromechanics and Microengineering
Journal of Micromechanics and Microengineering, 13, 0.37%
IEEE Transactions on Advanced Packaging
IEEE Transactions on Advanced Packaging, 13, 0.37%
Journal of Materials Science
Journal of Materials Science, 12, 0.34%
IEEE Sensors Journal
IEEE Sensors Journal, 11, 0.31%
Microelectronic Engineering
Microelectronic Engineering, 11, 0.31%
Sensors
Sensors, 11, 0.31%
Journal of Microelectromechanical Systems
Journal of Microelectromechanical Systems, 11, 0.31%
Journal of Alloys and Compounds
Journal of Alloys and Compounds, 10, 0.29%
Ceramics International
Ceramics International, 10, 0.29%
Journal of Materials Processing Technology
Journal of Materials Processing Technology, 9, 0.26%
IEEE Transactions on Power Delivery
IEEE Transactions on Power Delivery, 9, 0.26%
Materials Transactions
Materials Transactions, 9, 0.26%
Solid-State Electronics
Solid-State Electronics, 9, 0.26%
Review of Scientific Instruments
Review of Scientific Instruments, 9, 0.26%
Soldering and Surface Mount Technology
Soldering and Surface Mount Technology, 8, 0.23%
IEICE Transactions on Electronics, 8, 0.23%
IEEE Transactions on Industrial Electronics
IEEE Transactions on Industrial Electronics, 8, 0.23%
IOP Conference Series: Materials Science and Engineering
IOP Conference Series: Materials Science and Engineering, 8, 0.23%
Vacuum
Vacuum, 8, 0.23%
IEEE Transactions on Instrumentation and Measurement
IEEE Transactions on Instrumentation and Measurement, 8, 0.23%
Materials Chemistry and Physics
Materials Chemistry and Physics, 8, 0.23%
International Journal of Heat and Mass Transfer
International Journal of Heat and Mass Transfer, 8, 0.23%
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics, 8, 0.23%
Proceedings of the IEEE
Proceedings of the IEEE, 8, 0.23%
Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, 8, 0.23%
IEEE Access
IEEE Access, 8, 0.23%
Microelectronics Journal
Microelectronics Journal, 7, 0.2%
IEEE Electron Device Letters
IEEE Electron Device Letters, 7, 0.2%
Materials Today: Proceedings
Materials Today: Proceedings, 7, 0.2%
IEEE Transactions on Electrical Insulation
IEEE Transactions on Electrical Insulation, 7, 0.2%
Applications of Surface Science
Applications of Surface Science, 7, 0.2%
Ieee Journal Of Radio Frequency Identification
Ieee Journal Of Radio Frequency Identification, 7, 0.2%
Journal of Materials Research
Journal of Materials Research, 6, 0.17%
ACS applied materials & interfaces
ACS applied materials & interfaces, 6, 0.17%
Gold Bulletin
Gold Bulletin, 6, 0.17%
Journal of Materials Engineering and Performance
Journal of Materials Engineering and Performance, 6, 0.17%
IEEE Transactions on Device and Materials Reliability
IEEE Transactions on Device and Materials Reliability, 6, 0.17%
Surface and Coatings Technology
Surface and Coatings Technology, 6, 0.17%
Applied Surface Science
Applied Surface Science, 6, 0.17%
JOM
JOM, 6, 0.17%
Bell System Technical Journal
Bell System Technical Journal, 6, 0.17%
IEEE Microwave and Wireless Components Letters
IEEE Microwave and Wireless Components Letters, 5, 0.14%
Science and Technology of Welding and Joining
Science and Technology of Welding and Joining, 5, 0.14%
Journal of the European Ceramic Society
Journal of the European Ceramic Society, 5, 0.14%
Tribology International
Tribology International, 5, 0.14%
Analog Integrated Circuits and Signal Processing
Analog Integrated Circuits and Signal Processing, 5, 0.14%
Applied Thermal Engineering
Applied Thermal Engineering, 5, 0.14%
Electronics Letters
Electronics Letters, 5, 0.14%
IEICE Electronics Express, 5, 0.14%
Materials Letters
Materials Letters, 4, 0.11%
Journal of Materials Chemistry C
Journal of Materials Chemistry C, 4, 0.11%
Journal of Neural Engineering
Journal of Neural Engineering, 4, 0.11%
Journal of the Electrochemical Society
Journal of the Electrochemical Society, 4, 0.11%
IEEE Photonics Technology Letters
IEEE Photonics Technology Letters, 4, 0.11%
Applied Optics
Applied Optics, 4, 0.11%
IEEE Transactions on Electromagnetic Compatibility
IEEE Transactions on Electromagnetic Compatibility, 4, 0.11%
Journal of Thermophysics and Heat Transfer
Journal of Thermophysics and Heat Transfer, 4, 0.11%
IEEE Electrical Insulation Magazine
IEEE Electrical Insulation Magazine, 4, 0.11%
Semiconductor Science and Technology
Semiconductor Science and Technology, 4, 0.11%
AIP Conference Proceedings
AIP Conference Proceedings, 4, 0.11%
Organic Electronics
Organic Electronics, 4, 0.11%
SAE Technical Papers
SAE Technical Papers, 4, 0.11%
Sensors and Actuators, B: Chemical
Sensors and Actuators, B: Chemical, 4, 0.11%
Materials
Materials, 4, 0.11%
IEEE Transactions on Sonics and Ultrasonics
IEEE Transactions on Sonics and Ultrasonics, 4, 0.11%
IEEE Translation Journal on Magnetics in Japan
IEEE Translation Journal on Magnetics in Japan, 4, 0.11%
Materials Science Forum
Materials Science Forum, 3, 0.09%
RSC Advances
RSC Advances, 3, 0.09%
Transactions of Nonferrous Metals Society of China
Transactions of Nonferrous Metals Society of China, 3, 0.09%
EPJ Applied Physics
EPJ Applied Physics, 3, 0.09%
Show all (70 more)
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Citing publishers

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Institute of Electrical and Electronics Engineers (IEEE)
Institute of Electrical and Electronics Engineers (IEEE), 1396, 39.89%
Elsevier
Elsevier, 467, 13.34%
Springer Nature
Springer Nature, 202, 5.77%
Wiley
Wiley, 119, 3.4%
AIP Publishing
AIP Publishing, 116, 3.31%
IOP Publishing
IOP Publishing, 72, 2.06%
Taylor & Francis
Taylor & Francis, 63, 1.8%
Emerald
Emerald, 53, 1.51%
MDPI
MDPI, 43, 1.23%
ASME International
ASME International, 24, 0.69%
American Chemical Society (ACS)
American Chemical Society (ACS), 20, 0.57%
Institution of Engineering and Technology (IET)
Institution of Engineering and Technology (IET), 20, 0.57%
, 20, 0.57%
Japan Society of Applied Physics
Japan Society of Applied Physics, 19, 0.54%
Trans Tech Publications
Trans Tech Publications, 18, 0.51%
Royal Society of Chemistry (RSC)
Royal Society of Chemistry (RSC), 17, 0.49%
Hindawi Limited
Hindawi Limited, 11, 0.31%
Japan Institute of Metals
Japan Institute of Metals, 10, 0.29%
Cambridge University Press
Cambridge University Press, 9, 0.26%
, 7, 0.2%
Optica Publishing Group
Optica Publishing Group, 7, 0.2%
American Physical Society (APS)
American Physical Society (APS), 6, 0.17%
Institute of Electronics, Information and Communications Engineers (IEICE), 6, 0.17%
Walter de Gruyter
Walter de Gruyter, 5, 0.14%
Pleiades Publishing
Pleiades Publishing, 5, 0.14%
American Institute of Aeronautics and Astronautics (AIAA)
American Institute of Aeronautics and Astronautics (AIAA), 5, 0.14%
American Vacuum Society
American Vacuum Society, 5, 0.14%
The Electrochemical Society
The Electrochemical Society, 5, 0.14%
SPIE-Intl Soc Optical Eng
SPIE-Intl Soc Optical Eng, 5, 0.14%
SAE International
SAE International, 5, 0.14%
Electromagnetics Academy
Electromagnetics Academy, 4, 0.11%
Cold Spring Harbor Laboratory
Cold Spring Harbor Laboratory, 4, 0.11%
The Magnetics Society of Japan, 4, 0.11%
World Scientific
World Scientific, 3, 0.09%
EDP Sciences
EDP Sciences, 3, 0.09%
ASM International
ASM International, 2, 0.06%
Association for Computing Machinery (ACM)
Association for Computing Machinery (ACM), 2, 0.06%
Annual Reviews
Annual Reviews, 2, 0.06%
Japan Society of Corrosion Engineering, 2, 0.06%
IMAPS - International Microelectronics Assembly and Packaging Society, 2, 0.06%
Institute of Electrical Engineers of Japan (IEE Japan)
Institute of Electrical Engineers of Japan (IEE Japan), 2, 0.06%
IOS Press
IOS Press, 1, 0.03%
SAGE
SAGE, 1, 0.03%
American Association for the Advancement of Science (AAAS)
American Association for the Advancement of Science (AAAS), 1, 0.03%
Frontiers Media S.A.
Frontiers Media S.A., 1, 0.03%
Japan Society of Mechanical Engineers
Japan Society of Mechanical Engineers, 1, 0.03%
The Royal Society
The Royal Society, 1, 0.03%
, 1, 0.03%
University of Kragujevac, Faculty of Science, 1, 0.03%
, 1, 0.03%
Nonferrous Metals Society of China, 1, 0.03%
Tsinghua University Press
Tsinghua University Press, 1, 0.03%
Ministere de la Culture, 1, 0.03%
Copernicus
Copernicus, 1, 0.03%
Ceramic Society of Japan
Ceramic Society of Japan, 1, 0.03%
Chinese Institute of Automation Engineers (CIAE), 1, 0.03%
, 1, 0.03%
, 1, 0.03%
The Russian Academy of Sciences
The Russian Academy of Sciences, 1, 0.03%
Japan Institute of Electronics Packaging, 1, 0.03%
Vacuum Society of Japan, 1, 0.03%
Society of Rubber Industry, Japan, 1, 0.03%
IntechOpen, 1, 0.03%
Novosibirsk State University (NSU)
Novosibirsk State University (NSU), 1, 0.03%
Japan Welding Society, 1, 0.03%
Techno-Press, 1, 0.03%
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Publishing organizations

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Sandia National Laboratories
Sandia National Laboratories, 16, 4.62%
Washington State University
Washington State University, 2, 0.58%
National Institute of Standards and Technology
National Institute of Standards and Technology, 2, 0.58%
Rensselaer Polytechnic Institute
Rensselaer Polytechnic Institute, 2, 0.58%
Fujitsu Limited
Fujitsu Limited, 2, 0.58%
Nihon University
Nihon University, 2, 0.58%
United States Naval Research Laboratory
United States Naval Research Laboratory, 2, 0.58%
Marshall Space Flight Center
Marshall Space Flight Center, 2, 0.58%
Carnegie Mellon University
Carnegie Mellon University, 1, 0.29%
Pennsylvania State University
Pennsylvania State University, 1, 0.29%
Auburn University
Auburn University, 1, 0.29%
Syracuse University
Syracuse University, 1, 0.29%
Vanderbilt University
Vanderbilt University, 1, 0.29%
Michigan Technological University
Michigan Technological University, 1, 0.29%
Texas Instruments
Texas Instruments, 1, 0.29%
University of Wisconsin–Milwaukee
University of Wisconsin–Milwaukee, 1, 0.29%
Nippon Electric Company
Nippon Electric Company, 1, 0.29%
Lehigh University
Lehigh University, 1, 0.29%
University of Cincinnati
University of Cincinnati, 1, 0.29%
University of Colorado Boulder
University of Colorado Boulder, 1, 0.29%
Goddard Space Flight Center
Goddard Space Flight Center, 1, 0.29%
University of Toledo
University of Toledo, 1, 0.29%
South Dakota School of Mines and Technology
South Dakota School of Mines and Technology, 1, 0.29%
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Publishing countries

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USA, 113, 32.66%
Japan, 11, 3.18%
Germany, 4, 1.16%
United Kingdom, 4, 1.16%
Philippines, 4, 1.16%
France, 3, 0.87%
Canada, 2, 0.58%
Australia, 1, 0.29%
Sweden, 1, 0.29%
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