IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Institute of Electrical and Electronics Engineers (IEEE)
Institute of Electrical and Electronics Engineers (IEEE)
ISSN: 10709886, 15583678

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journal names
IEEE Transactions on Components Packaging and Manufacturing Technology Part A
Publications
429
Citations
9 002
h-index
49
Publications
0
Citations
1 233
Top-3 organizations
Top-3 countries
USA (235 publications)
Japan (45 publications)
Germany (28 publications)

Most cited in 5 years

Found 
Found 

Top-100

Citing journals

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IEEE Transactions on Components and Packaging Technologies
476 citations, 5.29%
Microelectronics Reliability
275 citations, 3.05%
Journal of Electronic Packaging, Transactions of the ASME
240 citations, 2.67%
IEEE Transactions on Components, Packaging and Manufacturing Technology
173 citations, 1.92%
Journal of Electronic Materials
141 citations, 1.57%
International Journal of Heat and Mass Transfer
128 citations, 1.42%
IEEE Transactions on Advanced Packaging
109 citations, 1.21%
IEEE Transactions on Components Packaging and Manufacturing Technology Part A
109 citations, 1.21%
IEEE Transactions on Plasma Science
106 citations, 1.18%
Journal Physics D: Applied Physics
73 citations, 0.81%
Journal of Applied Physics
72 citations, 0.8%
IEEE Transactions on Electron Devices
70 citations, 0.78%
IEEE Transactions on Electronics Packaging Manufacturing
66 citations, 0.73%
Journal of Materials Science: Materials in Electronics
56 citations, 0.62%
Microelectronics Journal
52 citations, 0.58%
IEEE Transactions on Device and Materials Reliability
51 citations, 0.57%
Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
49 citations, 0.54%
Applied Thermal Engineering
49 citations, 0.54%
IEEE Transactions on Power Electronics
47 citations, 0.52%
Soldering and Surface Mount Technology
44 citations, 0.49%
Journal of Alloys and Compounds
36 citations, 0.4%
Journal of Applied Polymer Science
35 citations, 0.39%
Applied Physics Letters
34 citations, 0.38%
Journal of Micromechanics and Microengineering
32 citations, 0.36%
Journal of Heat Transfer
30 citations, 0.33%
Sensors and Actuators, A: Physical
30 citations, 0.33%
International Journal of Thermal Sciences
29 citations, 0.32%
Microelectronic Engineering
27 citations, 0.3%
Plasma Science and Technology
26 citations, 0.29%
Materials Transactions
26 citations, 0.29%
International Journal of Adhesion and Adhesives
26 citations, 0.29%
IEEE Access
25 citations, 0.28%
IEEE Electron Device Letters
24 citations, 0.27%
Journal of Materials Research
23 citations, 0.26%
Thin Solid Films
23 citations, 0.26%
Journal of Adhesion Science and Technology
23 citations, 0.26%
Heat Transfer Engineering
22 citations, 0.24%
Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing
22 citations, 0.24%
Advanced Materials Research
22 citations, 0.24%
Microelectronics International
21 citations, 0.23%
Vacuum
21 citations, 0.23%
Sensors
21 citations, 0.23%
Key Engineering Materials
21 citations, 0.23%
Finite Elements in Analysis and Design
21 citations, 0.23%
IEEE Transactions on Semiconductor Manufacturing
20 citations, 0.22%
Materials Science in Semiconductor Processing
20 citations, 0.22%
International Journal of Advanced Manufacturing Technology
20 citations, 0.22%
Solid-State Electronics
19 citations, 0.21%
Materials and Design
19 citations, 0.21%
IEEE Transactions on Microwave Theory and Techniques
19 citations, 0.21%
Journal of Microelectromechanical Systems
19 citations, 0.21%
Sensors and Actuators, B: Chemical
19 citations, 0.21%
IEEE Transactions on Industry Applications
19 citations, 0.21%
MRS Proceedings
19 citations, 0.21%
IEEE Transactions on Components Packaging and Manufacturing Technology Part B
19 citations, 0.21%
IEICE Transactions on Electronics
18 citations, 0.2%
Journal of the Electrochemical Society
18 citations, 0.2%
Materials Chemistry and Physics
18 citations, 0.2%
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
18 citations, 0.2%
Energies
18 citations, 0.2%
International Communications in Heat and Mass Transfer
17 citations, 0.19%
IEEE Transactions on Dielectrics and Electrical Insulation
17 citations, 0.19%
IEEE Transactions on Magnetics
17 citations, 0.19%
Journal of Thermophysics and Heat Transfer
17 citations, 0.19%
Wear
17 citations, 0.19%
Heat and Mass Transfer
16 citations, 0.18%
SAE Technical Papers
16 citations, 0.18%
Proceedings of the IEEE
16 citations, 0.18%
Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
16 citations, 0.18%
AIP Advances
15 citations, 0.17%
Computers and Industrial Engineering
15 citations, 0.17%
Journal of Thermal Science and Engineering Applications
15 citations, 0.17%
Microsystem Technologies
15 citations, 0.17%
Engineering Fracture Mechanics
15 citations, 0.17%
Metals
14 citations, 0.16%
Journal of Materials Science
14 citations, 0.16%
Transactions of Nonferrous Metals Society of China
13 citations, 0.14%
Electronics (Switzerland)
13 citations, 0.14%
Applied Surface Science
13 citations, 0.14%
Materials
13 citations, 0.14%
Materials Letters
12 citations, 0.13%
International Journal of Solids and Structures
12 citations, 0.13%
Tribology International
12 citations, 0.13%
Circuit World
12 citations, 0.13%
International Journal of Production Research
12 citations, 0.13%
Journal of Electrostatics
12 citations, 0.13%
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
12 citations, 0.13%
Journal of the American Ceramic Society
12 citations, 0.13%
Journal of Thermal Analysis and Calorimetry
12 citations, 0.13%
Journal of Composite Materials
11 citations, 0.12%
Materials Science Forum
11 citations, 0.12%
IEEE Transactions on Power Delivery
11 citations, 0.12%
IEEE Journal of Solid-State Circuits
11 citations, 0.12%
IEEE Transactions on Electromagnetic Compatibility
11 citations, 0.12%
IEEE Journal of Emerging and Selected Topics in Power Electronics
11 citations, 0.12%
Journal of Electronics Manufacturing
11 citations, 0.12%
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
11 citations, 0.12%
Journal of Physics: Conference Series
10 citations, 0.11%
Physics of Plasmas
10 citations, 0.11%
Journal of Intelligent Manufacturing
10 citations, 0.11%
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Citing publishers

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Institute of Electrical and Electronics Engineers (IEEE)
3217 citations, 35.74%
Elsevier
1612 citations, 17.91%
Springer Nature
634 citations, 7.04%
ASME International
329 citations, 3.65%
Wiley
250 citations, 2.78%
IOP Publishing
234 citations, 2.6%
Taylor & Francis
196 citations, 2.18%
AIP Publishing
158 citations, 1.76%
MDPI
151 citations, 1.68%
Emerald
106 citations, 1.18%
Trans Tech Publications
82 citations, 0.91%
SAGE
60 citations, 0.67%
American Chemical Society (ACS)
51 citations, 0.57%
Japan Society of Applied Physics
48 citations, 0.53%
Cambridge University Press
34 citations, 0.38%
American Institute of Aeronautics and Astronautics (AIAA)
34 citations, 0.38%
Royal Society of Chemistry (RSC)
30 citations, 0.33%
Japan Institute of Metals
27 citations, 0.3%
World Scientific
26 citations, 0.29%
Institution of Engineering and Technology (IET)
26 citations, 0.29%
The Electrochemical Society
25 citations, 0.28%
Hindawi Limited
23 citations, 0.26%
Optica Publishing Group
20 citations, 0.22%
SAE International
20 citations, 0.22%
EDP Sciences
16 citations, 0.18%
Walter de Gruyter
15 citations, 0.17%
American Vacuum Society
14 citations, 0.16%
SPIE-Intl Soc Optical Eng
14 citations, 0.16%
11 citations, 0.12%
Korean Society of Mechanical Engineers
11 citations, 0.12%
Institute of Electronics, Information and Communications Engineers (IEICE)
10 citations, 0.11%
Pleiades Publishing
9 citations, 0.1%
Japan Society of Mechanical Engineers
9 citations, 0.1%
Association for Computing Machinery (ACM)
9 citations, 0.1%
9 citations, 0.1%
Nonferrous Metals Society of China
7 citations, 0.08%
Institute of Electrical Engineers of Japan (IEE Japan)
7 citations, 0.08%
Frontiers Media S.A.
6 citations, 0.07%
American Physical Society (APS)
5 citations, 0.06%
University of Science and Technology Beijing
5 citations, 0.06%
Japan Institute of Electronics Packaging
5 citations, 0.06%
IGI Global
5 citations, 0.06%
Zhejiang University Press
4 citations, 0.04%
The Institute of Electronics Engineers of Korea
4 citations, 0.04%
Korean Institute of Metals and Materials
4 citations, 0.04%
Korean Institute of Electrical Engineers
4 citations, 0.04%
Scientific Research Publishing
4 citations, 0.04%
IntechOpen
4 citations, 0.04%
IOS Press
3 citations, 0.03%
The Korean Society of Precision Engineering
3 citations, 0.03%
Korean Institute of Power Electronics
3 citations, 0.03%
Annual Reviews
3 citations, 0.03%
Japan Society of Powder and Powder Metallurgy
3 citations, 0.03%
Springer New York
3 citations, 0.03%
Oxford University Press
2 citations, 0.02%
Begell House
2 citations, 0.02%
American Scientific Publishers
2 citations, 0.02%
International Union of Crystallography (IUCr)
2 citations, 0.02%
British Institute of Non-Destructive Testing
2 citations, 0.02%
Tsinghua University Press
2 citations, 0.02%
Wuhan University of Technology
2 citations, 0.02%
Polymer Society of Korea
2 citations, 0.02%
2 citations, 0.02%
Canadian Science Publishing
2 citations, 0.02%
Science Alert
2 citations, 0.02%
The Electrochemical Society of Japan
2 citations, 0.02%
Universidade Federal de São Carlos
2 citations, 0.02%
Japan Welding Society
2 citations, 0.02%
Proceedings of the National Academy of Sciences (PNAS)
1 citation, 0.01%
American Association for the Advancement of Science (AAAS)
1 citation, 0.01%
The Royal Society
1 citation, 0.01%
1 citation, 0.01%
Public Library of Science (PLoS)
1 citation, 0.01%
University of Suceava
1 citation, 0.01%
Laser Institute of America
1 citation, 0.01%
Institute for Operations Research and the Management Sciences (INFORMS)
1 citation, 0.01%
ASM International
1 citation, 0.01%
Society of Rheology
1 citation, 0.01%
Fuji Technology Press
1 citation, 0.01%
Universitas Pendidikan Indonesia
1 citation, 0.01%
University of Electronic Science and Technology of China
1 citation, 0.01%
Science Publications
1 citation, 0.01%
The Korean Society for Aeronautical & Space Sciences
1 citation, 0.01%
American Association of Physics Teachers (AAPT)
1 citation, 0.01%
Society of Petroleum Engineers
1 citation, 0.01%
Ceramic Society of Japan
1 citation, 0.01%
Acta Physica Sinica, Chinese Physical Society and Institute of Physics, Chinese Academy of Sciences
1 citation, 0.01%
1 citation, 0.01%
International Microelectronics And Packaging Society
1 citation, 0.01%
Institute of Computer Science
1 citation, 0.01%
Gazi University Journal of Science
1 citation, 0.01%
The Korean Institute of Electrical and Electronic Material Engineers
1 citation, 0.01%
American Association of Textile Chemists and Colorists
1 citation, 0.01%
Taiwan Institute of Chemical Engineers
1 citation, 0.01%
Materials Research Society of Korea
1 citation, 0.01%
National Institute of Industrial Health
1 citation, 0.01%
Japan Society of Civil Engineers
1 citation, 0.01%
Science in China Press
1 citation, 0.01%
Society of Powder Technology
1 citation, 0.01%
European Journal of Chemistry
1 citation, 0.01%
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Publishing organizations

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University of Maryland, College Park
12 publications, 2.8%
Georgia Institute of technology
8 publications, 1.86%
University of Minnesota
8 publications, 1.86%
Keio University
7 publications, 1.63%
University of Southampton
6 publications, 1.4%
Interuniversity Microelectronics Centre
5 publications, 1.17%
Tokyo Institute of Technology
5 publications, 1.17%
Royal Philips
5 publications, 1.17%
Binghamton University
5 publications, 1.17%
Cornell University
4 publications, 0.93%
Vienna University of Technology
4 publications, 0.93%
National and Kapodistrian University of Athens
4 publications, 0.93%
Texas Instruments
4 publications, 0.93%
University of Vienna
4 publications, 0.93%
Lehigh University
4 publications, 0.93%
Sandia National Laboratories
4 publications, 0.93%
Xi'an Jiaotong University
3 publications, 0.7%
Chalmers University of Technology
3 publications, 0.7%
Nanyang Technological University
3 publications, 0.7%
Massachusetts Institute of Technology
3 publications, 0.7%
Carnegie Mellon University
3 publications, 0.7%
Auburn University
3 publications, 0.7%
University of Arizona
3 publications, 0.7%
University of Waterloo
3 publications, 0.7%
Siemens AG
3 publications, 0.7%
Toshiba Corporation
3 publications, 0.7%
University of Colorado Boulder
3 publications, 0.7%
Florida Institute of Technology
3 publications, 0.7%
University of Iowa
3 publications, 0.7%
Tsinghua University
2 publications, 0.47%
University of New South Wales
2 publications, 0.47%
Sorbonne University
2 publications, 0.47%
Loughborough University
2 publications, 0.47%
National Tsing Hua University
2 publications, 0.47%
Stanford University
2 publications, 0.47%
University of Johannesburg
2 publications, 0.47%
North Carolina State University
2 publications, 0.47%
University of California, Berkeley
2 publications, 0.47%
Technical University of Berlin
2 publications, 0.47%
National Technical University of Athens
2 publications, 0.47%
Wayne State University
2 publications, 0.47%
Technical University of Braunschweig
2 publications, 0.47%
University of Erlangen–Nuremberg
2 publications, 0.47%
Tamagawa University
2 publications, 0.47%
Shizuoka University
2 publications, 0.47%
Texas Tech University
2 publications, 0.47%
University College Cork (National University of Ireland, Cork)
2 publications, 0.47%
Université de Rennes
2 publications, 0.47%
Watson Research Center
2 publications, 0.47%
Katholieke Universiteit Leuven
1 publication, 0.23%
University of Twente
1 publication, 0.23%
University of Bordeaux
1 publication, 0.23%
University of Helsinki
1 publication, 0.23%
Beijing University of Technology
1 publication, 0.23%
Aalto University
1 publication, 0.23%
Technische Universität Dresden
1 publication, 0.23%
University of Science and Technology Beijing
1 publication, 0.23%
University of Bologna
1 publication, 0.23%
Université Catholique de Louvain
1 publication, 0.23%
University of Dundee
1 publication, 0.23%
University of Oslo
1 publication, 0.23%
Technical University of Denmark
1 publication, 0.23%
Tokyo University of Science
1 publication, 0.23%
National Taiwan University
1 publication, 0.23%
Johns Hopkins University
1 publication, 0.23%
Pennsylvania State University
1 publication, 0.23%
Ames National Laboratory
1 publication, 0.23%
Iowa State University
1 publication, 0.23%
Tokyo Metropolitan University
1 publication, 0.23%
Korea University
1 publication, 0.23%
Korea Advanced Institute of Science and Technology
1 publication, 0.23%
Ajou University
1 publication, 0.23%
National Institute of Standards and Technology
1 publication, 0.23%
Virginia Tech
1 publication, 0.23%
Syracuse University
1 publication, 0.23%
Harvard University
1 publication, 0.23%
Tufts University
1 publication, 0.23%
University of California, San Diego
1 publication, 0.23%
Eastern Illinois University
1 publication, 0.23%
University at Buffalo, State University of New York
1 publication, 0.23%
University of California, Irvine
1 publication, 0.23%
Northeastern University
1 publication, 0.23%
New Jersey Institute of Technology
1 publication, 0.23%
Southern Methodist University
1 publication, 0.23%
Osaka University
1 publication, 0.23%
Budapest University of Technology and Economics
1 publication, 0.23%
Rensselaer Polytechnic Institute
1 publication, 0.23%
University of Bristol
1 publication, 0.23%
University of the West of England
1 publication, 0.23%
University of Michigan
1 publication, 0.23%
McMaster University
1 publication, 0.23%
Industrial Technology Research Institute
1 publication, 0.23%
Fraunhofer Institute for Reliability and Microintegration
1 publication, 0.23%
Darmstadt University of Applied Sciences
1 publication, 0.23%
University of Tokyo
1 publication, 0.23%
Kyushu University
1 publication, 0.23%
Mitsubishi Electric Corporation
1 publication, 0.23%
University of Electro-Communications
1 publication, 0.23%
Nippon Steel Corporation (Nippon Steel & Sumitomo Metal Corporation)
1 publication, 0.23%
Toyota Technological Institute
1 publication, 0.23%
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Publishing countries

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USA, 235, 54.78%
USA
235 publications, 54.78%
Japan, 45, 10.49%
Japan
45 publications, 10.49%
Germany, 28, 6.53%
Germany
28 publications, 6.53%
United Kingdom, 20, 4.66%
United Kingdom
20 publications, 4.66%
China, 18, 4.2%
China
18 publications, 4.2%
France, 17, 3.96%
France
17 publications, 3.96%
Canada, 14, 3.26%
Canada
14 publications, 3.26%
Austria, 10, 2.33%
Austria
10 publications, 2.33%
Netherlands, 8, 1.86%
Netherlands
8 publications, 1.86%
Belgium, 7, 1.63%
Belgium
7 publications, 1.63%
Singapore, 6, 1.4%
Singapore
6 publications, 1.4%
Sweden, 6, 1.4%
Sweden
6 publications, 1.4%
Republic of Korea, 5, 1.17%
Republic of Korea
5 publications, 1.17%
Greece, 4, 0.93%
Greece
4 publications, 0.93%
Ireland, 4, 0.93%
Ireland
4 publications, 0.93%
Russia, 3, 0.7%
Russia
3 publications, 0.7%
Israel, 3, 0.7%
Israel
3 publications, 0.7%
Poland, 3, 0.7%
Poland
3 publications, 0.7%
Australia, 2, 0.47%
Australia
2 publications, 0.47%
Hungary, 2, 0.47%
Hungary
2 publications, 0.47%
Spain, 2, 0.47%
Spain
2 publications, 0.47%
Malaysia, 2, 0.47%
Malaysia
2 publications, 0.47%
Norway, 2, 0.47%
Norway
2 publications, 0.47%
Switzerland, 2, 0.47%
Switzerland
2 publications, 0.47%
South Africa, 2, 0.47%
South Africa
2 publications, 0.47%
Kazakhstan, 1, 0.23%
Kazakhstan
1 publication, 0.23%
Algeria, 1, 0.23%
Algeria
1 publication, 0.23%
Venezuela, 1, 0.23%
Venezuela
1 publication, 0.23%
Denmark, 1, 0.23%
Denmark
1 publication, 0.23%
Italy, 1, 0.23%
Italy
1 publication, 0.23%
Finland, 1, 0.23%
Finland
1 publication, 0.23%
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