IEEE Transactions on Parts Hybrids and Packaging

Institute of Electrical and Electronics Engineers (IEEE)
Institute of Electrical and Electronics Engineers (IEEE)
ISSN: 03611000, 15582469
Publications
346
Citations
3 483
h-index
25
Publications
0
Citations
400
Top-3 organizations
Top-3 countries
USA (113 publications)
Japan (11 publications)
Germany (4 publications)

Most cited in 5 years

Found 
from chars
Publications found: 0

Top-100

Citing journals

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IEEE Transactions on Components Hybrids and Manufacturing Technology
338 citations, 9.7%
IEEE Transactions on Parts Hybrids and Packaging
100 citations, 2.87%
Thin Solid Films
90 citations, 2.58%
Journal of Applied Physics
70 citations, 2.01%
IEEE Transactions on Microwave Theory and Techniques
48 citations, 1.38%
IEEE Journal of Solid-State Circuits
43 citations, 1.23%
IEEE Transactions on Electron Devices
39 citations, 1.12%
Microelectronics Reliability
38 citations, 1.09%
IEEE Transactions on Components and Packaging Technologies
38 citations, 1.09%
Journal of Electronic Materials
37 citations, 1.06%
Journal of the American Ceramic Society
29 citations, 0.83%
IEEE Transactions on Magnetics
28 citations, 0.8%
IEEE Transactions on Components Packaging and Manufacturing Technology Part A
25 citations, 0.72%
MRS Proceedings
23 citations, 0.66%
IEEE Transactions on Plasma Science
22 citations, 0.63%
IEEE Transactions on Antennas and Propagation
21 citations, 0.6%
Microelectronics International
21 citations, 0.6%
Applied Physics Letters
21 citations, 0.6%
IEEE Transactions on Components, Packaging and Manufacturing Technology
20 citations, 0.57%
Wear
20 citations, 0.57%
Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
19 citations, 0.55%
Microwave and Optical Technology Letters
18 citations, 0.52%
Corrosion Science
16 citations, 0.46%
Circuit World
16 citations, 0.46%
Journal of Electronic Packaging, Transactions of the ASME
15 citations, 0.43%
Journal Physics D: Applied Physics
15 citations, 0.43%
Ferroelectrics
15 citations, 0.43%
IEEE Transactions on Power Electronics
15 citations, 0.43%
Microsystem Technologies
13 citations, 0.37%
Sensors and Actuators, A: Physical
13 citations, 0.37%
IEEE Transactions on Advanced Packaging
13 citations, 0.37%
Journal of Materials Science
12 citations, 0.34%
Journal of Micromechanics and Microengineering
12 citations, 0.34%
IEEE Sensors Journal
11 citations, 0.32%
Microelectronic Engineering
11 citations, 0.32%
Sensors
11 citations, 0.32%
Journal of Microelectromechanical Systems
11 citations, 0.32%
Journal of Alloys and Compounds
10 citations, 0.29%
Ceramics International
10 citations, 0.29%
Journal of Materials Processing Technology
9 citations, 0.26%
IEEE Transactions on Power Delivery
9 citations, 0.26%
Materials Transactions
9 citations, 0.26%
Solid-State Electronics
9 citations, 0.26%
Review of Scientific Instruments
9 citations, 0.26%
Soldering and Surface Mount Technology
8 citations, 0.23%
IEICE Transactions on Electronics
8 citations, 0.23%
IEEE Transactions on Industrial Electronics
8 citations, 0.23%
IOP Conference Series: Materials Science and Engineering
8 citations, 0.23%
Vacuum
8 citations, 0.23%
IEEE Transactions on Instrumentation and Measurement
8 citations, 0.23%
Materials Chemistry and Physics
8 citations, 0.23%
International Journal of Heat and Mass Transfer
8 citations, 0.23%
Journal of Materials Science: Materials in Electronics
8 citations, 0.23%
Proceedings of the IEEE
8 citations, 0.23%
Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
8 citations, 0.23%
IEEE Access
8 citations, 0.23%
Microelectronics Journal
7 citations, 0.2%
IEEE Electron Device Letters
7 citations, 0.2%
JOM
7 citations, 0.2%
Materials Today: Proceedings
7 citations, 0.2%
IEEE Transactions on Electrical Insulation
7 citations, 0.2%
Applications of Surface Science
7 citations, 0.2%
Journal of Materials Research
6 citations, 0.17%
ACS applied materials & interfaces
6 citations, 0.17%
Gold Bulletin
6 citations, 0.17%
Journal of Materials Engineering and Performance
6 citations, 0.17%
IEEE Transactions on Device and Materials Reliability
6 citations, 0.17%
Surface and Coatings Technology
6 citations, 0.17%
Bell System Technical Journal
6 citations, 0.17%
Ieee Journal Of Radio Frequency Identification
6 citations, 0.17%
IEEE Microwave and Wireless Components Letters
5 citations, 0.14%
Science and Technology of Welding and Joining
5 citations, 0.14%
Journal of the European Ceramic Society
5 citations, 0.14%
Tribology International
5 citations, 0.14%
Applied Surface Science
5 citations, 0.14%
Analog Integrated Circuits and Signal Processing
5 citations, 0.14%
Applied Thermal Engineering
5 citations, 0.14%
Electronics Letters
5 citations, 0.14%
IEICE Electronics Express
5 citations, 0.14%
Materials Letters
4 citations, 0.11%
Journal of Materials Chemistry C
4 citations, 0.11%
Journal of Neural Engineering
4 citations, 0.11%
Journal of the Electrochemical Society
4 citations, 0.11%
IEEE Photonics Technology Letters
4 citations, 0.11%
Applied Optics
4 citations, 0.11%
IEEE Transactions on Electromagnetic Compatibility
4 citations, 0.11%
Journal of Thermophysics and Heat Transfer
4 citations, 0.11%
IEEE Electrical Insulation Magazine
4 citations, 0.11%
Semiconductor Science and Technology
4 citations, 0.11%
AIP Conference Proceedings
4 citations, 0.11%
Organic Electronics
4 citations, 0.11%
SAE Technical Papers
4 citations, 0.11%
Sensors and Actuators, B: Chemical
4 citations, 0.11%
Materials
4 citations, 0.11%
IEEE Transactions on Sonics and Ultrasonics
4 citations, 0.11%
IEEE Translation Journal on Magnetics in Japan
4 citations, 0.11%
Materials Science Forum
3 citations, 0.09%
RSC Advances
3 citations, 0.09%
Transactions of Nonferrous Metals Society of China
3 citations, 0.09%
EPJ Applied Physics
3 citations, 0.09%
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Citing publishers

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Institute of Electrical and Electronics Engineers (IEEE)
1378 citations, 39.56%
Elsevier
456 citations, 13.09%
Springer Nature
195 citations, 5.6%
Wiley
117 citations, 3.36%
AIP Publishing
116 citations, 3.33%
IOP Publishing
70 citations, 2.01%
Taylor & Francis
63 citations, 1.81%
Emerald
53 citations, 1.52%
MDPI
42 citations, 1.21%
23 citations, 0.66%
ASME International
23 citations, 0.66%
American Chemical Society (ACS)
20 citations, 0.57%
Institution of Engineering and Technology (IET)
20 citations, 0.57%
Japan Society of Applied Physics
19 citations, 0.55%
Trans Tech Publications
18 citations, 0.52%
Royal Society of Chemistry (RSC)
17 citations, 0.49%
Hindawi Limited
11 citations, 0.32%
Japan Institute of Metals
10 citations, 0.29%
Cambridge University Press
9 citations, 0.26%
7 citations, 0.2%
Optica Publishing Group
7 citations, 0.2%
American Physical Society (APS)
6 citations, 0.17%
Institute of Electronics, Information and Communications Engineers (IEICE)
6 citations, 0.17%
Walter de Gruyter
5 citations, 0.14%
Pleiades Publishing
5 citations, 0.14%
American Institute of Aeronautics and Astronautics (AIAA)
5 citations, 0.14%
American Vacuum Society
5 citations, 0.14%
The Electrochemical Society
5 citations, 0.14%
SPIE-Intl Soc Optical Eng
5 citations, 0.14%
SAE International
5 citations, 0.14%
Electromagnetics Academy
4 citations, 0.11%
The Magnetics Society of Japan
4 citations, 0.11%
World Scientific
3 citations, 0.09%
EDP Sciences
3 citations, 0.09%
ASM International
2 citations, 0.06%
Association for Computing Machinery (ACM)
2 citations, 0.06%
Annual Reviews
2 citations, 0.06%
Japan Society of Corrosion Engineering
2 citations, 0.06%
IMAPS - International Microelectronics Assembly and Packaging Society
2 citations, 0.06%
Institute of Electrical Engineers of Japan (IEE Japan)
2 citations, 0.06%
IOS Press
1 citation, 0.03%
SAGE
1 citation, 0.03%
American Association for the Advancement of Science (AAAS)
1 citation, 0.03%
Frontiers Media S.A.
1 citation, 0.03%
Japan Society of Mechanical Engineers
1 citation, 0.03%
The Royal Society
1 citation, 0.03%
1 citation, 0.03%
University of Kragujevac, Faculty of Science
1 citation, 0.03%
1 citation, 0.03%
Nonferrous Metals Society of China
1 citation, 0.03%
Tsinghua University Press
1 citation, 0.03%
Ministere de la Culture
1 citation, 0.03%
Copernicus
1 citation, 0.03%
Ceramic Society of Japan
1 citation, 0.03%
Chinese Institute of Automation Engineers (CIAE)
1 citation, 0.03%
1 citation, 0.03%
1 citation, 0.03%
Cold Spring Harbor Laboratory
1 citation, 0.03%
The Russian Academy of Sciences
1 citation, 0.03%
Vacuum Society of Japan
1 citation, 0.03%
Society of Rubber Industry, Japan
1 citation, 0.03%
IntechOpen
1 citation, 0.03%
Novosibirsk State University (NSU)
1 citation, 0.03%
Japan Welding Society
1 citation, 0.03%
Techno-Press
1 citation, 0.03%
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Publishing organizations

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Sandia National Laboratories
16 publications, 4.62%
Washington State University
2 publications, 0.58%
National Institute of Standards and Technology
2 publications, 0.58%
Rensselaer Polytechnic Institute
2 publications, 0.58%
Fujitsu Limited
2 publications, 0.58%
Nihon University
2 publications, 0.58%
United States Naval Research Laboratory
2 publications, 0.58%
Marshall Space Flight Center
2 publications, 0.58%
Carnegie Mellon University
1 publication, 0.29%
Pennsylvania State University
1 publication, 0.29%
Auburn University
1 publication, 0.29%
Syracuse University
1 publication, 0.29%
Vanderbilt University
1 publication, 0.29%
Michigan Technological University
1 publication, 0.29%
Texas Instruments
1 publication, 0.29%
University of Wisconsin–Milwaukee
1 publication, 0.29%
Nippon Electric Company
1 publication, 0.29%
Lehigh University
1 publication, 0.29%
University of Cincinnati
1 publication, 0.29%
University of Colorado Boulder
1 publication, 0.29%
Goddard Space Flight Center
1 publication, 0.29%
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Publishing countries

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USA, 113, 32.66%
USA
113 publications, 32.66%
Japan, 11, 3.18%
Japan
11 publications, 3.18%
Germany, 4, 1.16%
Germany
4 publications, 1.16%
United Kingdom, 4, 1.16%
United Kingdom
4 publications, 1.16%
Philippines, 4, 1.16%
Philippines
4 publications, 1.16%
France, 3, 0.87%
France
3 publications, 0.87%
Canada, 2, 0.58%
Canada
2 publications, 0.58%
Australia, 1, 0.29%
Australia
1 publication, 0.29%
Sweden, 1, 0.29%
Sweden
1 publication, 0.29%
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