IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Institute of Electrical and Electronics Engineers (IEEE)
Institute of Electrical and Electronics Engineers (IEEE)
ISSN: 10709894, 15583686
Publications
415
Citations
6 477
h-index
39
Publications
0
Citations
565
Top-3 organizations
Cornell University
Cornell University (12 publications)
University of Arizona
University of Arizona (9 publications)
Top-3 countries
USA (269 publications)
Japan (43 publications)
China (25 publications)

Most cited in 5 years

Found 
from chars
Publications found: 0

Top-100

Citing journals

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IEEE Transactions on Advanced Packaging
351 citations, 5.42%
IEEE Transactions on Components and Packaging Technologies
158 citations, 2.44%
IEEE Transactions on Components Packaging and Manufacturing Technology Part B
156 citations, 2.41%
IEEE Transactions on Components, Packaging and Manufacturing Technology
147 citations, 2.27%
Microelectronics Reliability
141 citations, 2.18%
IEEE Transactions on Microwave Theory and Techniques
138 citations, 2.13%
Journal of Electronic Packaging, Transactions of the ASME
129 citations, 1.99%
Journal of Electronic Materials
88 citations, 1.36%
IEEE Transactions on Electromagnetic Compatibility
71 citations, 1.1%
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
69 citations, 1.07%
Soldering and Surface Mount Technology
61 citations, 0.94%
IEEE Transactions on Electronics Packaging Manufacturing
61 citations, 0.94%
Journal of Micromechanics and Microengineering
60 citations, 0.93%
Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
56 citations, 0.86%
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
51 citations, 0.79%
Journal of Lightwave Technology
39 citations, 0.6%
Journal of Materials Science: Materials in Electronics
36 citations, 0.56%
Proceedings of the IEEE
30 citations, 0.46%
MRS Proceedings
30 citations, 0.46%
Microelectronic Engineering
28 citations, 0.43%
Microwave and Optical Technology Letters
27 citations, 0.42%
IEEE Transactions on Components Packaging and Manufacturing Technology Part A
26 citations, 0.4%
Applied Physics Letters
25 citations, 0.39%
IEEE Journal of Selected Topics in Quantum Electronics
24 citations, 0.37%
Journal of Microelectromechanical Systems
24 citations, 0.37%
Journal of Applied Physics
23 citations, 0.36%
Sensors and Actuators, A: Physical
23 citations, 0.36%
Journal of Adhesion Science and Technology
22 citations, 0.34%
Microelectronics Journal
21 citations, 0.32%
Journal of Applied Polymer Science
20 citations, 0.31%
Materials Transactions
20 citations, 0.31%
IEEE Transactions on Device and Materials Reliability
19 citations, 0.29%
Applied Surface Science
19 citations, 0.29%
IEEE Journal of Solid-State Circuits
19 citations, 0.29%
Circuit World
19 citations, 0.29%
IEEE Transactions on Circuits and Systems I Fundamental Theory and Applications
19 citations, 0.29%
International Journal of Adhesion and Adhesives
17 citations, 0.26%
Applied Optics
16 citations, 0.25%
IEEE Microwave and Wireless Components Letters
15 citations, 0.23%
Journal of Alloys and Compounds
15 citations, 0.23%
IEEE Sensors Journal
15 citations, 0.23%
IEEE Photonics Technology Letters
14 citations, 0.22%
IEEE Transactions on Electron Devices
14 citations, 0.22%
IEEE Transactions on Instrumentation and Measurement
13 citations, 0.2%
Materials Science and Engineering B: Solid-State Materials for Advanced Technology
12 citations, 0.19%
International Journal of Heat and Mass Transfer
12 citations, 0.19%
Polymer
12 citations, 0.19%
IEEE Transactions on Circuits and Systems II Analog and Digital Signal Processing
12 citations, 0.19%
Journal of the Electrochemical Society
11 citations, 0.17%
Integration, the VLSI Journal
11 citations, 0.17%
Materials Chemistry and Physics
11 citations, 0.17%
Thin Solid Films
11 citations, 0.17%
Analytical Chemistry
11 citations, 0.17%
Microelectronics International
10 citations, 0.15%
Electronics Letters
10 citations, 0.15%
Journal of the American Ceramic Society
10 citations, 0.15%
Finite Elements in Analysis and Design
10 citations, 0.15%
IEEE Transactions on Semiconductor Manufacturing
9 citations, 0.14%
ACS applied materials & interfaces
9 citations, 0.14%
Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A/Chung-kuo Kung Ch'eng Hsuch K'an
9 citations, 0.14%
International Journal of Advanced Manufacturing Technology
9 citations, 0.14%
IEEE Access
9 citations, 0.14%
IEEE Design & Test of Computers
9 citations, 0.14%
IEICE Transactions on Electronics
8 citations, 0.12%
IEEE Transactions on Antennas and Propagation
8 citations, 0.12%
Engineering Failure Analysis
8 citations, 0.12%
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
8 citations, 0.12%
Optics Express
8 citations, 0.12%
Ceramics International
8 citations, 0.12%
Key Engineering Materials
8 citations, 0.12%
Applied Mechanics and Materials
8 citations, 0.12%
Materials Science Forum
7 citations, 0.11%
Journal of Physics: Conference Series
7 citations, 0.11%
International Journal of Numerical Modelling: Electronic Networks, Devices and Fields
7 citations, 0.11%
IEEE Transactions on Circuits and Systems I: Regular Papers
7 citations, 0.11%
Solid-State Electronics
7 citations, 0.11%
International Communications in Heat and Mass Transfer
7 citations, 0.11%
Journal of Electronic Testing: Theory and Applications (JETTA)
7 citations, 0.11%
Materials Characterization
7 citations, 0.11%
Microsystem Technologies
7 citations, 0.11%
Analog Integrated Circuits and Signal Processing
7 citations, 0.11%
Applied Thermal Engineering
7 citations, 0.11%
Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing
7 citations, 0.11%
Optical Engineering
7 citations, 0.11%
Embedded Processor-Based Self-Test
7 citations, 0.11%
Integrated Circuits and Systems
7 citations, 0.11%
Electronic Packaging and Interconnects Series
7 citations, 0.11%
Lecture Notes in Computer Science
6 citations, 0.09%
International Journal of Electronics
6 citations, 0.09%
Micromachines
6 citations, 0.09%
Journal of Materials Processing Technology
6 citations, 0.09%
Journal of Materials Research
6 citations, 0.09%
IEEE Transactions on Power Delivery
6 citations, 0.09%
Electronics (Switzerland)
6 citations, 0.09%
IEEE Transactions on Computers
6 citations, 0.09%
IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control
6 citations, 0.09%
Chemistry of Materials
6 citations, 0.09%
International Journal of Precision Engineering and Manufacturing
6 citations, 0.09%
Review of Scientific Instruments
6 citations, 0.09%
Surface and Coatings Technology
6 citations, 0.09%
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Citing publishers

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2500
Institute of Electrical and Electronics Engineers (IEEE)
2268 citations, 35.02%
Elsevier
660 citations, 10.19%
Springer Nature
338 citations, 5.22%
Wiley
167 citations, 2.58%
ASME International
140 citations, 2.16%
IOP Publishing
105 citations, 1.62%
Emerald
97 citations, 1.5%
Taylor & Francis
82 citations, 1.27%
AIP Publishing
71 citations, 1.1%
Optica Publishing Group
67 citations, 1.03%
Japan Society of Applied Physics
58 citations, 0.9%
American Chemical Society (ACS)
47 citations, 0.73%
MDPI
46 citations, 0.71%
Trans Tech Publications
34 citations, 0.52%
29 citations, 0.45%
Institution of Engineering and Technology (IET)
26 citations, 0.4%
Royal Society of Chemistry (RSC)
24 citations, 0.37%
SAGE
22 citations, 0.34%
Japan Institute of Metals
21 citations, 0.32%
SPIE-Intl Soc Optical Eng
18 citations, 0.28%
Cambridge University Press
15 citations, 0.23%
The Electrochemical Society
14 citations, 0.22%
World Scientific
13 citations, 0.2%
Association for Computing Machinery (ACM)
13 citations, 0.2%
11 citations, 0.17%
American Vacuum Society
11 citations, 0.17%
American Physical Society (APS)
8 citations, 0.12%
Hindawi Limited
8 citations, 0.12%
Electromagnetics Academy
6 citations, 0.09%
The Korean Society of Precision Engineering
6 citations, 0.09%
SAE International
6 citations, 0.09%
American Institute of Aeronautics and Astronautics (AIAA)
5 citations, 0.08%
Korean Institute of Metals and Materials
5 citations, 0.08%
The Electrochemical Society of Japan
5 citations, 0.08%
Institute of Electrical Engineers of Japan (IEE Japan)
5 citations, 0.08%
EDP Sciences
4 citations, 0.06%
Korean Society of Mechanical Engineers
4 citations, 0.06%
Laser Institute of America
4 citations, 0.06%
Annual Reviews
4 citations, 0.06%
Pleiades Publishing
3 citations, 0.05%
American Association for the Advancement of Science (AAAS)
3 citations, 0.05%
The Korean Institute of Electrical and Electronic Material Engineers
3 citations, 0.05%
Japan Institute of Electronics Packaging
3 citations, 0.05%
Japan Society of Mechanical Engineers
2 citations, 0.03%
Nonferrous Metals Society of China
2 citations, 0.03%
Ain Shams University
2 citations, 0.03%
The Russian Academy of Sciences
2 citations, 0.03%
Institute of Electronics, Information and Communications Engineers (IEICE)
2 citations, 0.03%
Walter de Gruyter
1 citation, 0.02%
Frontiers Media S.A.
1 citation, 0.02%
Morgan & Claypool Publishers
1 citation, 0.02%
1 citation, 0.02%
1 citation, 0.02%
Arizona State University
1 citation, 0.02%
Federal Informational-Analytical Center of the Defense Industry
1 citation, 0.02%
Society of Chemical Engineers, Japan
1 citation, 0.02%
Shanghai Jiaotong University Press
1 citation, 0.02%
Korean Institute of Electrical Engineers
1 citation, 0.02%
Korea Soc of Automotive Engineers, Inc
1 citation, 0.02%
American Association of Physics Teachers (AAPT)
1 citation, 0.02%
International Microelectronics And Packaging Society
1 citation, 0.02%
Polymer Society of Korea
1 citation, 0.02%
midwest symposium on circuits and systems
1 citation, 0.02%
Argentinean Association of Computational Mechanics
1 citation, 0.02%
1 citation, 0.02%
Science in China Press
1 citation, 0.02%
China Science Publishing & Media
1 citation, 0.02%
Oriental Scientific Publishing Company
1 citation, 0.02%
Science Alert
1 citation, 0.02%
National Academy of Sciences of Ukraine (Co. LTD Ukrinformnauka) (Publications)
1 citation, 0.02%
American Society of Civil Engineers (ASCE)
1 citation, 0.02%
OAE Publishing Inc.
1 citation, 0.02%
International Academy Publishing (IAP)
1 citation, 0.02%
IGI Global
1 citation, 0.02%
IntechOpen
1 citation, 0.02%
Japan Welding Society
1 citation, 0.02%
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Publishing organizations

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Cornell University
12 publications, 2.89%
Georgia Institute of technology
12 publications, 2.89%
University of Arizona
9 publications, 2.17%
Nippon Electric Company
9 publications, 2.17%
City University of Hong Kong
7 publications, 1.69%
Royal Philips
6 publications, 1.45%
Massachusetts Institute of Technology
5 publications, 1.2%
Stanford University
5 publications, 1.2%
North Carolina State University
5 publications, 1.2%
University of Colorado Boulder
5 publications, 1.2%
Brunel University London
4 publications, 0.96%
Samsung
4 publications, 0.96%
Arizona State University
4 publications, 0.96%
Shanghai Jiao Tong University
3 publications, 0.72%
National Cheng Kung University
3 publications, 0.72%
Interuniversity Microelectronics Centre
3 publications, 0.72%
Washington University in St. Louis
3 publications, 0.72%
University of California, Santa Cruz
3 publications, 0.72%
University of South Florida
3 publications, 0.72%
University of Illinois Urbana-Champaign
3 publications, 0.72%
Simon Fraser University
3 publications, 0.72%
Kagoshima University
3 publications, 0.72%
Carolina University
3 publications, 0.72%
Mayo Clinic
3 publications, 0.72%
Ghent University
2 publications, 0.48%
Linköping University
2 publications, 0.48%
Sun Yat-sen University
2 publications, 0.48%
Polytechnic University of Milan
2 publications, 0.48%
Nanyang Technological University
2 publications, 0.48%
National University of Singapore
2 publications, 0.48%
Pennsylvania State University
2 publications, 0.48%
Auburn University
2 publications, 0.48%
University of California, San Diego
2 publications, 0.48%
Texas Instruments
2 publications, 0.48%
Sony Group Corporation
2 publications, 0.48%
University of Maryland, College Park
2 publications, 0.48%
Mitsubishi Electric Corporation
2 publications, 0.48%
Lehigh University
2 publications, 0.48%
University of Reading
2 publications, 0.48%
Sandia National Laboratories
2 publications, 0.48%
Texas A&M University
2 publications, 0.48%
Polytechnique Montréal
2 publications, 0.48%
Indian Institute of Technology Bombay
1 publication, 0.24%
Tsinghua University
1 publication, 0.24%
University of Genoa
1 publication, 0.24%
KTH Royal Institute of Technology
1 publication, 0.24%
Stockholm University
1 publication, 0.24%
University of Helsinki
1 publication, 0.24%
ETH Zurich
1 publication, 0.24%
National Sun Yat-sen University
1 publication, 0.24%
European Organization for Nuclear Research
1 publication, 0.24%
Polytechnic University of Turin
1 publication, 0.24%
Florida State University
1 publication, 0.24%
University of Southern California
1 publication, 0.24%
National Tsing Hua University
1 publication, 0.24%
National Yang Ming Chiao Tung University
1 publication, 0.24%
National Institute for Nuclear Physics
1 publication, 0.24%
California Institute of Technology
1 publication, 0.24%
University of Adelaide
1 publication, 0.24%
Korea Advanced Institute of Science and Technology
1 publication, 0.24%
Electronics and Telecommunications Research Institute
1 publication, 0.24%
Northwestern University
1 publication, 0.24%
University of Hong Kong
1 publication, 0.24%
Colorado State University
1 publication, 0.24%
Rutgers, The State University of New Jersey
1 publication, 0.24%
Oregon State University
1 publication, 0.24%
Lawrence Livermore National Laboratory
1 publication, 0.24%
Case Western Reserve University
1 publication, 0.24%
Technical University of Berlin
1 publication, 0.24%
Tufts University
1 publication, 0.24%
University of California, Davis
1 publication, 0.24%
University of Texas at Austin
1 publication, 0.24%
Rensselaer Polytechnic Institute
1 publication, 0.24%
Leibniz University Hannover
1 publication, 0.24%
Japan Advanced Institute of Science and Technology
1 publication, 0.24%
Wayne State University
1 publication, 0.24%
University of Michigan
1 publication, 0.24%
Marquette University
1 publication, 0.24%
University of British Columbia
1 publication, 0.24%
Jet Propulsion Laboratory
1 publication, 0.24%
Stevens Institute of Technology
1 publication, 0.24%
Ulm University
1 publication, 0.24%
Worcester Polytechnic Institute
1 publication, 0.24%
Purdue University
1 publication, 0.24%
Darmstadt University of Applied Sciences
1 publication, 0.24%
University of Vienna
1 publication, 0.24%
Uniformed Services University of the Health Sciences
1 publication, 0.24%
Fujitsu Limited
1 publication, 0.24%
Toshiba Corporation
1 publication, 0.24%
University of Sheffield
1 publication, 0.24%
Polytechnic University of Catalonia
1 publication, 0.24%
Carleton University
1 publication, 0.24%
Louisiana State University
1 publication, 0.24%
University of North Carolina at Charlotte
1 publication, 0.24%
University of Alabama at Birmingham
1 publication, 0.24%
Texas Christian University
1 publication, 0.24%
Binghamton University
1 publication, 0.24%
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Publishing countries

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USA, 269, 64.82%
USA
269 publications, 64.82%
Japan, 43, 10.36%
Japan
43 publications, 10.36%
China, 25, 6.02%
China
25 publications, 6.02%
Germany, 21, 5.06%
Germany
21 publications, 5.06%
United Kingdom, 10, 2.41%
United Kingdom
10 publications, 2.41%
Canada, 9, 2.17%
Canada
9 publications, 2.17%
France, 7, 1.69%
France
7 publications, 1.69%
Netherlands, 7, 1.69%
Netherlands
7 publications, 1.69%
Republic of Korea, 7, 1.69%
Republic of Korea
7 publications, 1.69%
Singapore, 6, 1.45%
Singapore
6 publications, 1.45%
Sweden, 5, 1.2%
Sweden
5 publications, 1.2%
Belgium, 4, 0.96%
Belgium
4 publications, 0.96%
Italy, 4, 0.96%
Italy
4 publications, 0.96%
Portugal, 2, 0.48%
Portugal
2 publications, 0.48%
Finland, 2, 0.48%
Finland
2 publications, 0.48%
Switzerland, 2, 0.48%
Switzerland
2 publications, 0.48%
Belarus, 1, 0.24%
Belarus
1 publication, 0.24%
Australia, 1, 0.24%
Australia
1 publication, 0.24%
Austria, 1, 0.24%
Austria
1 publication, 0.24%
Denmark, 1, 0.24%
Denmark
1 publication, 0.24%
India, 1, 0.24%
India
1 publication, 0.24%
Ireland, 1, 0.24%
Ireland
1 publication, 0.24%
Spain, 1, 0.24%
Spain
1 publication, 0.24%
Lebanon, 1, 0.24%
Lebanon
1 publication, 0.24%
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