Transactions of The Japan Institute of Electronics Packaging

Japan Institute of Electronics Packaging
ISSN: 18833365, 18848028
Publications
167
Citations
803
h-index
13
Publications
13
Citations
408
Top-3 organizations
Waseda University
Waseda University (6 publications)
Tokyo University of Science
Tokyo University of Science (5 publications)
Waseda University
Waseda University (4 publications)
Tokyo University of Science
Tokyo University of Science (2 publications)
Top-3 countries
Japan (42 publications)
China (3 publications)
USA (3 publications)
Japan (7 publications)
Germany (1 publication)
USA (1 publication)

Most cited in 5 years

Found 
from chars
Publications found: 0

Top-100

Citing journals

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Transactions of The Japan Institute of Electronics Packaging
29 citations, 3.61%
Journal of Electronic Materials
23 citations, 2.86%
Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
22 citations, 2.74%
Microelectronics Reliability
19 citations, 2.37%
IEEE Transactions on Components, Packaging and Manufacturing Technology
13 citations, 1.62%
Journal of Materials Science: Materials in Electronics
11 citations, 1.37%
Journal of Japan Institute of Electronics Packaging
11 citations, 1.37%
Journal of Electronic Packaging, Transactions of the ASME
9 citations, 1.12%
Materials Transactions
9 citations, 1.12%
IEEJ Transactions on Sensors and Micromachines
9 citations, 1.12%
Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing
9 citations, 1.12%
Journal of Photopolymer Science and Technology
8 citations, 1%
Metals
8 citations, 1%
Journal of Alloys and Compounds
7 citations, 0.87%
Materials
7 citations, 0.87%
Materials Science Forum
6 citations, 0.75%
Micromachines
6 citations, 0.75%
Journal of Materials Research and Technology
6 citations, 0.75%
IEEE Transactions on Power Electronics
6 citations, 0.75%
Materials Letters
5 citations, 0.62%
Journal of the Electrochemical Society
5 citations, 0.62%
Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society
5 citations, 0.62%
Materials Characterization
4 citations, 0.5%
International Journal of Heat and Mass Transfer
4 citations, 0.5%
IEEE Transactions on Electromagnetic Compatibility
4 citations, 0.5%
Sensors
4 citations, 0.5%
Welding International
4 citations, 0.5%
Soldering and Surface Mount Technology
3 citations, 0.37%
Advanced Materials Technologies
3 citations, 0.37%
IEICE Transactions on Electronics
3 citations, 0.37%
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
3 citations, 0.37%
Materials Science and Engineering B: Solid-State Materials for Advanced Technology
3 citations, 0.37%
Polymers
3 citations, 0.37%
Microsystem Technologies
3 citations, 0.37%
Scientific Reports
3 citations, 0.37%
Applied Thermal Engineering
3 citations, 0.37%
Applied Physics A: Materials Science and Processing
3 citations, 0.37%
Microelectronic Engineering
3 citations, 0.37%
Langmuir
3 citations, 0.37%
AIP Conference Proceedings
3 citations, 0.37%
Energies
3 citations, 0.37%
Applied Physics Express
3 citations, 0.37%
Journal of Micromechanics and Microengineering
3 citations, 0.37%
International Symposium on Microelectronics
3 citations, 0.37%
JOURNAL OF THE JAPAN WELDING SOCIETY
3 citations, 0.37%
Solid State Phenomena
2 citations, 0.25%
Journal of Applied Polymer Science
2 citations, 0.25%
Journal of Materials Processing Technology
2 citations, 0.25%
Journal of Materials Research
2 citations, 0.25%
IEEE Journal of the Electron Devices Society
2 citations, 0.25%
RSC Advances
2 citations, 0.25%
Advances in Materials Science and Engineering
2 citations, 0.25%
Intermetallics
2 citations, 0.25%
Acta Materialia
2 citations, 0.25%
AIP Advances
2 citations, 0.25%
Electrochemistry
2 citations, 0.25%
Optics Express
2 citations, 0.25%
Materials and Design
2 citations, 0.25%
Journal of Lightwave Technology
2 citations, 0.25%
IOP Conference Series: Materials Science and Engineering
2 citations, 0.25%
International Journal of Precision Engineering and Manufacturing
2 citations, 0.25%
Materials Today Communications
2 citations, 0.25%
International Journal of Multiphase Flow
2 citations, 0.25%
Surface and Coatings Technology
2 citations, 0.25%
Polymer Science - Series D
2 citations, 0.25%
Scripta Materialia
2 citations, 0.25%
Electrochimica Acta
2 citations, 0.25%
Springer Series in Advanced Microelectronics
2 citations, 0.25%
Crystals
2 citations, 0.25%
Procedia Engineering
2 citations, 0.25%
Thin Solid Films
2 citations, 0.25%
Advanced Engineering Materials
2 citations, 0.25%
Nanoscale Research Letters
2 citations, 0.25%
Opto-electronics Review
2 citations, 0.25%
Radio Science
2 citations, 0.25%
Sensors and Actuators, A: Physical
2 citations, 0.25%
ETRI Journal
2 citations, 0.25%
Welding in the World, Le Soudage Dans Le Monde
2 citations, 0.25%
Journal of Microelectronics and Electronic Packaging
2 citations, 0.25%
IEEE Transactions on Electron Devices
2 citations, 0.25%
MRS Advances
2 citations, 0.25%
Pramana - Journal of Physics
1 citation, 0.12%
Korean Journal of Chemical Engineering
1 citation, 0.12%
Surfaces and Interfaces
1 citation, 0.12%
Transactions of the Institute of Metal Finishing
1 citation, 0.12%
Chinese Journal of Chemical Engineering
1 citation, 0.12%
Artificial Life and Robotics
1 citation, 0.12%
Fluids
1 citation, 0.12%
ACS applied materials & interfaces
1 citation, 0.12%
ACS Applied Nano Materials
1 citation, 0.12%
Journal of Industrial and Engineering Chemistry
1 citation, 0.12%
Microelectronics International
1 citation, 0.12%
Journal of Physics: Conference Series
1 citation, 0.12%
Fibre chemistry
1 citation, 0.12%
IEEE Microwave and Wireless Components Letters
1 citation, 0.12%
Polish Journal of Chemical Technology
1 citation, 0.12%
Journal of Materials Chemistry C
1 citation, 0.12%
Materials Research Express
1 citation, 0.12%
Applied Physics Letters
1 citation, 0.12%
Smart Materials and Structures
1 citation, 0.12%
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Citing publishers

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Institute of Electrical and Electronics Engineers (IEEE)
164 citations, 20.42%
Elsevier
123 citations, 15.32%
Springer Nature
71 citations, 8.84%
MDPI
39 citations, 4.86%
Japan Institute of Electronics Packaging
32 citations, 3.99%
Wiley
25 citations, 3.11%
Japan Society of Applied Physics
21 citations, 2.62%
IOP Publishing
16 citations, 1.99%
Japan Institute of Metals
12 citations, 1.49%
Institute of Electrical Engineers of Japan (IEE Japan)
12 citations, 1.49%
Taylor & Francis
11 citations, 1.37%
Trans Tech Publications
9 citations, 1.12%
ASME International
9 citations, 1.12%
American Chemical Society (ACS)
8 citations, 1%
AIP Publishing
8 citations, 1%
8 citations, 1%
Japan Welding Society
8 citations, 1%
The Technical Association of Photopolymers, Japan
7 citations, 0.87%
The Electrochemical Society
6 citations, 0.75%
Emerald
5 citations, 0.62%
Pleiades Publishing
5 citations, 0.62%
Royal Society of Chemistry (RSC)
5 citations, 0.62%
4 citations, 0.5%
SAGE
3 citations, 0.37%
IMAPS - International Microelectronics Assembly and Packaging Society
3 citations, 0.37%
Cambridge University Press
2 citations, 0.25%
Walter de Gruyter
2 citations, 0.25%
Optica Publishing Group
2 citations, 0.25%
American Physical Society (APS)
2 citations, 0.25%
Korean Institute of Metals and Materials
2 citations, 0.25%
The Korean Society of Precision Engineering
2 citations, 0.25%
International Microelectronics And Packaging Society
2 citations, 0.25%
Hindawi Limited
2 citations, 0.25%
The Electrochemical Society of Japan
2 citations, 0.25%
SPIE-Intl Soc Optical Eng
2 citations, 0.25%
EDP Sciences
1 citation, 0.12%
Institution of Engineering and Technology (IET)
1 citation, 0.12%
Japan Society of Mechanical Engineers
1 citation, 0.12%
1 citation, 0.12%
1 citation, 0.12%
American Scientific Publishers
1 citation, 0.12%
Korean Society of Industrial Engineering Chemistry
1 citation, 0.12%
Japan Institute of Light Metals
1 citation, 0.12%
Wuhan University of Technology
1 citation, 0.12%
American Vacuum Society
1 citation, 0.12%
Polymer Society of Korea
1 citation, 0.12%
Taiwan Institute of Chemical Engineers
1 citation, 0.12%
1 citation, 0.12%
The Chemical Society of Japan
1 citation, 0.12%
The Carbon Society of Japan
1 citation, 0.12%
Bryansk State Technical University BSTU
1 citation, 0.12%
Vacuum Society of Japan
1 citation, 0.12%
SAE International
1 citation, 0.12%
Shanghai Institute of Organic Chemistry
1 citation, 0.12%
Universidade Federal de São Carlos
1 citation, 0.12%
Japan Society of Powder and Powder Metallurgy
1 citation, 0.12%
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Publishing organizations

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Waseda University
6 publications, 3.59%
Tokyo University of Science
5 publications, 2.99%
Toyama Prefectural University
4 publications, 2.4%
Iwate University
4 publications, 2.4%
Osaka University
3 publications, 1.8%
National Institute of Advanced Industrial Science and Technology
3 publications, 1.8%
Fukuoka University
3 publications, 1.8%
Nagoya University
2 publications, 1.2%
University of Tokyo
2 publications, 1.2%
Kyushu Institute of Technology
2 publications, 1.2%
Panasonic Holdings Corporation
2 publications, 1.2%
Nihon University
2 publications, 1.2%
Gunma University
2 publications, 1.2%
Ibaraki University
2 publications, 1.2%
University of Hyogo
2 publications, 1.2%
University of Electronic Science and Technology of China
1 publication, 0.6%
Karlsruhe Institute of Technology
1 publication, 0.6%
University of Malaysia, Perlis
1 publication, 0.6%
Sun Yat-sen University
1 publication, 0.6%
University of Milan
1 publication, 0.6%
National Institute for Materials Science
1 publication, 0.6%
National Taiwan University
1 publication, 0.6%
Interuniversity Microelectronics Centre
1 publication, 0.6%
Yokohama National University
1 publication, 0.6%
Fraunhofer Institute for Integrated Systems and Device Technology
1 publication, 0.6%
Mitsubishi Electric Corporation
1 publication, 0.6%
Kumamoto University
1 publication, 0.6%
Meisei University
1 publication, 0.6%
University of Yamanashi
1 publication, 0.6%
Kagawa University
1 publication, 0.6%
Hosei University
1 publication, 0.6%
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Publishing organizations in 5 years

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Waseda University
4 publications, 30.77%
Tokyo University of Science
2 publications, 15.38%
Karlsruhe Institute of Technology
1 publication, 7.69%
University of Malaysia, Perlis
1 publication, 7.69%
Yokohama National University
1 publication, 7.69%
Nihon University
1 publication, 7.69%
University of Yamanashi
1 publication, 7.69%
Hosei University
1 publication, 7.69%
Iwate University
1 publication, 7.69%
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Publishing countries

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Japan, 42, 25.15%
Japan
42 publications, 25.15%
USA, 3, 1.8%
USA
3 publications, 1.8%
China, 3, 1.8%
China
3 publications, 1.8%
Germany, 2, 1.2%
Germany
2 publications, 1.2%
Belgium, 1, 0.6%
Belgium
1 publication, 0.6%
Italy, 1, 0.6%
Italy
1 publication, 0.6%
Malaysia, 1, 0.6%
Malaysia
1 publication, 0.6%
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Publishing countries in 5 years

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Japan, 7, 53.85%
Japan
7 publications, 53.85%
Germany, 1, 7.69%
Germany
1 publication, 7.69%
USA, 1, 7.69%
USA
1 publication, 7.69%
Malaysia, 1, 7.69%
Malaysia
1 publication, 7.69%
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