IEEE Transactions on Parts Materials and Packaging

Institute of Electrical and Electronics Engineers (IEEE)

ISSN: 00189502, 15582655

Journal publications in Cobalt

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journal names

IEEE Transactions on Parts Materials and Packaging

All time from 2021

Publications

205

Citations

684

h-index

Publications

Citations

Top-3 citing journals

IEEE Transactions on Components Hybrids and Manufacturing Technology (56 citations)

IEEE Transactions on Parts Hybrids and Packaging (37 citations)

IEEE Transactions on Parts Materials and Packaging (19 citations)

Top-3 organizations

Shizuoka University (2 publications)

Tohoku University (2 publications)

Cornell University (1 publication)

Top-3 countries

USA (30 publications)

Japan (5 publications)

United Kingdom (1 publication)

Most cited in 5 years

Found

Publication title

Found

Top-100

Citing journals

	10 20 30 40 50 60
IEEE Transactions on Components Hybrids and Manufacturing Technology	IEEE Transactions on Components Hybrids and Manufacturing Technology, 56, 8.19% IEEE Transactions on Components Hybrids and Manufacturing Technology 56 citations, 8.19%
IEEE Transactions on Parts Hybrids and Packaging	IEEE Transactions on Parts Hybrids and Packaging, 37, 5.41% IEEE Transactions on Parts Hybrids and Packaging 37 citations, 5.41%
IEEE Transactions on Parts Materials and Packaging	IEEE Transactions on Parts Materials and Packaging, 19, 2.78% IEEE Transactions on Parts Materials and Packaging 19 citations, 2.78%
Thin Solid Films	Thin Solid Films, 17, 2.49% Thin Solid Films 17 citations, 2.49%
Journal of Applied Physics	Journal of Applied Physics, 14, 2.05% Journal of Applied Physics 14 citations, 2.05%
IEEE Transactions on Microwave Theory and Techniques	IEEE Transactions on Microwave Theory and Techniques, 11, 1.61% IEEE Transactions on Microwave Theory and Techniques 11 citations, 1.61%
IEEE Transactions on Components, Packaging and Manufacturing Technology	IEEE Transactions on Components, Packaging and Manufacturing Technology, 11, 1.61% IEEE Transactions on Components, Packaging and Manufacturing Technology 11 citations, 1.61%
IEEE Transactions on Plasma Science	IEEE Transactions on Plasma Science, 10, 1.46% IEEE Transactions on Plasma Science 10 citations, 1.46%
Review of Scientific Instruments	Review of Scientific Instruments, 10, 1.46% Review of Scientific Instruments 10 citations, 1.46%
IEEE Transactions on Components and Packaging Technologies	IEEE Transactions on Components and Packaging Technologies, 9, 1.32% IEEE Transactions on Components and Packaging Technologies 9 citations, 1.32%
Corrosion Science	Corrosion Science, 8, 1.17% Corrosion Science 8 citations, 1.17%
IEEE Transactions on Magnetics	IEEE Transactions on Magnetics, 7, 1.02% IEEE Transactions on Magnetics 7 citations, 1.02%
IEICE Transactions on Electronics	IEICE Transactions on Electronics, 6, 0.88% IEICE Transactions on Electronics 6 citations, 0.88%
Microelectronics Reliability	Microelectronics Reliability, 6, 0.88% Microelectronics Reliability 6 citations, 0.88%
Electrical Engineering in Japan (English translation of Denki Gakkai Ronbunshi)	Electrical Engineering in Japan (English translation of Denki Gakkai Ronbunshi), 6, 0.88% Electrical Engineering in Japan (English translation of Denki Gakkai Ronbunshi) 6 citations, 0.88%
IEEE Transactions on Electromagnetic Compatibility	IEEE Transactions on Electromagnetic Compatibility, 6, 0.88% IEEE Transactions on Electromagnetic Compatibility 6 citations, 0.88%
Ferroelectrics	Ferroelectrics, 6, 0.88% Ferroelectrics 6 citations, 0.88%
IEEE Transactions on Industry Applications	IEEE Transactions on Industry Applications, 6, 0.88% IEEE Transactions on Industry Applications 6 citations, 0.88%
Proceedings of the IEEE	Proceedings of the IEEE, 5, 0.73% Proceedings of the IEEE 5 citations, 0.73%
Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes	Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes, 4, 0.58% Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes 4 citations, 0.58%
IEEE Microwave and Wireless Components Letters	IEEE Microwave and Wireless Components Letters, 4, 0.58% IEEE Microwave and Wireless Components Letters 4 citations, 0.58%
IEEE Transactions on Applied Superconductivity	IEEE Transactions on Applied Superconductivity, 4, 0.58% IEEE Transactions on Applied Superconductivity 4 citations, 0.58%
IEEE Transactions on Components Packaging and Manufacturing Technology Part A	IEEE Transactions on Components Packaging and Manufacturing Technology Part A, 4, 0.58% IEEE Transactions on Components Packaging and Manufacturing Technology Part A 4 citations, 0.58%
Materials Letters	Materials Letters, 3, 0.44% Materials Letters 3 citations, 0.44%
Nuclear Instruments and Methods in Physics Research, Section B: Beam Interactions with Materials and Atoms	Nuclear Instruments and Methods in Physics Research, Section B: Beam Interactions with Materials and Atoms, 3, 0.44% Nuclear Instruments and Methods in Physics Research, Section B: Beam Interactions with Materials and Atoms 3 citations, 0.44%
Applied Physics Letters	Applied Physics Letters, 3, 0.44% Applied Physics Letters 3 citations, 0.44%
Vacuum	Vacuum, 3, 0.44% Vacuum 3 citations, 0.44%
IEEE Journal of Solid-State Circuits	IEEE Journal of Solid-State Circuits, 3, 0.44% IEEE Journal of Solid-State Circuits 3 citations, 0.44%
Journal Physics D: Applied Physics	Journal Physics D: Applied Physics, 3, 0.44% Journal Physics D: Applied Physics 3 citations, 0.44%
Journal of Crystal Growth	Journal of Crystal Growth, 3, 0.44% Journal of Crystal Growth 3 citations, 0.44%
IEEE Transactions on Power Electronics	IEEE Transactions on Power Electronics, 3, 0.44% IEEE Transactions on Power Electronics 3 citations, 0.44%
Journal of Macromolecular Science Part A - Chemistry	Journal of Macromolecular Science Part A - Chemistry, 3, 0.44% Journal of Macromolecular Science Part A - Chemistry 3 citations, 0.44%
IEEE Transactions on Electrical Insulation	IEEE Transactions on Electrical Insulation, 3, 0.44% IEEE Transactions on Electrical Insulation 3 citations, 0.44%
Microelectronics International	Microelectronics International, 2, 0.29% Microelectronics International 2 citations, 0.29%
IEEE Transactions on Power Delivery	IEEE Transactions on Power Delivery, 2, 0.29% IEEE Transactions on Power Delivery 2 citations, 0.29%
Journal of Thermal Spray Technology	Journal of Thermal Spray Technology, 2, 0.29% Journal of Thermal Spray Technology 2 citations, 0.29%
Tribology Letters	Tribology Letters, 2, 0.29% Tribology Letters 2 citations, 0.29%
IEEE Transactions on Circuits and Systems I: Regular Papers	IEEE Transactions on Circuits and Systems I: Regular Papers, 2, 0.29% IEEE Transactions on Circuits and Systems I: Regular Papers 2 citations, 0.29%
Journal of Alloys and Compounds	Journal of Alloys and Compounds, 2, 0.29% Journal of Alloys and Compounds 2 citations, 0.29%
IEEE Transactions on Industrial Electronics	IEEE Transactions on Industrial Electronics, 2, 0.29% IEEE Transactions on Industrial Electronics 2 citations, 0.29%
Handbook of Magnetic Materials	Handbook of Magnetic Materials, 2, 0.29% Handbook of Magnetic Materials 2 citations, 0.29%
Electronics (Switzerland)	Electronics (Switzerland), 2, 0.29% Electronics (Switzerland) 2 citations, 0.29%
Acta Materialia	Acta Materialia, 2, 0.29% Acta Materialia 2 citations, 0.29%
AIP Advances	AIP Advances, 2, 0.29% AIP Advances 2 citations, 0.29%
Applied Optics	Applied Optics, 2, 0.29% Applied Optics 2 citations, 0.29%
IEEE Transactions on Dielectrics and Electrical Insulation	IEEE Transactions on Dielectrics and Electrical Insulation, 2, 0.29% IEEE Transactions on Dielectrics and Electrical Insulation 2 citations, 0.29%
Materials Research Bulletin	Materials Research Bulletin, 2, 0.29% Materials Research Bulletin 2 citations, 0.29%
IEEE Transactions on Instrumentation and Measurement	IEEE Transactions on Instrumentation and Measurement, 2, 0.29% IEEE Transactions on Instrumentation and Measurement 2 citations, 0.29%
Physics of the Solid State	Physics of the Solid State, 2, 0.29% Physics of the Solid State 2 citations, 0.29%
Plasma Chemistry and Plasma Processing	Plasma Chemistry and Plasma Processing, 2, 0.29% Plasma Chemistry and Plasma Processing 2 citations, 0.29%
Scripta Materialia	Scripta Materialia, 2, 0.29% Scripta Materialia 2 citations, 0.29%
Journal of Physical Chemistry B	Journal of Physical Chemistry B, 2, 0.29% Journal of Physical Chemistry B 2 citations, 0.29%
Electrochimica Acta	Electrochimica Acta, 2, 0.29% Electrochimica Acta 2 citations, 0.29%
Journal of Spacecraft and Rockets	Journal of Spacecraft and Rockets, 2, 0.29% Journal of Spacecraft and Rockets 2 citations, 0.29%
Journal of Electronic Materials	Journal of Electronic Materials, 2, 0.29% Journal of Electronic Materials 2 citations, 0.29%
Journal of Energy Storage	Journal of Energy Storage, 2, 0.29% Journal of Energy Storage 2 citations, 0.29%
Journal of Materials Science: Materials in Electronics	Journal of Materials Science: Materials in Electronics, 2, 0.29% Journal of Materials Science: Materials in Electronics 2 citations, 0.29%
Heat Transfer Engineering	Heat Transfer Engineering, 2, 0.29% Heat Transfer Engineering 2 citations, 0.29%
IEICE Electronics Express	IEICE Electronics Express, 2, 0.29% IEICE Electronics Express 2 citations, 0.29%
IEEE Journal of Emerging and Selected Topics in Power Electronics	IEEE Journal of Emerging and Selected Topics in Power Electronics, 2, 0.29% IEEE Journal of Emerging and Selected Topics in Power Electronics 2 citations, 0.29%
SAE Technical Papers	SAE Technical Papers, 2, 0.29% SAE Technical Papers 2 citations, 0.29%
Journal of Micromechanics and Microengineering	Journal of Micromechanics and Microengineering, 2, 0.29% Journal of Micromechanics and Microengineering 2 citations, 0.29%
IEEE Access	IEEE Access, 2, 0.29% IEEE Access 2 citations, 0.29%
Physical Review B	Physical Review B, 2, 0.29% Physical Review B 2 citations, 0.29%
MRS Advances	MRS Advances, 2, 0.29% MRS Advances 2 citations, 0.29%
IEEE Transactions on Advanced Packaging	IEEE Transactions on Advanced Packaging, 2, 0.29% IEEE Transactions on Advanced Packaging 2 citations, 0.29%
Electronics and Communications in Japan (Part I Communications)	Electronics and Communications in Japan (Part I Communications), 2, 0.29% Electronics and Communications in Japan (Part I Communications) 2 citations, 0.29%
Physics of Thin Films - Advances in Research and Development	Physics of Thin Films - Advances in Research and Development, 2, 0.29% Physics of Thin Films - Advances in Research and Development 2 citations, 0.29%
Solid State Phenomena	Solid State Phenomena, 1, 0.15% Solid State Phenomena 1 citation, 0.15%
Materials Science Forum	Materials Science Forum, 1, 0.15% Materials Science Forum 1 citation, 0.15%
Plasma Science and Technology	Plasma Science and Technology, 1, 0.15% Plasma Science and Technology 1 citation, 0.15%
Surface Science	Surface Science, 1, 0.15% Surface Science 1 citation, 0.15%
Journal of Chemical Physics	Journal of Chemical Physics, 1, 0.15% Journal of Chemical Physics 1 citation, 0.15%
Surfaces and Interfaces	Surfaces and Interfaces, 1, 0.15% Surfaces and Interfaces 1 citation, 0.15%
Transactions of the Institute of Metal Finishing	Transactions of the Institute of Metal Finishing, 1, 0.15% Transactions of the Institute of Metal Finishing 1 citation, 0.15%
International Journal of Electronics	International Journal of Electronics, 1, 0.15% International Journal of Electronics 1 citation, 0.15%
ACS applied materials & interfaces	ACS applied materials & interfaces, 1, 0.15% ACS applied materials & interfaces 1 citation, 0.15%
Annual Review of Materials Research	Annual Review of Materials Research, 1, 0.15% Annual Review of Materials Research 1 citation, 0.15%
Physical Chemistry Chemical Physics	Physical Chemistry Chemical Physics, 1, 0.15% Physical Chemistry Chemical Physics 1 citation, 0.15%
Microscopy and Microanalysis	Microscopy and Microanalysis, 1, 0.15% Microscopy and Microanalysis 1 citation, 0.15%
IEEE Transactions on Aerospace and Electronic Systems	IEEE Transactions on Aerospace and Electronic Systems, 1, 0.15% IEEE Transactions on Aerospace and Electronic Systems 1 citation, 0.15%
Tribology Online	Tribology Online, 1, 0.15% Tribology Online 1 citation, 0.15%
Journal of Electronic Packaging, Transactions of the ASME	Journal of Electronic Packaging, Transactions of the ASME, 1, 0.15% Journal of Electronic Packaging, Transactions of the ASME 1 citation, 0.15%
Corrosion Reviews	Corrosion Reviews, 1, 0.15% Corrosion Reviews 1 citation, 0.15%
Journal of Materials Chemistry C	Journal of Materials Chemistry C, 1, 0.15% Journal of Materials Chemistry C 1 citation, 0.15%
Hyperfine Interactions	Hyperfine Interactions, 1, 0.15% Hyperfine Interactions 1 citation, 0.15%
Advances in Materials Science and Engineering	Advances in Materials Science and Engineering, 1, 0.15% Advances in Materials Science and Engineering 1 citation, 0.15%
Smart Materials and Structures	Smart Materials and Structures, 1, 0.15% Smart Materials and Structures 1 citation, 0.15%
Solid-State Electronics	Solid-State Electronics, 1, 0.15% Solid-State Electronics 1 citation, 0.15%
Gold Bulletin	Gold Bulletin, 1, 0.15% Gold Bulletin 1 citation, 0.15%
Journal of Physics Condensed Matter	Journal of Physics Condensed Matter, 1, 0.15% Journal of Physics Condensed Matter 1 citation, 0.15%
Plasma Sources Science and Technology	Plasma Sources Science and Technology, 1, 0.15% Plasma Sources Science and Technology 1 citation, 0.15%
IEEE Transactions on Biomedical Circuits and Systems	IEEE Transactions on Biomedical Circuits and Systems, 1, 0.15% IEEE Transactions on Biomedical Circuits and Systems 1 citation, 0.15%
Mathematics and Computers in Simulation	Mathematics and Computers in Simulation, 1, 0.15% Mathematics and Computers in Simulation 1 citation, 0.15%
IEEE Spectrum	IEEE Spectrum, 1, 0.15% IEEE Spectrum 1 citation, 0.15%
Journal of the Electrochemical Society	Journal of the Electrochemical Society, 1, 0.15% Journal of the Electrochemical Society 1 citation, 0.15%
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films	Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films, 1, 0.15% Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films 1 citation, 0.15%
Journal of the Korean Ceramic Society	Journal of the Korean Ceramic Society, 1, 0.15% Journal of the Korean Ceramic Society 1 citation, 0.15%
IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control	IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, 1, 0.15% IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control 1 citation, 0.15%
Superconductor Science and Technology	Superconductor Science and Technology, 1, 0.15% Superconductor Science and Technology 1 citation, 0.15%

	10 20 30 40 50 60

Citing publishers

	50 100 150 200 250 300 350
Institute of Electrical and Electronics Engineers (IEEE)	Institute of Electrical and Electronics Engineers (IEEE), 302, 44.15% Institute of Electrical and Electronics Engineers (IEEE) 302 citations, 44.15%
Elsevier	Elsevier, 87, 12.72% Elsevier 87 citations, 12.72%
Springer Nature	Springer Nature, 32, 4.68% Springer Nature 32 citations, 4.68%
AIP Publishing	AIP Publishing, 32, 4.68% AIP Publishing 32 citations, 4.68%
Wiley	Wiley, 20, 2.92% Wiley 20 citations, 2.92%
Taylor & Francis	Taylor & Francis, 18, 2.63% Taylor & Francis 18 citations, 2.63%
IOP Publishing	IOP Publishing, 15, 2.19% IOP Publishing 15 citations, 2.19%
MDPI	MDPI, 12, 1.75% MDPI 12 citations, 1.75%
American Chemical Society (ACS)	American Chemical Society (ACS), 5, 0.73% American Chemical Society (ACS) 5 citations, 0.73%
Japan Society of Applied Physics	Japan Society of Applied Physics, 5, 0.73% Japan Society of Applied Physics 5 citations, 0.73%
	, 4, 0.58% 4 citations, 0.58%
Institute of Electronics, Information and Communications Engineers (IEICE)	Institute of Electronics, Information and Communications Engineers (IEICE), 4, 0.58% Institute of Electronics, Information and Communications Engineers (IEICE) 4 citations, 0.58%
Emerald	Emerald, 3, 0.44% Emerald 3 citations, 0.44%
Pleiades Publishing	Pleiades Publishing, 3, 0.44% Pleiades Publishing 3 citations, 0.44%
Trans Tech Publications	Trans Tech Publications, 3, 0.44% Trans Tech Publications 3 citations, 0.44%
Optica Publishing Group	Optica Publishing Group, 3, 0.44% Optica Publishing Group 3 citations, 0.44%
American Institute of Aeronautics and Astronautics (AIAA)	American Institute of Aeronautics and Astronautics (AIAA), 3, 0.44% American Institute of Aeronautics and Astronautics (AIAA) 3 citations, 0.44%
American Physical Society (APS)	American Physical Society (APS), 3, 0.44% American Physical Society (APS) 3 citations, 0.44%
SAE International	SAE International, 3, 0.44% SAE International 3 citations, 0.44%
Institution of Engineering and Technology (IET)	Institution of Engineering and Technology (IET), 2, 0.29% Institution of Engineering and Technology (IET) 2 citations, 0.29%
Royal Society of Chemistry (RSC)	Royal Society of Chemistry (RSC), 2, 0.29% Royal Society of Chemistry (RSC) 2 citations, 0.29%
Hindawi Limited	Hindawi Limited, 2, 0.29% Hindawi Limited 2 citations, 0.29%
ASME International	ASME International, 2, 0.29% ASME International 2 citations, 0.29%
Walter de Gruyter	Walter de Gruyter, 1, 0.15% Walter de Gruyter 1 citation, 0.15%
Oxford University Press	Oxford University Press, 1, 0.15% Oxford University Press 1 citation, 0.15%
SAGE	SAGE, 1, 0.15% SAGE 1 citation, 0.15%
Public Library of Science (PLoS)	Public Library of Science (PLoS), 1, 0.15% Public Library of Science (PLoS) 1 citation, 0.15%
Japanese Society of Tribologists	Japanese Society of Tribologists, 1, 0.15% Japanese Society of Tribologists 1 citation, 0.15%
Nonferrous Metals Society of China	Nonferrous Metals Society of China, 1, 0.15% Nonferrous Metals Society of China 1 citation, 0.15%
Tsinghua University Press	Tsinghua University Press, 1, 0.15% Tsinghua University Press 1 citation, 0.15%
	, 1, 0.15% 1 citation, 0.15%
Korean Ceramic Society	Korean Ceramic Society, 1, 0.15% Korean Ceramic Society 1 citation, 0.15%
Beilstein-Institut	Beilstein-Institut, 1, 0.15% Beilstein-Institut 1 citation, 0.15%
	, 1, 0.15% 1 citation, 0.15%
The Electrochemical Society	The Electrochemical Society, 1, 0.15% The Electrochemical Society 1 citation, 0.15%
Annual Reviews	Annual Reviews, 1, 0.15% Annual Reviews 1 citation, 0.15%
The Surface Finishing Society of Japan	The Surface Finishing Society of Japan, 1, 0.15% The Surface Finishing Society of Japan 1 citation, 0.15%
The Surface Science Society of Japan	The Surface Science Society of Japan, 1, 0.15% The Surface Science Society of Japan 1 citation, 0.15%
IntechOpen	IntechOpen, 1, 0.15% IntechOpen 1 citation, 0.15%
Institute of Electrical Engineers of Japan (IEE Japan)	Institute of Electrical Engineers of Japan (IEE Japan), 1, 0.15% Institute of Electrical Engineers of Japan (IEE Japan) 1 citation, 0.15%

	50 100 150 200 250 300 350

Publishing organizations

	1 2
Tohoku University	Tohoku University, 2, 0.98% Tohoku University 2 publications, 0.98%
Shizuoka University	Shizuoka University, 2, 0.98% Shizuoka University 2 publications, 0.98%
Cornell University	Cornell University, 1, 0.49% Cornell University 1 publication, 0.49%
Pennsylvania State University	Pennsylvania State University, 1, 0.49% Pennsylvania State University 1 publication, 0.49%
Stanford University	Stanford University, 1, 0.49% Stanford University 1 publication, 0.49%
Swansea University	Swansea University, 1, 0.49% Swansea University 1 publication, 0.49%
Texas Instruments	Texas Instruments, 1, 0.49% Texas Instruments 1 publication, 0.49%
Sandia National Laboratories	Sandia National Laboratories, 1, 0.49% Sandia National Laboratories 1 publication, 0.49%
	1 2

Publishing countries

	5 10 15 20 25 30
USA	USA, 30, 14.63% USA 30 publications, 14.63%
Japan	Japan, 5, 2.44% Japan 5 publications, 2.44%
United Kingdom	United Kingdom, 1, 0.49% United Kingdom 1 publication, 0.49%
Canada	Canada, 1, 0.49% Canada 1 publication, 0.49%
	5 10 15 20 25 30