IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Institute of Electrical and Electronics Engineers (IEEE)
Institute of Electrical and Electronics Engineers (IEEE)
ISSN: 10709886, 15583678
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IEEE Transactions on Components Packaging and Manufacturing Technology Part A
All time from 2020
Publications
429
Citations
8 853
h-index
48
Top-3 citing journals
Top-3 organizations
Top-3 countries
USA (235 publications)
Japan (45 publications)
Germany (28 publications)

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Top-100

Citing journals

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IEEE Transactions on Components and Packaging Technologies
IEEE Transactions on Components and Packaging Technologies, 476, 5.38%
Microelectronics Reliability
Microelectronics Reliability, 271, 3.06%
Journal of Electronic Packaging, Transactions of the ASME
Journal of Electronic Packaging, Transactions of the ASME, 238, 2.69%
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology, 170, 1.92%
Journal of Electronic Materials
Journal of Electronic Materials, 140, 1.58%
International Journal of Heat and Mass Transfer
International Journal of Heat and Mass Transfer, 123, 1.39%
IEEE Transactions on Advanced Packaging
IEEE Transactions on Advanced Packaging, 109, 1.23%
IEEE Transactions on Components Packaging and Manufacturing Technology Part A
IEEE Transactions on Components Packaging and Manufacturing Technology Part A, 109, 1.23%
IEEE Transactions on Plasma Science
IEEE Transactions on Plasma Science, 106, 1.2%
Journal of Applied Physics
Journal of Applied Physics, 71, 0.8%
Journal Physics D: Applied Physics
Journal Physics D: Applied Physics, 71, 0.8%
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices, 68, 0.77%
IEEE Transactions on Electronics Packaging Manufacturing
IEEE Transactions on Electronics Packaging Manufacturing, 66, 0.75%
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics, 53, 0.6%
Microelectronics Journal
Microelectronics Journal, 52, 0.59%
IEEE Transactions on Device and Materials Reliability
IEEE Transactions on Device and Materials Reliability, 51, 0.58%
Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes, 48, 0.54%
Applied Thermal Engineering
Applied Thermal Engineering, 46, 0.52%
IEEE Transactions on Power Electronics
IEEE Transactions on Power Electronics, 45, 0.51%
Soldering and Surface Mount Technology
Soldering and Surface Mount Technology, 44, 0.5%
Journal of Applied Polymer Science
Journal of Applied Polymer Science, 35, 0.4%
Journal of Alloys and Compounds
Journal of Alloys and Compounds, 33, 0.37%
Applied Physics Letters
Applied Physics Letters, 33, 0.37%
Journal of Micromechanics and Microengineering
Journal of Micromechanics and Microengineering, 32, 0.36%
Journal of Heat Transfer
Journal of Heat Transfer, 30, 0.34%
Sensors and Actuators, A: Physical
Sensors and Actuators, A: Physical, 30, 0.34%
International Journal of Thermal Sciences
International Journal of Thermal Sciences, 28, 0.32%
Microelectronic Engineering
Microelectronic Engineering, 27, 0.3%
Plasma Science and Technology
Plasma Science and Technology, 26, 0.29%
Materials Transactions
Materials Transactions, 26, 0.29%
International Journal of Adhesion and Adhesives
International Journal of Adhesion and Adhesives, 26, 0.29%
IEEE Electron Device Letters
IEEE Electron Device Letters, 24, 0.27%
Journal of Materials Research
Journal of Materials Research, 23, 0.26%
Thin Solid Films
Thin Solid Films, 23, 0.26%
IEEE Access
IEEE Access, 23, 0.26%
Journal of Adhesion Science and Technology
Journal of Adhesion Science and Technology, 22, 0.25%
Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing
Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing, 22, 0.25%
Advanced Materials Research
Advanced Materials Research, 22, 0.25%
Microelectronics International
Microelectronics International, 21, 0.24%
Vacuum
Vacuum, 21, 0.24%
Sensors
Sensors, 21, 0.24%
Key Engineering Materials
Key Engineering Materials, 21, 0.24%
Heat Transfer Engineering
Heat Transfer Engineering, 21, 0.24%
Finite Elements in Analysis and Design
Finite Elements in Analysis and Design, 21, 0.24%
IEEE Transactions on Semiconductor Manufacturing
IEEE Transactions on Semiconductor Manufacturing, 20, 0.23%
Materials Science in Semiconductor Processing
Materials Science in Semiconductor Processing, 20, 0.23%
MRS Proceedings
MRS Proceedings, 20, 0.23%
IEEE Transactions on Microwave Theory and Techniques
IEEE Transactions on Microwave Theory and Techniques, 19, 0.21%
Journal of Microelectromechanical Systems
Journal of Microelectromechanical Systems, 19, 0.21%
International Journal of Advanced Manufacturing Technology
International Journal of Advanced Manufacturing Technology, 19, 0.21%
Sensors and Actuators, B: Chemical
Sensors and Actuators, B: Chemical, 19, 0.21%
IEEE Transactions on Industry Applications
IEEE Transactions on Industry Applications, 19, 0.21%
IEEE Transactions on Components Packaging and Manufacturing Technology Part B
IEEE Transactions on Components Packaging and Manufacturing Technology Part B, 19, 0.21%
IEICE Transactions on Electronics, 18, 0.2%
Journal of the Electrochemical Society
Journal of the Electrochemical Society, 18, 0.2%
Materials and Design
Materials and Design, 18, 0.2%
Materials Chemistry and Physics
Materials Chemistry and Physics, 18, 0.2%
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 18, 0.2%
IEEE Transactions on Dielectrics and Electrical Insulation
IEEE Transactions on Dielectrics and Electrical Insulation, 17, 0.19%
IEEE Transactions on Magnetics
IEEE Transactions on Magnetics, 17, 0.19%
Journal of Thermophysics and Heat Transfer
Journal of Thermophysics and Heat Transfer, 17, 0.19%
Wear
Wear, 17, 0.19%
Energies
Energies, 17, 0.19%
Solid-State Electronics
Solid-State Electronics, 16, 0.18%
International Communications in Heat and Mass Transfer
International Communications in Heat and Mass Transfer, 16, 0.18%
Heat and Mass Transfer
Heat and Mass Transfer, 16, 0.18%
SAE Technical Papers
SAE Technical Papers, 16, 0.18%
Proceedings of the IEEE
Proceedings of the IEEE, 16, 0.18%
Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, 16, 0.18%
Computers and Industrial Engineering
Computers and Industrial Engineering, 15, 0.17%
Journal of Thermal Science and Engineering Applications
Journal of Thermal Science and Engineering Applications, 15, 0.17%
Microsystem Technologies
Microsystem Technologies, 15, 0.17%
Engineering Fracture Mechanics
Engineering Fracture Mechanics, 15, 0.17%
Metals
Metals, 14, 0.16%
AIP Advances
AIP Advances, 14, 0.16%
Journal of Materials Science
Journal of Materials Science, 14, 0.16%
Transactions of Nonferrous Metals Society of China
Transactions of Nonferrous Metals Society of China, 13, 0.15%
Electronics (Switzerland)
Electronics (Switzerland), 13, 0.15%
Materials
Materials, 13, 0.15%
Materials Letters
Materials Letters, 12, 0.14%
Circuit World
Circuit World, 12, 0.14%
International Journal of Production Research
International Journal of Production Research, 12, 0.14%
Journal of Electrostatics
Journal of Electrostatics, 12, 0.14%
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 12, 0.14%
Journal of Composite Materials
Journal of Composite Materials, 11, 0.12%
Materials Science Forum
Materials Science Forum, 11, 0.12%
IEEE Transactions on Power Delivery
IEEE Transactions on Power Delivery, 11, 0.12%
International Journal of Solids and Structures
International Journal of Solids and Structures, 11, 0.12%
Applied Surface Science
Applied Surface Science, 11, 0.12%
IEEE Journal of Solid-State Circuits
IEEE Journal of Solid-State Circuits, 11, 0.12%
IEEE Transactions on Electromagnetic Compatibility
IEEE Transactions on Electromagnetic Compatibility, 11, 0.12%
IEEE Journal of Emerging and Selected Topics in Power Electronics
IEEE Journal of Emerging and Selected Topics in Power Electronics, 11, 0.12%
Journal of the American Ceramic Society
Journal of the American Ceramic Society, 11, 0.12%
Journal of Electronics Manufacturing
Journal of Electronics Manufacturing, 11, 0.12%
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 11, 0.12%
Tribology International
Tribology International, 10, 0.11%
Physics of Plasmas
Physics of Plasmas, 10, 0.11%
Journal of Intelligent Manufacturing
Journal of Intelligent Manufacturing, 10, 0.11%
Modelling and Simulation in Materials Science and Engineering
Modelling and Simulation in Materials Science and Engineering, 10, 0.11%
Applied Sciences (Switzerland)
Applied Sciences (Switzerland), 10, 0.11%
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Citing publishers

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Institute of Electrical and Electronics Engineers (IEEE)
Institute of Electrical and Electronics Engineers (IEEE), 2819, 31.84%
Elsevier
Elsevier, 1537, 17.36%
Springer Nature
Springer Nature, 581, 6.56%
ASME International
ASME International, 316, 3.57%
Wiley
Wiley, 235, 2.65%
IOP Publishing
IOP Publishing, 227, 2.56%
Taylor & Francis
Taylor & Francis, 194, 2.19%
AIP Publishing
AIP Publishing, 154, 1.74%
MDPI
MDPI, 141, 1.59%
Emerald
Emerald, 106, 1.2%
Trans Tech Publications
Trans Tech Publications, 82, 0.93%
SAGE
SAGE, 60, 0.68%
American Chemical Society (ACS)
American Chemical Society (ACS), 49, 0.55%
Japan Society of Applied Physics
Japan Society of Applied Physics, 48, 0.54%
Cambridge University Press
Cambridge University Press, 46, 0.52%
Royal Society of Chemistry (RSC)
Royal Society of Chemistry (RSC), 29, 0.33%
American Institute of Aeronautics and Astronautics (AIAA)
American Institute of Aeronautics and Astronautics (AIAA), 27, 0.3%
Japan Institute of Metals
Japan Institute of Metals, 27, 0.3%
World Scientific
World Scientific, 26, 0.29%
Institution of Engineering and Technology (IET)
Institution of Engineering and Technology (IET), 26, 0.29%
The Electrochemical Society
The Electrochemical Society, 25, 0.28%
Hindawi Limited
Hindawi Limited, 23, 0.26%
Optica Publishing Group
Optica Publishing Group, 20, 0.23%
, 20, 0.23%
SAE International
SAE International, 20, 0.23%
EDP Sciences
EDP Sciences, 16, 0.18%
SPIE-Intl Soc Optical Eng
SPIE-Intl Soc Optical Eng, 14, 0.16%
Walter de Gruyter
Walter de Gruyter, 13, 0.15%
, 13, 0.15%
Korean Society of Mechanical Engineers, 13, 0.15%
American Vacuum Society
American Vacuum Society, 13, 0.15%
Pleiades Publishing
Pleiades Publishing, 9, 0.1%
Japan Society of Mechanical Engineers
Japan Society of Mechanical Engineers, 9, 0.1%
Association for Computing Machinery (ACM)
Association for Computing Machinery (ACM), 9, 0.1%
Institute of Electronics, Information and Communications Engineers (IEICE), 8, 0.09%
Nonferrous Metals Society of China, 7, 0.08%
Institute of Electrical Engineers of Japan (IEE Japan)
Institute of Electrical Engineers of Japan (IEE Japan), 7, 0.08%
Frontiers Media S.A.
Frontiers Media S.A., 6, 0.07%
Korean Institute of Metals and Materials
Korean Institute of Metals and Materials, 6, 0.07%
Korean Institute of Electrical Engineers, 6, 0.07%
American Physical Society (APS)
American Physical Society (APS), 5, 0.06%
University of Science and Technology Beijing, 5, 0.06%
Japan Institute of Electronics Packaging, 5, 0.06%
IGI Global
IGI Global, 5, 0.06%
The Institute of Electronics Engineers of Korea, 4, 0.05%
Scientific Research Publishing
Scientific Research Publishing, 4, 0.05%
IOS Press
IOS Press, 3, 0.03%
The Korean Society of Precision Engineering, 3, 0.03%
Korean Institute of Power Electronics, 3, 0.03%
Annual Reviews
Annual Reviews, 3, 0.03%
Japan Society of Powder and Powder Metallurgy, 3, 0.03%
Oxford University Press
Oxford University Press, 2, 0.02%
Begell House
Begell House, 2, 0.02%
American Scientific Publishers
American Scientific Publishers, 2, 0.02%
International Union of Crystallography (IUCr)
International Union of Crystallography (IUCr), 2, 0.02%
British Institute of Non-Destructive Testing, 2, 0.02%
Zhejiang University Press, 2, 0.02%
Tsinghua University Press
Tsinghua University Press, 2, 0.02%
Wuhan University of Technology
Wuhan University of Technology, 2, 0.02%
Polymer Society of Korea, 2, 0.02%
, 2, 0.02%
Canadian Science Publishing
Canadian Science Publishing, 2, 0.02%
Science Alert, 2, 0.02%
The Electrochemical Society of Japan
The Electrochemical Society of Japan, 2, 0.02%
IntechOpen, 2, 0.02%
Universidade Federal de São Carlos, 2, 0.02%
Japan Welding Society, 2, 0.02%
Proceedings of the National Academy of Sciences (PNAS)
Proceedings of the National Academy of Sciences (PNAS), 1, 0.01%
American Association for the Advancement of Science (AAAS)
American Association for the Advancement of Science (AAAS), 1, 0.01%
The Royal Society
The Royal Society, 1, 0.01%
, 1, 0.01%
Public Library of Science (PLoS)
Public Library of Science (PLoS), 1, 0.01%
University of Suceava, 1, 0.01%
Laser Institute of America
Laser Institute of America, 1, 0.01%
, 1, 0.01%
Institute for Operations Research and the Management Sciences (INFORMS)
Institute for Operations Research and the Management Sciences (INFORMS), 1, 0.01%
Society of Rheology
Society of Rheology, 1, 0.01%
Fuji Technology Press, 1, 0.01%
Universitas Pendidikan Indonesia
Universitas Pendidikan Indonesia, 1, 0.01%
University of Electronic Science and Technology of China, 1, 0.01%
Science Publications, 1, 0.01%
The Korean Society for Aeronautical & Space Sciences, 1, 0.01%
American Association of Physics Teachers (AAPT)
American Association of Physics Teachers (AAPT), 1, 0.01%
Ceramic Society of Japan
Ceramic Society of Japan, 1, 0.01%
Acta Physica Sinica, Chinese Physical Society and Institute of Physics, Chinese Academy of Sciences
Acta Physica Sinica, Chinese Physical Society and Institute of Physics, Chinese Academy of Sciences, 1, 0.01%
, 1, 0.01%
International Microelectronics And Packaging Society, 1, 0.01%
Institute of Computer Science, 1, 0.01%
Gazi University Journal of Science, 1, 0.01%
The Korean Institute of Electrical and Electronic Material Engineers, 1, 0.01%
American Association of Textile Chemists and Colorists, 1, 0.01%
Taiwan Institute of Chemical Engineers, 1, 0.01%
Materials Research Society of Korea, 1, 0.01%
National Institute of Industrial Health, 1, 0.01%
Japan Society of Civil Engineers
Japan Society of Civil Engineers, 1, 0.01%
Science in China Press, 1, 0.01%
Society of Powder Technology, 1, 0.01%
European Journal of Chemistry, 1, 0.01%
The Surface Finishing Society of Japan, 1, 0.01%
American Society of Civil Engineers (ASCE)
American Society of Civil Engineers (ASCE), 1, 0.01%
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Publishing organizations

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University of Maryland, College Park
University of Maryland, College Park, 12, 2.8%
Georgia Institute of technology
Georgia Institute of technology, 8, 1.86%
University of Minnesota
University of Minnesota, 8, 1.86%
Keio University
Keio University, 7, 1.63%
University of Southampton
University of Southampton, 6, 1.4%
Interuniversity Microelectronics Centre
Interuniversity Microelectronics Centre, 5, 1.17%
Tokyo Institute of Technology
Tokyo Institute of Technology, 5, 1.17%
Royal Philips
Royal Philips, 5, 1.17%
Binghamton University
Binghamton University, 5, 1.17%
Cornell University
Cornell University, 4, 0.93%
Vienna University of Technology
Vienna University of Technology, 4, 0.93%
National and Kapodistrian University of Athens
National and Kapodistrian University of Athens, 4, 0.93%
Texas Instruments
Texas Instruments, 4, 0.93%
University of Vienna
University of Vienna, 4, 0.93%
Lehigh University
Lehigh University, 4, 0.93%
Sandia National Laboratories
Sandia National Laboratories, 4, 0.93%
Xi'an Jiaotong University
Xi'an Jiaotong University, 3, 0.7%
Chalmers University of Technology
Chalmers University of Technology, 3, 0.7%
Nanyang Technological University
Nanyang Technological University, 3, 0.7%
Massachusetts Institute of Technology
Massachusetts Institute of Technology, 3, 0.7%
Carnegie Mellon University
Carnegie Mellon University, 3, 0.7%
Auburn University
Auburn University, 3, 0.7%
University of Arizona
University of Arizona, 3, 0.7%
University of Waterloo
University of Waterloo, 3, 0.7%
Toshiba Corporation
Toshiba Corporation, 3, 0.7%
University of Colorado Boulder
University of Colorado Boulder, 3, 0.7%
Florida Institute of Technology
Florida Institute of Technology, 3, 0.7%
University of Iowa
University of Iowa, 3, 0.7%
Tsinghua University
Tsinghua University, 2, 0.47%
University of New South Wales
University of New South Wales, 2, 0.47%
Sorbonne University
Sorbonne University, 2, 0.47%
Loughborough University
Loughborough University, 2, 0.47%
National Tsing Hua University
National Tsing Hua University, 2, 0.47%
Stanford University
Stanford University, 2, 0.47%
University of Johannesburg
University of Johannesburg, 2, 0.47%
North Carolina State University
North Carolina State University, 2, 0.47%
University of California, Berkeley
University of California, Berkeley, 2, 0.47%
Technical University of Berlin
Technical University of Berlin, 2, 0.47%
National Technical University of Athens
National Technical University of Athens, 2, 0.47%
Wayne State University
Wayne State University, 2, 0.47%
Technical University of Braunschweig
Technical University of Braunschweig, 2, 0.47%
University of Erlangen–Nuremberg
University of Erlangen–Nuremberg, 2, 0.47%
Tamagawa University
Tamagawa University, 2, 0.47%
Shizuoka University
Shizuoka University, 2, 0.47%
Texas Tech University
Texas Tech University, 2, 0.47%
University College Cork (National University of Ireland, Cork)
University College Cork (National University of Ireland, Cork), 2, 0.47%
Katholieke Universiteit Leuven
Katholieke Universiteit Leuven, 1, 0.23%
University of Twente
University of Twente, 1, 0.23%
University of Bordeaux
University of Bordeaux, 1, 0.23%
University of Helsinki
University of Helsinki, 1, 0.23%
Beijing University of Technology
Beijing University of Technology, 1, 0.23%
Aalto University
Aalto University, 1, 0.23%
Technische Universität Dresden
Technische Universität Dresden, 1, 0.23%
University of Science and Technology Beijing
University of Science and Technology Beijing, 1, 0.23%
University of Bologna
University of Bologna, 1, 0.23%
Université Catholique de Louvain
Université Catholique de Louvain, 1, 0.23%
University of Dundee
University of Dundee, 1, 0.23%
University of Oslo
University of Oslo, 1, 0.23%
Technical University of Denmark
Technical University of Denmark, 1, 0.23%
Tokyo University of Science
Tokyo University of Science, 1, 0.23%
National Taiwan University
National Taiwan University, 1, 0.23%
Johns Hopkins University
Johns Hopkins University, 1, 0.23%
Pennsylvania State University
Pennsylvania State University, 1, 0.23%
Ames National Laboratory
Ames National Laboratory, 1, 0.23%
Iowa State University
Iowa State University, 1, 0.23%
Tokyo Metropolitan University
Tokyo Metropolitan University, 1, 0.23%
Korea University
Korea University, 1, 0.23%
Korea Advanced Institute of Science and Technology
Korea Advanced Institute of Science and Technology, 1, 0.23%
Ajou University
Ajou University, 1, 0.23%
National Institute of Standards and Technology
National Institute of Standards and Technology, 1, 0.23%
Virginia Tech
Virginia Tech, 1, 0.23%
Syracuse University
Syracuse University, 1, 0.23%
Harvard University
Harvard University, 1, 0.23%
Tufts University
Tufts University, 1, 0.23%
University of California, San Diego
University of California, San Diego, 1, 0.23%
Eastern Illinois University
Eastern Illinois University, 1, 0.23%
University at Buffalo, State University of New York
University at Buffalo, State University of New York, 1, 0.23%
University of California, Irvine
University of California, Irvine, 1, 0.23%
Northeastern University
Northeastern University, 1, 0.23%
New Jersey Institute of Technology
New Jersey Institute of Technology, 1, 0.23%
Southern Methodist University
Southern Methodist University, 1, 0.23%
Osaka University
Osaka University, 1, 0.23%
Budapest University of Technology and Economics
Budapest University of Technology and Economics, 1, 0.23%
Rensselaer Polytechnic Institute
Rensselaer Polytechnic Institute, 1, 0.23%
University of Bristol
University of Bristol, 1, 0.23%
University of the West of England
University of the West of England, 1, 0.23%
University of Michigan
University of Michigan, 1, 0.23%
McMaster University
McMaster University, 1, 0.23%
Fraunhofer Institute for Reliability and Microintegration
Fraunhofer Institute for Reliability and Microintegration, 1, 0.23%
Darmstadt University of Applied Sciences
Darmstadt University of Applied Sciences, 1, 0.23%
University of Tokyo
University of Tokyo, 1, 0.23%
Kyushu University
Kyushu University, 1, 0.23%
Mitsubishi Electric Corporation
Mitsubishi Electric Corporation, 1, 0.23%
University of Electro-Communications
University of Electro-Communications, 1, 0.23%
Nippon Steel Corporation (Nippon Steel & Sumitomo Metal Corporation)
Nippon Steel Corporation (Nippon Steel & Sumitomo Metal Corporation), 1, 0.23%
Toyota Technological Institute
Toyota Technological Institute, 1, 0.23%
University of Sheffield
University of Sheffield, 1, 0.23%
Bucknell University
Bucknell University, 1, 0.23%
University of East Anglia
University of East Anglia, 1, 0.23%
University of Toronto
University of Toronto, 1, 0.23%
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Publishing countries

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USA, 235, 54.78%
Japan, 45, 10.49%
Germany, 28, 6.53%
United Kingdom, 20, 4.66%
China, 18, 4.2%
France, 17, 3.96%
Canada, 14, 3.26%
Austria, 10, 2.33%
Netherlands, 8, 1.86%
Belgium, 7, 1.63%
Singapore, 6, 1.4%
Sweden, 6, 1.4%
Republic of Korea, 5, 1.17%
Greece, 4, 0.93%
Ireland, 4, 0.93%
Russia, 3, 0.7%
Israel, 3, 0.7%
Poland, 3, 0.7%
Australia, 2, 0.47%
Hungary, 2, 0.47%
Spain, 2, 0.47%
Malaysia, 2, 0.47%
Norway, 2, 0.47%
Switzerland, 2, 0.47%
South Africa, 2, 0.47%
Kazakhstan, 1, 0.23%
Algeria, 1, 0.23%
Venezuela, 1, 0.23%
Denmark, 1, 0.23%
Italy, 1, 0.23%
Finland, 1, 0.23%
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