Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Institute of Electrical and Electronics Engineers (IEEE)

ISSN: 10652221

Journal publications in Cobalt

Are you a researcher?

Create a profile to get free access to personal recommendations for colleagues and new articles.

SJR

0.120

CiteScore

0.6

Most cited in 5 years

Found

Publication title

Found

Top-100

Citing journals

Citing publishers

	20 40 60 80 100 120 140 160 180 200
Institute of Electrical and Electronics Engineers (IEEE)	Institute of Electrical and Electronics Engineers (IEEE), 183, 42.86% Institute of Electrical and Electronics Engineers (IEEE) 183 citations, 42.86%
Elsevier	Elsevier, 66, 15.46% Elsevier 66 citations, 15.46%
Springer Nature	Springer Nature, 28, 6.56% Springer Nature 28 citations, 6.56%
MDPI	MDPI, 24, 5.62% MDPI 24 citations, 5.62%
ASME International	ASME International, 13, 3.04% ASME International 13 citations, 3.04%
AIP Publishing	AIP Publishing, 7, 1.64% AIP Publishing 7 citations, 1.64%
Emerald	Emerald, 6, 1.41% Emerald 6 citations, 1.41%
Springer New York	Springer New York, 6, 1.41% Springer New York 6 citations, 1.41%
Taylor & Francis	Taylor & Francis, 5, 1.17% Taylor & Francis 5 citations, 1.17%
Wiley	Wiley, 4, 0.94% Wiley 4 citations, 0.94%
Institution of Engineering and Technology (IET)	Institution of Engineering and Technology (IET), 4, 0.94% Institution of Engineering and Technology (IET) 4 citations, 0.94%
IOP Publishing	IOP Publishing, 3, 0.7% IOP Publishing 3 citations, 0.7%
American Chemical Society (ACS)	American Chemical Society (ACS), 2, 0.47% American Chemical Society (ACS) 2 citations, 0.47%
EDP Sciences	EDP Sciences, 2, 0.47% EDP Sciences 2 citations, 0.47%
Begell House	Begell House, 2, 0.47% Begell House 2 citations, 0.47%
Pleiades Publishing	Pleiades Publishing, 2, 0.47% Pleiades Publishing 2 citations, 0.47%
Trans Tech Publications	Trans Tech Publications, 2, 0.47% Trans Tech Publications 2 citations, 0.47%
Japan Institute of Electronics Packaging	Japan Institute of Electronics Packaging, 2, 0.47% Japan Institute of Electronics Packaging 2 citations, 0.47%
SAE International	SAE International, 2, 0.47% SAE International 2 citations, 0.47%
American Association for the Advancement of Science (AAAS)	American Association for the Advancement of Science (AAAS), 1, 0.23% American Association for the Advancement of Science (AAAS) 1 citation, 0.23%
Universitat Politecnica de Valencia	Universitat Politecnica de Valencia, 1, 0.23% Universitat Politecnica de Valencia 1 citation, 0.23%
Acoustical Society of America (ASA)	Acoustical Society of America (ASA), 1, 0.23% Acoustical Society of America (ASA) 1 citation, 0.23%
Association for Computing Machinery (ACM)	Association for Computing Machinery (ACM), 1, 0.23% Association for Computing Machinery (ACM) 1 citation, 0.23%
Science in China Press	Science in China Press, 1, 0.23% Science in China Press 1 citation, 0.23%
Scientific Research Publishing	Scientific Research Publishing, 1, 0.23% Scientific Research Publishing 1 citation, 0.23%
IntechOpen	IntechOpen, 1, 0.23% IntechOpen 1 citation, 0.23%
Institute of Electronics, Information and Communications Engineers (IEICE)	Institute of Electronics, Information and Communications Engineers (IEICE), 1, 0.23% Institute of Electronics, Information and Communications Engineers (IEICE) 1 citation, 0.23%
Industrial University of Tyumen	Industrial University of Tyumen, 1, 0.23% Industrial University of Tyumen 1 citation, 0.23%
	20 40 60 80 100 120 140 160 180 200

	2 4 6 8 10 12 14 16
Applied Thermal Engineering	Applied Thermal Engineering, 16, 3.75% Applied Thermal Engineering 16 citations, 3.75%
International Journal of Heat and Mass Transfer	International Journal of Heat and Mass Transfer, 14, 3.28% International Journal of Heat and Mass Transfer 14 citations, 3.28%
Energies	Energies, 12, 2.81% Energies 12 citations, 2.81%
IEEE Transactions on Components, Packaging and Manufacturing Technology	IEEE Transactions on Components, Packaging and Manufacturing Technology, 9, 2.11% IEEE Transactions on Components, Packaging and Manufacturing Technology 9 citations, 2.11%
IEEE Transactions on Power Electronics	IEEE Transactions on Power Electronics, 9, 2.11% IEEE Transactions on Power Electronics 9 citations, 2.11%
Experimental Thermal and Fluid Science	Experimental Thermal and Fluid Science, 7, 1.64% Experimental Thermal and Fluid Science 7 citations, 1.64%
IEEE Transactions on Electron Devices	IEEE Transactions on Electron Devices, 7, 1.64% IEEE Transactions on Electron Devices 7 citations, 1.64%
IEEE Journal of Emerging and Selected Topics in Power Electronics	IEEE Journal of Emerging and Selected Topics in Power Electronics, 6, 1.41% IEEE Journal of Emerging and Selected Topics in Power Electronics 6 citations, 1.41%
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems	2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 6, 1.41% 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems 6 citations, 1.41%
Solid State Lighting Technology and Application Series	Solid State Lighting Technology and Application Series, 6, 1.41% Solid State Lighting Technology and Application Series 6 citations, 1.41%
Journal of Electronic Packaging, Transactions of the ASME	Journal of Electronic Packaging, Transactions of the ASME, 5, 1.17% Journal of Electronic Packaging, Transactions of the ASME 5 citations, 1.17%
IEEE Transactions on Instrumentation and Measurement	IEEE Transactions on Instrumentation and Measurement, 5, 1.17% IEEE Transactions on Instrumentation and Measurement 5 citations, 1.17%
Journal of Applied Physics	Journal of Applied Physics, 5, 1.17% Journal of Applied Physics 5 citations, 1.17%
Journal of Heat Transfer	Journal of Heat Transfer, 5, 1.17% Journal of Heat Transfer 5 citations, 1.17%
IEEE Access	IEEE Access, 4, 0.94% IEEE Access 4 citations, 0.94%
IEEE Open Journal of Industry Applications	IEEE Open Journal of Industry Applications, 4, 0.94% IEEE Open Journal of Industry Applications 4 citations, 0.94%
IEEE Transactions on Industrial Electronics	IEEE Transactions on Industrial Electronics, 3, 0.7% IEEE Transactions on Industrial Electronics 3 citations, 0.7%
Microsystem Technologies	Microsystem Technologies, 3, 0.7% Microsystem Technologies 3 citations, 0.7%
Applied Sciences (Switzerland)	Applied Sciences (Switzerland), 3, 0.7% Applied Sciences (Switzerland) 3 citations, 0.7%
Arabian Journal for Science and Engineering	Arabian Journal for Science and Engineering, 3, 0.7% Arabian Journal for Science and Engineering 3 citations, 0.7%
Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium	Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 3, 0.7% Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium 3 citations, 0.7%
Soldering and Surface Mount Technology	Soldering and Surface Mount Technology, 2, 0.47% Soldering and Surface Mount Technology 2 citations, 0.47%
IEEE Transactions on Semiconductor Manufacturing	IEEE Transactions on Semiconductor Manufacturing, 2, 0.47% IEEE Transactions on Semiconductor Manufacturing 2 citations, 0.47%
Microelectronics Reliability	Microelectronics Reliability, 2, 0.47% Microelectronics Reliability 2 citations, 0.47%
Microelectronics International	Microelectronics International, 2, 0.47% Microelectronics International 2 citations, 0.47%
International Journal of Heat and Fluid Flow	International Journal of Heat and Fluid Flow, 2, 0.47% International Journal of Heat and Fluid Flow 2 citations, 0.47%
Micro and Nano Letters	Micro and Nano Letters, 2, 0.47% Micro and Nano Letters 2 citations, 0.47%
IEEE Transactions on Dielectrics and Electrical Insulation	IEEE Transactions on Dielectrics and Electrical Insulation, 2, 0.47% IEEE Transactions on Dielectrics and Electrical Insulation 2 citations, 0.47%
Materials Science in Semiconductor Processing	Materials Science in Semiconductor Processing, 2, 0.47% Materials Science in Semiconductor Processing 2 citations, 0.47%
International Journal of Thermal Sciences	International Journal of Thermal Sciences, 2, 0.47% International Journal of Thermal Sciences 2 citations, 0.47%
Journal of Thermal Science and Engineering Applications	Journal of Thermal Science and Engineering Applications, 2, 0.47% Journal of Thermal Science and Engineering Applications 2 citations, 0.47%
Heat and Mass Transfer	Heat and Mass Transfer, 2, 0.47% Heat and Mass Transfer 2 citations, 0.47%
Energy Conversion and Management	Energy Conversion and Management, 2, 0.47% Energy Conversion and Management 2 citations, 0.47%
IEEE Transactions on Device and Materials Reliability	IEEE Transactions on Device and Materials Reliability, 2, 0.47% IEEE Transactions on Device and Materials Reliability 2 citations, 0.47%
Review of Scientific Instruments	Review of Scientific Instruments, 2, 0.47% Review of Scientific Instruments 2 citations, 0.47%
IEEE Transactions on Transportation Electrification	IEEE Transactions on Transportation Electrification, 2, 0.47% IEEE Transactions on Transportation Electrification 2 citations, 0.47%
Procedia Engineering	Procedia Engineering, 2, 0.47% Procedia Engineering 2 citations, 0.47%
International Journal of Energy Research	International Journal of Energy Research, 2, 0.47% International Journal of Energy Research 2 citations, 0.47%
Journal of Electronic Materials	Journal of Electronic Materials, 2, 0.47% Journal of Electronic Materials 2 citations, 0.47%